דרושים » תעופה וימאות » Multi-Layer C-UAS - Product Manager

We are seeking an experienced, highly technical Senior Hardware Product Manager to own the end-to-end product lifecycle, operational sustaining, regulatory qualification, and sales enablement for our deployment kits and complex hardware configurations. In this role, you will serve as the single point of truth for major strategic kit initiatives.
You will bridge hardware engineering, manufacturing scaling, regulatory compliance, and commercial execution- working cross-functionally across R&D, System Engineering, Operations, Quality, and Sales to drive physical product maturity, reliability, and market deployment.
Key Responsibilities:
HW Product Ownership & PLCM: Own the end-to-end PLCM policy for deployment kits, managing product roadmap, definitions and execution through release and ongoing lifecycle evolution.
Inbound Leadership: Drive internal initiatives and prioritize System, SW and HW team efforts to ensure aligned execution.
Domain SME: Serve as the primary technical subject matter expert for deployment form factors, environmental constraints, and hardware kit capabilities.
Operations & Sustaining: Sustain day-to-day hardware health including design for manufacturability, supply chain issue mitigation, production scaling support, and root-cause resolution of field hardware defects (RMAs) with Quality and R&D.
Compliance, Qualification & Certification: Oversee kit-level regulatory, military, and environmental testing such as FCC/CE, MIL-STD 810/461, EMC/EMF etc.
Sales Enablement: Drive domain-specific sales enablement, including marketing materials, user documents (Installation Manuals, ICDs, Product Descriptions), and technical support for presale and customer inquiries.

Were seeking passionate professionals who thrive in a fast-paced, creative, and collaborative environment - those who want to be part of the next generation of airspace security innovation.
In this role, you will be responsible for all mechanical aspects of the product, working closely with hardware, production, operations, and product teams.
The role includes technical leadership of complex mechanical designs, including:
Design from scratch alongside retrofitting and improving existing designs.
Complex thermal management.
Withstanding dynamic profiles (mainly vehicle-related and wind loads).
Protection against electromagnetic interference (EMI/EMC).
Design for sealing.

The System team defines and develops cutting-edge 5G technology. In this role, you will lead the system team responsible for defining our next-generation modem products and developing modem algorithms, working at the intersection of research, system design, and implementation.

Responsibilities

Lead a team of senior system and algorithm engineers responsible for developing innovative 5G modems.

Partner closely with VLSI and SW teams implementing the modem HW and SW and align on system definitions with implementation constraints.

Develop and maintain deep expertise in cellular standards and their implications for modem design.

Lead system and algorithmic research, balancing trade-offs between DSP/SW/HW implementations, performance, implementation cost, real-time constraints, and time-to-market.

Own system definitions, requirements, and implementation from initial research through simulation to official release, including MATLAB/C/C++/SystemC modeling and specification documentation.

Mentor and grow team members, fostering technical excellence and professional development.

We are seeking an experienced and multifaceted Mechanical NPI & Manufacturing Engineer to own mechanical systems engineering, manufacturing transfer, advanced packaging, and thermal/liquid cooling integration across our high-performance networking portfolio.
In this role, you will lead end-to-end mechanical execution from late-stage R&D through volume manufacturing at global EMS/ODM facilities. Your scope spans chassis-level systems up to full-rack scale integration, custom packaging/palletization design, and advanced data center liquid cooling architectures. You will serve as the technical authority for mechanical quality, supplier qualification, transit reliability, and production line optimization.
Key Responsibilities
NPI Transfer & Manufacturing Execution:
Lead seamless NPI-to-mass-production transfers, cataloging & verifying BOM completeness, 2D/3D drawing releases, and fabrication readiness for standalone switches and fully integrated rack systems.
Author, validate, and maintain detailed Mechanical Assembly & Process Instructions for global contract manufacturing lines.
Define together with R&D precision assembly parameters: torque specifications, fastening tooling, screw tightening sequences, and structural assembly guidelines.
Design, validate, and commission mechanical assembly jigs, alignment fixtures, and high efficiancy tooling to ensure repeatable line assembly.
Advanced Packaging, Palletization & Logistics Engineering:
Design and validate primary and secondary packaging solutions, including custom cushioning (EPE/EPP foam), corrugated structures, and chassis transit protection.
Define ESD shielding, Moisture Barrier Bags (MBB), and desiccant requirements for high-sensitivity optical and electronic assemblies.
Optimize palletization patterns, container cube utilization, stacking strength calculations, and pallet weight distribution for global freight.
Plan, execute, and certify transit/drop testing in accordance with international standards.
Manage day-to-day shipping deviations, packaging waivers, and disposition of in-transit damage.
Labeling & Regulatory Compliance Integration:
Design unit, carton, and pallet labels; select and qualify label substrates, adhesives, and print ribbons for environmental durability (abrasion, high temperature, humidity, UV resistance per UL standards).
Manage the physical integration and placement of global regulatory markings on chassis surfaces, rating plates, and packaging.
Thermal Management & Liquid Cooling Architecture:
Address mechanical-thermal integration challenges within high-power chassis and optical cages .
Oversee mechanical validation and assembly of Liquid Cooling systems for high-density compute/switching gear, including cold plates, manifolds, quick disconnects , hoses/piping routing, fluid loop integrity, and leak detection mechanisms.

We are seeking a highly skilled Senior Communication PHY Algorithms Engineer.
This senior role is focused on the end-to-end research, design, and implementation of digital receivers for proprietary drone communication signals.
Responsibilities:
Mathematically characterize complex communication and signal detection problems. Analyze and assess design trade-offs based on both performance metrics and implementation complexity.
Develop and maintain simulations using MATLAB and Python.
Design digital receiver modules to be implemented either by FPGA of SW.
Implement features directly in SW or technically lead and verify the FPGA implementation efforts of the FPGA engineer.
Accompany the integration process of the feature until its end-to-end operation.

We are looking for an experienced Senior Signal Integrity Engineer to join our Hardware Engineering team. This role focuses on ensuring optimal signal integrity for high-speed interfaces, including Ethernet, PCIe, DDR5, and other next-generation technologies. As part of the team, you will be responsible for performing signal integrity analysis, developing signal integrity models, and ensuring electrical compliance for high-speed SERDES I/Os.
Responsibilities:
Conduct signal integrity analysis and simulations for high-speed interfaces such as 112Gbps Ethernet, PCIe Gen5, and DDR5 interfaces.
Develop and implement signal integrity guidelines for PCB design, ensuring high-performance and low-loss signal paths.
Analyze and resolve signal integrity issues related to high-speed interfaces, including reflection, crosstalk, and power delivery network (PDN) issues.
Collaborate with PCB layout engineers to optimize design for signal integrity, ensuring compliance with electrical standards and high-speed design best practices.
Perform time-domain and frequency-domain analysis, including loss, jitter, and eye-diagram analysis.
Utilize EDA tools such as Ansys SIWAVE, HFSS, or similar for simulation and validation of signal integrity designs.
Work closely with cross-functional teams to integrate signal integrity considerations into the overall hardware design process.
Develop behavioural models based on measured signal integrity data to inform future design and simulation work.
Conduct pre- and post-layout simulations and measurements for high-speed signal interfaces.