דרושים » חומרה » (PhD) Optical Laser Engineer for a quantum photonic device

The Senior Optical Systems Engineer will have responsibility for working closely with the test cell development team to understand test hardware software and algorithms. The candidate will develop optical test instrumentation architecture for emerging markets within semiconductor test. Instrumentation may include laser sources, polarizers, optical fibers and connectors, optical sensors, photo-diodes, along with motion systems, cameras, and image-analysis software. As a member of the Silicon Photonics Engineering team, you will be a key player delivering test solutions and deployment at customers sites. You will be working closely with the customer engineers, Teradyne engineering and applications engineering to ensure on-time delivery.



Derive system requirements by interacting with customers to define requirements for new optical test products
Develop test methods for lab and production verification
Develop experimental setups with optical instrumentation
Work within cross-discipline teams to develop innovative products

We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain.

Key job responsibilities
As a SIP engineer, you will be involved in:
Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
Hands-on lab work involving oscilloscopes, spectrum analyzers, and other RF/mixed-signal measurement equipment, for advanced electrical characterization.

You will undergo a comprehensive training program, providing you with the essential knowledge and skills required to succeed in this field. The work is multidisciplinary, bridging physical design, electromagnetic theory, and practical engineering challenges.

We are seeking a skilled Failure Analysis (FA) Engineer with expertise in X-ray inspection techniques to join our AV Platform team. The ideal candidate will specialize in using advanced X-ray imaging and other analysis methods to investigate product failures, identify root causes, and provide actionable insights to improve product quality and reliability
What will your job look like?
Perform detailed failure analysis using X-ray imaging systems and related diagnostic tools to inspect electronic components, assemblies, and materials.
Interpret and analyze X-ray images to detect structural anomalies, defects, voids, cracks, delamination, and other failure mechanisms.
Develop and optimize X-ray inspection procedures and protocols for failure analysis and quality control.
Prepare test specimens: cutting, mounting, grinding, polishing and chemical etching
Collaborate with product engineering, quality assurance, and manufacturing teams to support product development, troubleshooting, and continuous improvement efforts.
Prepare detailed technical reports documenting findings, root cause analyses, and recommended corrective actions.
Support reliability testing and failure mode analysis for new and existing products.

We are looking for highly motivated Electrical Engineering graduates, or engineers with up to 3 years' experience in related fields, to join our growing team specializing in Signal Integrity and IC Package Design. The position offers a unique entry point into a diverse and multidisciplinary domain

Key job responsibilities
As a SIP engineer, you will be involved in:
Work on advanced high-speed interfaces such as PCIe, DDR and Ethernet.
End-to-end solution of high-speed interfaces; from floor-planning at the DIE level, through Package and PCB routing, addressing both robust SI/PI considerations as well as optimizing layout routing.
Signal and power integrity modeling and simulation of high-speed interconnects using advanced SI/PI simulation tools.
Hands-on lab work involving oscilloscopes, spectrum analyzers, and other RF/mixed-signal measurement equipment, for advanced electrical characterization.