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לפני 1 שעות
חברה חסויה
Location: Yokne`am and Tel Aviv-Yafo
Job Type: Full Time
We are looking for best-in-class STA (Static Timing analysis) Physical Design Engineers to join our outstanding Networking DFT team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you will be doing:
DFT STA execution, from rtl driven constraints and definitions through DFT constraints quality assurance to STA sign-off.
Be part of a unique team of experts who have deep understanding in all aspects of pre and post silicon.
Be exposed and work on a variety of challenging designs, unique DFT solutions that require deep silicon implementation understanding.
Daily work involves all aspects of static timing analysis - constraints, environment, models generation and timing ECO generation for block level and full chip level.
Taking part in flows development.
Requirements:
What we need to see:
B.SC. in Electrical Engineering/Computer Engineering.
2-3 years of experience as STA engineer.
Ability to quickly adapt to new technology and go deep into new areas
Strong communication skills
Great teammate.
Drive new solutions based on any issues that arise

Ways to Stand Out From the Crowd:
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Knowledge in DFT flows such as ATPG, Mbist, Ijtag.
Prior experience in DFT timing closures.
Knowledge in CDC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
This position is open to all candidates.
 
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לפני 2 שעות
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform advanced AI Static Timing Analysis (STA) for complex chiplet and full chip level.

AI use for timing optimization and data analysis in STA and PnR.

Running and build STA tools for anlyaze and debug timing.

Use traditional STA tools like Prime Time, review and debug timing paths, understand constraints, sdc generation, timing ecos generation.

Identify convergence risks and work closely with physical design, RTL and DFT teams, ensuring convergence throughout various project stages.

Responsible for a full timing closer and quality approval from pre-layout STA model through signoff.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering.

At least 5+ years of hands-on STA experience.

Experience in Prime Time and signoff methodologies.

A great teammate who thrives in a collaborative environment.

AI tools orientation or alternatively a desire to learn.


Ways to stand out from the crowd:

Agentic Frameworks.

AI prompting experience.

Experience in Linux environments.

TCL, Python, shell scripting abilities.

Experience with data collection and analysis.
This position is open to all candidates.
 
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4 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
Basic Qualifications
B.Sc. in Electrical Engineering or Computer Engineering.
6+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting).
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels.
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off.
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure.


Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia).
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration.
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities

DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies.
Lead DFT planning, specification, and quality tracking across the project lifecycle.
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout.

Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels.
Own end-to-end DFT activities from specification through silicon bring-up and production support.
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements.

Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks.
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness.
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred).
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs.
Proven experience in leading DFT activities across full chip development cycles.
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG.
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges.
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent).
Solid experience with DFT verification methodologies and coverage analysis.
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development.

Preferred Qualifications
Experience with advanced process nodes (7nm and below).
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar).
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems.
Knowledge of silicon bring-up, production test flows, and yield optimization.
Familiarity with STA, low-power design, and CDC as it relates to DFT integration.
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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4 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
4+ years of hands-on experience in DFT roles at semiconductor companies.
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent).
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Staff DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support.
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards.
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies.

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production.
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance.
Drive test coverage and quality metrics to meet stringent manufacturing requirements.

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR.
Participate in developing and maintaining cutting-edge DFT implementation flows.
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
8+ years of hands-on experience in DFT roles at semiconductor companies.
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent).
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.


Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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לפני 2 שעות
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.
Requirements:
What we need to see:

An Electronics Engineer certificate or a B.Sc. in Electrical Engineering.

You should have 5 years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodologies, including DRC, LVS, ANT, ERC, and DFM for advanced process nodes, is required.

Knowledge in scripts' language: TCL, Unix and Shell.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre).

Self-motivation, attention to detail and good interpersonal skills.


Ways to stand out from the crowd:

Experience in methodology definition / flow owner of Full-chip / Place and Route.

Great teammate.

Ownership, self-learning skills and ability to work autonomously.
This position is open to all candidates.
 
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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4 ימים
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8831923
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לפני 6 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are now looking for a Senior Chip Design Engineer to join our Switch Silicon team. As a Chip Design Engineer in our Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state-of-the-art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What You'll Be Doing:

Work in a design/verification team which develops core units within the Switch silicon.

Micro-architecture of rtl verification environments planning for units and modules.

Design RTL of units/blocks according to Arch. specifications under challenging constraints with high orientation to power, area, and performance.

RTL synthesis, timing, supporting verification, and silicon post TO activities.

Work closely with multiple teams within organizations such as Architecture, u-arch, Full chip Micro-Architecture, BE, and FW.
Requirements:
What We Need To See:

Electrical Engineering B.Sc. or Computer Engineering B.Sc. graduate with high scores or equivalent experience.

5+ years of experience in RTL design.

Knowledge in network protocols and/or HPC and distributed calculations - advantage.

A team player with good communication and interpersonal skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8835895
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