דרושים » חשמל ואלקטרוניקה » Analog IP Layout Lead - Advanced Technologies Group

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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will need expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
15 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.

Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544135
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544213
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Evaluate, analyze, implement, and integrate SRAMs, other memories (such as multiport register files), and custom circuits. Drive proper IP integration and margins with the physical design team.
Partner with foundries and IP providers, as well as internal technology, physical design, and architecture teams, to optimize products for PPA, schedule, and reliability in advanced CMOS nodes.
Drive and support test chip design, execution, and validation of critical circuit IPs.
Design and build custom circuits at the transistor and gate levels to support physical design and power-performance-area optimization.
Drive development of a leading edge technology platform for custom, high performance ASICs and SoCs, from design through manufacturing, packaging, and test.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience in Circuit Design, Physical Design (RTL-to-GDS), or Technology Development, including advanced nodes (e.g., 7nm or below).
Experience with custom circuit/IP and physical design, including Place and Route (PNR) and Static Timing Analysis (STA).
Experience in scripting and automation using Tcl and Python (or Perl).
Experience with SPICE and transistor level design in advanced nodes.
Experience in CMOS device physics, finfet/GAA/nanosheet architectures, and layout parasitics.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience working with major foundry technology files (PDKs), standard cell libraries, metal stacks, and other features.
Understanding of characterization and verification of standard cells/SRAMs/register files, including knowledge of power, noise, variation, and IR analysis.
Understanding of collaterals for front end and back end design teams.
Excellent track record of delivering optimized custom circuits/memories/IPs and PNR blocks for product tapeout.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8545271
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of the Data Center silicon. Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications. You will be a key contributor in the growth team, developing advanced custom IP and solutions. We seek experienced applicants with expertise in one or more of the following areas: wireline communications, analog circuit design, DSP design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed IO industry standards. You will collaborate with a set of cross-functional organizations. You will serve many of our companys advanced data center products.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our companyservices around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architecture and design of high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterizing performance, and testing for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure integration into System-on-Chips (SoCs).
Adhere to standards like Institute of Electrical and Electronics Engineers(IEEE) or Optical Internetworking Forum (OIF) for protocols and optimizing power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in analog mixed signal and high-speed Input/Output development.
Experience defining and taking to High Volume Manufacturing(HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science.
Experience in mixed-signal and high-speed Input/Output (IO) solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544208
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Develop and optimize the overall layout of the chip, including partitioning, macro and IP placement, and pin placement.
Design and implement efficient power delivery networks power grids to ensure stable power to all parts of the chip.
Develop and validate high-performance, low-power clock networks (e.g., Clock Tree Synthesis (CTS)) to ensure proper synchronization across the entire chip.
Develop, enhance, and maintain custom scripts (e.g., Tcl, Perl, Python) for automation and improved efficiency.
Conduct extensive Design Rule Checks (DRC) to ensure the layout adheres to manufacturing rules, performing Layout Versus Schematic (LVS) checks to verify that the physical layout matches the logical design.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with physical design flows and methodologies (e.g., RTL2GDS).
Experience with semiconductor process technologies (e.g., deep submicron, advanced nodes like 5nm and below), and device physics (e.g., MOSFET/FINFET).
Experience with Design For Testability (DFT) and low-power design methodologies.
Experience with UPF (Unified Power Format) and its application in physical design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture, or a related field.
Experience with scripting languages such as Perl, Python, or Tcl.
Excellent analysis skills, with the ability to understand, debug, and resolve issues in the design flow.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544084
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you will conduct Place and Route experiments and sensitivity analyses to influence standard cell library architecture, metal stack definitions, and design rules. You will collaborate with Foundry, IP, and Architecture teams to identify Power, Performance, and Area (PPA) bottlenecks and drive System Technology Co-Optimization (STCO) initiatives.
Your work will involve performing high-fidelity physical implementation sweeps, analyzing the impact of scaling boosters, and developing automated methodologies to quantify PPA gains. By navigating the trade-offs between process complexity and design performance, you will ensure our companys hardware achieves efficiency and power density.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute high-fidelity Place and Route experiments to evaluate the PPA impact of advanced process features, library architectures, and design rule variations on datacenter-class IP.
Drive Design Technology Co-Optimization by collaborating with foundries and internal technology teams to define optimal metal stacks, track heights, and scaling boosters (e.g., backside power delivery, buried power rails).
Quantify process entitlement through systematic benchmarking of logic and memory macros, identifying bottlenecks in power density and timing closure for next-generation nodes.
Develop automated physical design methodologies and flows to accelerate technology pathfinding and enable rapid what-if analysis of emerging transistor architectures.
Influence System Technology Co-Optimization by partnering with Hardware Architects and Circuit Designers to translate process-level innovations into system-level performance gains.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
2 years of experience in Physical Design (RTL-to-GDS) or Technology Development, focusing on advanced nodes (e.g., 7nm, 5nm, or below).
Experience with industry-standard Place and Route (P&R) tools and Static Timing Analysis (STA) tools.
Experience in CMOS device physics, FinFET/nanosheet architectures, and the impact of layout parasitics on PPA.
Experience in scripting and automation using Tcl and Python (or Perl) to manage design sweeps and data extraction.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in Design Technology Co-Optimization (DTCO), including standard cell library characterization, metal stack optimization, and evaluation of scaling boosters (e.g., backside power delivery).
Experience working with major foundry technology files (PDKs) and interpreting Design Rule Manuals (DRM) to guide physical implementation.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544218
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design & Power Methodology Team Manager within the Server Chip Design team, you will be responsible of managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL Design cycle IP and SoC.
8 years of experience in team management.
Experience with design methodologies, structural checks, and power estimation/optimization.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of IP and SOC architecture.
Knowledge of physical design techniques: SDC, Synthesis, EMIR, etc.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8545441
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design Team Manager within the Server Chip Design team, you will oversee the IP and SoC VLSI design cycle from architecture to production. In this role, you will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads.
You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and SoC.
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
Knowledge of one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544202
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544165
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, RTL coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis dft etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power including low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544190
סגור
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