דרושים » חשמל ואלקטרוניקה » Physical Design Manager

we are looking for a Senior Physical Design Engineer.
Your Impact:
You'll be part of the team, which is at the heart of software and ASIC design efforts.
You'll handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

we are seeking a Physical Design Engineer.
Meet the Team:
The Physical Design team owns backend methodology and flow development from RTL to GDS. The team plays a critical role in developing high-quality VLSI designs for some of most advanced silicon products.
We work with the latest silicon technologies and processes to build large-scale, complex devices that push the boundaries of feasibility. You will collaborate with experienced engineers across architecture, design, verification, and implementation to deliver high-performance silicon.
Your Impact:
You will be part of the team, which is at the heart of software and ASIC design efforts. As a Physical Design Engineer, you will contribute to backend implementation work across key stages of chip design, helping move complex designs from RTL toward GDS.
You will work on physical synthesis, place and route, optimization, timing closure, and floor planning activities. Success in this role means delivering high-quality implementation results, learning quickly from senior engineers, and helping improve the flow and methodology used by the team.

You'll be joining our Physical Design team within Cisco Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.

Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.

Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.

Taking part inflows development.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be in charge of developing full-chip physical design methodologies, Physical Verification development and support through all the projects, Tapeout activities for implementation of networking chips and SOCs.

Work closely with Full Chip Layout owners and block owners, project managers to assure high quality and timely convergence.

Come up with unique and creative solutions to the state of the art FCL physical design problems that are needed for our chips.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

Participating and developing flow and tool methodologies for fullchip, physical design verification across multiple projects.

We are looking for talented people to join us, as leaders in our excellent Physical Design team, adopting super advanced process nodes, mentoring team members, and further developing our implementation methodologies.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macro and cluster-level blocks, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsys and Cadence.
* Engaged in defining implementation and signoff methodologies.