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חברה חסויה
Location: Haifa and Tel Aviv-Yafo
Job Type: Full Time
In this role, you can lead our teams to deliver fully functional "first silicon" IP designs, from defining initial constraints through high-quality tape-out. You will have the rare and rewarding privilege of crafting upcoming products that will delight and inspire millions of customers every single day.
Responsibilities
Own the entire IP-level netlist generation and timing convergence journey, from synthesis and UPF power intent to final sign-off.
Architect and manage complex timing constraints (SDC) for both standard and custom designs, ensuring sign-off quality from day one.
Drive Full Chip and block-level timing/noise convergence, including hierarchical timing flows and power optimizations.
Collaborate closely with RTL designers to understand clock architecture, DFT teams on mode constraints, and PNR teams to achieve flawless physical convergence.
Develop and support automated block and chip-level sign-off flows, working with CAD teams to shape cutting-edge methodologies that eliminate pessimism and accelerate convergence.
Perform deep-dive signal integrity (SI) and noise analysis, drive custom IP integration, and generate block-level budgets to ensure correlation with the Full Chip.
Requirements:
B.Sc / M.Sc in Electrical Engineering.
5+ years of experience in the field, with at least 2-4 years specifically focused on ASIC timing constraints and Static Timing Analysis (STA).
Expertise in commercial STA tools (e.g., PrimeTime) and flow generation.
Deep understanding of the ASIC design flow, including hierarchical top-down design, timing closure, and backend sign-off.
Solid understanding of AC timing (from specs to implementation) and DFT modes.
Strong communication skills and a team-player mindset, with the ability to learn new flows and methods quickly.
This position is open to all candidates.
 
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
5+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting)
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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14/05/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Staff Physical STA Expert to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the sign-off methodology for chips that power the world's most advanced AI clusters.

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter
Requirements:
B.Sc. in Electrical Engineering or Computer Engineering
8+ years of deep, hands-on experience in Static Timing Analysis (STA) at leading semiconductor companies, specifically working on advanced process technologies
Deep expertise in multi-scenario STA, timing/SDC constraint development and verification. You have a "full-chip" perspective, managing both complex macro-level designs and top-level integration
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off
Solid knowledge of physical design flows (P&R, Physical Verification) and how they intersect with timing closure
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8651951
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
This is a highly visible role where you will own the physical design cycle at the partition, IP, and Chip levels-enabling us to produce fully functional "first silicon" designs. Do you love working on challenges that no one has solved yet? If you are ready to join the world's leading engineers and work with state-of-the-art design flows, come join our group.
Responsibilities
You will be responsible for all phases of pre-silicon development, from initial definition to high-quality tape-out (Netlist to GDSII).
Lead block-level Place & Route (PnR), complex floor-planning, partitioning, and the creation of power domains and grid specifications.
Develop and validate high-performance, low-power clock network guidelines and distribution.
Drive static timing closure (STA), Physical Verification (DRC/LVS), and Electrical/Power analysis (EM, IR-Drop, Xtalk, and Noise).
Participate in establishing CAD and physical design methodologies for "correct-by-construction" designs and assist in flow development for chip integration.
Generate and implement ECOs to fix timing, noise, and EM/IR violations while meeting strict area and power constraints.
Work closely with logic design teams on SoC architecture and HDL (Verilog) to implement timing fixes and design optimizations.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering or Computer Engineering.
3-7 years of Physical Design experience on high-performance, low-power, large-scale SoCs.
Power user of industry-standard PnR and Synthesis tools (Synopsys or Cadence).
Deep understanding of physically aware synthesis, extraction, and STA methodologies.
Strong programming skills in Tcl, Python, Perl, or Shell scripting.
Experience with successful tape-outs in advanced sub-micron process technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration
Requirements:
B.Sc. or M.Sc. in Electrical Engineering
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus)
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8652208
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14/05/2026
Location: Haifa
Job Type: Full Time
we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
5+ years of hands-on professional experience with back-end industrial tool suites (e.g., Synopsys Fusion Compiler or Cadence Genus/Innovus)
Expert-level proficiency in Tcl and Python for high-level flow automation, data parsing, and tool customization
Deep technical understanding of Physical Design concepts, including clock tree synthesis (CTS), routing congestion, timing closure, and signal integrity
Proven experience executing sign-off flows for complex, high-performance designs
Strong communication skills and a collaborative approach to solving complex engineering bottlenecks
This position is open to all candidates.
 
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14/05/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
3+ years of hands-on experience in DFT roles at semiconductor companies
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent)
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA)
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8652211
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience in logic design and debug with Design Verification (DV).
Experience with microarchitecture and specifications.
Preferred qualifications:
Experience with logic synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (Lint, CDC, VCLP etc.).
Experience in a scripting language like Python or Perl.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of one of these areas, PCIe, UCIe, DDR, AXI, ARM processors family.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8643611
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
8 years of experience in technical leadership.
Experience in one of the following areas: arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Experience developing RTL for ASIC subsystems.
Preferred qualifications:
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in TCP, IP, Ethernet, PCIE and DRAM including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8642044
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will play a crucial role in Design for Testing (DFT) Architecture and DFT design, and support devices of extreme complexity to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality matrix throughout the project life-cycle, and providing sign-off DFT to tapeout.
Responsibilities
Lead and execute activities in the design, implementation, and verification of DFT solutions for large-scale ASICs.
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage the DFT team's workload and deliverables, provide technical leadership and guidance to the team.
Lead DFT execution of a silicon project (e.g., planning, execution, tracking, quality, and signoff).
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Automatic Test Pattern Generation (ATPG) methods.
Experience with multiple projects in DFT design and verification, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and tools, ASIC DFT synthesis, simulation, and verification flow.
Experience in leading DFT activities throughout an ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in JTAG and iJTAG protocols and architectures.
Experience in post-silicon test or product engineering.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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