לוח משרות דרושים הייטק חומרה בחיפה, לחיפוש זה נמצאו 35 משרות

we are looking for a Software Integration Team Lead (Hands-On Technical Lead) to join our AV group and drive SW deployment and integration for our companys next-generation autonomous vehicle platforms.
This role is ideal for a strong hands-on engineer who combines deep technical expertise with natural leadership abilities, taking ownership of complex integration efforts while actively contributing to system bring-up, debugging, and validation.
The position includes a balanced mix of hands-on integration work and team leadership, driving both execution and coordination across multidisciplinary teams.
What will your job look like?
Lead a team of Software-Hardware Integrators, responsible for deployment & integration of dedicated SW & HW toward AV validation campaigns.
Lead software deployment and integration activities for our companys next-generation AV platforms across complex HW/SW environments.
Provide day-to-day technical leadership, task prioritization, and guidance to integration engineers, while remaining closely involved in execution.
Own the integration and stability of complex AV platforms composed of multiple SoCs, networking infrastructure, sensors, and embedded software stacks.
Actively perform hands-on integration, bring-up, and debugging activities across embedded Linux systems and HW/SW interfaces.
Lead investigte and resolve complex system-level issues spanning embedded software, Linux infrastructure, networking, logging platforms, and hardware interfaces.
Serve as a technical focal point for integration challenges during validation and bring-up phases.
Coordinate integration activities across software, hardware, validation, and infrastructure teams to drive system readiness.

We are seeking a System HW Engineer to define, shape, and integrate solutions for the next generation of our cloud platforms.

As a System Engineer on the hardware team, you will define systems for our Labs' Network Interface Card (NIC) hardware, support the development and validation of our NIC, and help bring the NIC to mass production.
You'll lead the implementation of new hardware interface technologies and scale them to large-scale deployment, continuously delivering a world-class customer experience. This fast-paced, intellectually challenging position requires collaboration with technical experts, senior leaders, and multiple technology teams.


Key job responsibilities
Define and design systems to support K2 cards development and manufacturing.
Define and provide feedback to the design of the K2 Smart Network Interface Card.
Work with design partners and manufacturing sites, to enable healthy mass production of the K2 card.
Analyze and debug design/manufacturing/integration issues.
Continuously assess process capabilities and innovate to simplify processes, reduce costs, and shorten the time cycle of K2 cards development and manufacturing.
Collaborate with members of cross-functional teams, to gain knowledge and improve product design, processes, and quality.
Work with customers, to optimize the entire value stream and put together joint processes that will lead to improved time cycle and lower costs.
Willing to travel abroad one or two times a year, for a week at a time.

We are looking for a SoC / IP Architect to shape the next revolution in electronics!
Responsibilities
Define and design architecture: Create the overall SoC/IP architecture based on product and customer requirements and define detailed technical specifications.
Collaborate with cross-functional teams: Work with a variety of teams, including logic design, verification, firmware architecture and development teams, and physical design, to ensure successful execution.
Lead technical discussions and architectural reviews, guiding design and verification teams to deliver scalable, high-quality implementations.
System-level integration: Ensure seamless hardware-software co-design by working on aspects like control paths, interrupt schemes, and debug infrastructure.
Drive architectural decisions that optimize scalability, and future readiness for next-generation applications.

Develop and maintain internal EDA tools and frameworks for RTL assembly and connectivity checking.
Implement efficient algorithms for hierarchical RTL construction, module binding, and interface consistency across complex SoCs.
Build intelligent connectivity, visualization, and debug utilities.
Collaborate with front-end design, DFT, and integration teams to align methodologies and define tool requirements.
Drive automation and performance improvements, including runtime optimization and scalability across large designs.
Support adoption, documentation, and user training for internal design teams.

we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution

Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity

Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration

Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration

we're seeking a highly skilled Physical Design CAD Engineer specializing in CAD Automation and Signoff to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the backend execution environment and methodologies for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the physical implementation environment. Your primary mission is to develop, optimize, and support automated flows from RTL to manufacturable GDSII tape-out, ensuring a methodical and efficient work environment for the entire PD team.


Key Responsibilities


Develop and maintain automated flows for Synthesis, Place & Route (P&R), and Floor-planning to ensure seamless design transitions
Implement and manage robust environments for Static Timing Analysis (STA), Power Analysis, and Physical Verification (DRC/LVS/ERC)
Write and maintain custom plug-ins and scripts (Tcl/Python) to extend vendor tool capabilities, tailoring them to specific process node constraints
Build automated "dashboards" and feedback loops to track and improve Power, Performance, and Area (PPA) metrics across design iterations
Own the design database structure and version control to ensure team alignment and data integrity
Collaborate directly with EDA vendors (Synopsys, Cadence, Siemens/Mentor) to troubleshoot flow issues and analyze tool results
Provide technical support to the broader PD team, helping them optimize individual blocks for power, performance, and timing

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

we're seeking a visionary Staff Physical STA Expert to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the sign-off methodology for chips that power the world's most advanced AI clusters.

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter