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לפני 7 שעות
חברה חסויה
Job Type: Full Time
we are looking for best-in-class physical design engineers to join our outstanding networking silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.
what you'll be doing:
physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
be exposed and work on a variety of challenging designs (including high cell count and hs blocks). resolving complex timing and congestion problems.
daily work involves all aspects of physical design chip development (rtl2gds) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
taking part inflows development.
Requirements:
what we need to see:
b.sc./ m.sc. in electrical engineering/computer engineering or equivalent experience.
3+ years of relevant experience
knowledge in physical design flows and methodologies (pnr, sta, physical verification).
deep understanding of all aspects of physical construction and integration.
knowledge in physical design verification methodology lvs/drc.
familiarity with physical design eda tools (such as synopsys, cadence, etc.).
great teammate.
we have some of the most forward-thinking people in the world working for us. are you a creative and autonomous engineer who loves a challenge? are you ready to become the engineer you always wanted to be? come and be part of the best physical design team in the industry!
This position is open to all candidates.
 
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29/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent experience.
2+ years of relevant experience.
Proven experience in RTL2GDS flows and methodologies.
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate.
This position is open to all candidates.
 
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28/09/2026
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class STA (Static Timing analysis) Physical Design Engineers to join our outstanding Networking DFT team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you will be doing:
DFT STA execution, from rtl driven constraints and definitions through DFT constraints quality assurance to STA sign-off.
Be part of a unique team of experts who have deep understanding in all aspects of pre and post silicon.
Be exposed and work on a variety of challenging designs, unique DFT solutions that require deep silicon implementation understanding.
Daily work involves all aspects of static timing analysis - constraints, environment, models generation and timing ECO generation for block level and full chip level.
Taking part in flows development.
Requirements:
What we need to see:
B.SC. in Electrical Engineering/Computer Engineering.
2-3 years of experience as STA engineer.
Ability to quickly adapt to new technology and go deep into new areas
Strong communication skills
Great teammate.
Drive new solutions based on any issues that arise

Ways to Stand Out From the Crowd:
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Knowledge in DFT flows such as ATPG, Mbist, Ijtag.
Prior experience in DFT timing closures.
Knowledge in CDC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
This position is open to all candidates.
 
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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30/09/2026
Job Type: Full Time
We are looking for best-in-class Chip Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! Come and take a significant part in designing our groundbreaking and innovative chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.

What you will be doing:

Join the Tel Aviv or Beer-Sheva group, working on RiscV processors platform.

Verification for chip blocks according to specifications under challenging constraints and with high orientation to power, area and performance.

Daily work might involve any or all aspects of chip development including verification, integration, debug

Work closely with firmware and other groups around the globe.
Requirements:
What we need to see:

B.SC./M.SC. or equivalent experience in Electrical Engineering/Communication Engineering/Computer Engineering.

5+ years of proven experience in RTL Frontend ASIC Verification (Chip Design).

High Level of English.

Ways to stand out from the crowd:

Extensive experience in RTL Frontend ASIC Verification (Chip Design).

Strong experience and knowledge in Specman.

Vast background and knowledge in system level aspects.
This position is open to all candidates.
 
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24/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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28/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.
Requirements:
What we need to see:

An Electronics Engineer certificate or a B.Sc. in Electrical Engineering.

You should have 5 years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodologies, including DRC, LVS, ANT, ERC, and DFM for advanced process nodes, is required.

Knowledge in scripts' language: TCL, Unix and Shell.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre).

Self-motivation, attention to detail and good interpersonal skills.


Ways to stand out from the crowd:

Experience in methodology definition / flow owner of Full-chip / Place and Route.

Great teammate.

Ownership, self-learning skills and ability to work autonomously.
This position is open to all candidates.
 
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לפני 7 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
we are looking for a best-in-class chip design Verification engineer to join our outstanding networking silicon engineering team, developing the industry's best high-speed communication devices and delivering the highest throughput and lowest latency! join us to play a key role in verifying our groundbreaking, innovative chips, and work in a meaningful, growing, highly professional environment where you can make a huge impact at a technology-focused company.
what you'll be doing:
work on a design and verification team developing the Front-End design for the switch silicon.
develop verification components and reference models, and verify and simulate chip blocks to specifications under challenging constraints, with a strong focus on power, area, and performance.
work closely with multiple teams within organizations such as architecture, micro- architecture and fw.
Requirements:
what we need to see:
electrical engineering b.sc., computer engineering, or another relevant engineering discipline, with high scores, or equivalent experience.
completion of programming or logic design courses with high scores.
4+ years of experience in asic or sw verification.
software/ firmware development with orientation toward rtl is also relevant.
a team player with good communication and interpersonal skills.
we have some of the most forward-thinking and hardworking people in the world working for us. are you creative and autonomous? do you love the challenge of crafting the highest performance & lowest power silicon possible? if so, we want to hear from you. come, join our switch silicon design team, and help us build the next chip in this exciting and quickly growing field.
This position is open to all candidates.
 
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
Basic Qualifications
B.Sc. in Electrical Engineering or Computer Engineering.
6+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting).
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels.
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off.
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure.


Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia).
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration.
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 5 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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28/09/2026
חברה חסויה
Location: Be'er Sheva
Job Type: Full Time
We are looking for a Senior Chip Design Engineer to join our Network Adapter Silicon group. As a Senior Design Engineer in our Networking Silicon team, you will join a group of passionate engineers to design and implement the next generation state-of-the-art Networking Silicon chips. In this position, you will make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What you'll be doing:

Work in a combined design and verification team which develops core units within the Networking silicon.

Own micro-architecture definition and RTL implementation of chip blocks/entities according to specifications, performance, timing, area and power requirements.

Drive your design through the full implementation flow - synthesis, timing closure, lint/CDC and physical design constraints - together with the backend teams.

Work closely with multiple teams within organizations such as Architecture, Micro-Architecture, Verification, FW and Post-Silicon validation.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering or Computer Engineering, or equivalent experience.

5+ years of proven experience in RTL design.

Strong knowledge of HDL (Verilog/SystemVerilog/VHDL).

Solid understanding of digital design fundamentals - pipelining, clock domain crossing, arbitration and low-power techniques.

Familiarity with synthesis and static timing analysis is an advantage.

A great teammate with good communication and interpersonal skills.
This position is open to all candidates.
 
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