דרושים » תוכנה » Physical Design Backend Engineer

We are looking for best-in-class STA (Static Timing analysis) Physical Design Engineers to join our outstanding Networking DFT team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you will be doing:
DFT STA execution, from rtl driven constraints and definitions through DFT constraints quality assurance to STA sign-off.
Be part of a unique team of experts who have deep understanding in all aspects of pre and post silicon.
Be exposed and work on a variety of challenging designs, unique DFT solutions that require deep silicon implementation understanding.
Daily work involves all aspects of static timing analysis - constraints, environment, models generation and timing ECO generation for block level and full chip level.
Taking part in flows development.

As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform advanced AI Static Timing Analysis (STA) for complex chiplet and full chip level.

AI use for timing optimization and data analysis in STA and PnR.

Running and build STA tools for anlyaze and debug timing.

Use traditional STA tools like Prime Time, review and debug timing paths, understand constraints, sdc generation, timing ecos generation.

Identify convergence risks and work closely with physical design, RTL and DFT teams, ensuring convergence throughout various project stages.

Responsible for a full timing closer and quality approval from pre-layout STA model through signoff.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.

As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.

As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.

We are now looking for a Senior Chip Design Engineer to join our Switch Silicon team. As a Chip Design Engineer in our Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state-of-the-art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What You'll Be Doing:

Work in a design/verification team which develops core units within the Switch silicon.

Micro-architecture of rtl verification environments planning for units and modules.

Design RTL of units/blocks according to Arch. specifications under challenging constraints with high orientation to power, area, and performance.

RTL synthesis, timing, supporting verification, and silicon post TO activities.

Work closely with multiple teams within organizations such as Architecture, u-arch, Full chip Micro-Architecture, BE, and FW.

We are now looking for a Senior Chip Design Verification Engineer to join our Switch Silicon team. As a Chip Design Engineer in our Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state-of-the-art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What You'll Be Doing:

Work in a design/verification team which develops core units within the Switch silicon.

Micro-architecture of dynamic verification environments planning for units and modules.

Design dynamic verification environments of units/blocks according to Arch. specifications under challenging constraints with high orientation to power, area, and performance.

Work closely with multiple teams within organizations such as Architecture, u-arch, Full chip Micro-Architecture, BE, and FW.

We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.