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לפני 11 שעות
חברה חסויה
Location: Haifa and Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. Our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for talented physical design implementation engineers to join our excellent Physical Design team, which develops our next generation of products for the cloud market.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.
Requirements:
Basic Qualifications
- Understanding the entire physical design flow (RTL to GDS).
- Deep understanding of sign-off activities (timing and physical verification).
- Experience in advanced nodes technologies and Implementation tools.
- Process and technology oriented.
- Leadership and mentoring skills.

Preferred Qualifications
- Full-chip experience (floor plan, layout, timing).
- Previous experience in high-speed designs, multi-voltage (low power) designs.
This position is open to all candidates.
 
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לפני 11 שעות
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are looking for talented people to join us, as leaders in our excellent Physical Design team, adopting super advanced process nodes, mentoring team members, and further developing our implementation methodologies.

Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.
Requirements:
Basic Qualifications
- 8+ years of experience in physical design.
- Understanding the entire place and route flow (RTL to GDS).
- Very deep understanding of timing.
- Process and technology (advanced nodes) oriented.
- Leadership and mentoring skills.

Preferred Qualifications
- Full-chip experience (floor plan, layout, timing).
- Previous experience in high-speed designs, multi-voltage (low power) designs.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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24/06/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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לפני 11 שעות
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. AWS provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of Amazon Web Services (AWS), is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
* Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.
Requirements:
Basic Qualifications
- Bachelor's degree in computer science or electrical engineering.
- 4+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).

Preferred Qualifications
- Background in protocols (AXI, CHI, DDR, Networking, PCIe).
- Knowledge of Network-on-Chip (NOC) architecture.
- Experience with coherent and non-coherent fabric design.
- Experience with the entire SoC cycle - Synthesis / STA / CDC / Lint.
- Experience with Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Haifa
Job Type: Full Time
Our Physical Design group operates in a dynamic, startup-like environment that values deep technical expertise and high-level execution. Each engineer holds end-to-end responsibility - from initial definition and constraints development to execution and full signoff. You will work closely with Design and Architecture teams on RTL modifications and design reviews to ensure seamless convergence.
Were looking for an Experienced Physical Design Engineer to join our growing team, and take a key role in developing our next-generation SoC from definition to Tape-Out.
What will your job look like:
Hands-on physical design block owner, leading the process from RTL to GDS .
Lead floorplan exploration in collaboration with Front-End and Architecture teams.
STA: Partner with FE and floor planners to manage block and top-level constraints and perform 1st-level timing analysis.
Synthesis: Conduct synthesis exploration and deliver final netlists, including scan insertion, UPF, and clean Lint/Spyglass checks.
Place & Route: Drive the flow from synthesis netlist to final layout and signoff verification, with a focus on optimizing PPA (Power, Performance, and Area).
Signoff : on all physical design domains- STA, IR/EM, Physical Verification, Logic Equivalent Checking, Low Power Verification.
Requirements:
BSc or MSc in Computer Engineering or Electrical Engineering.
5+ years of experience in the Physical Design field
Proficiency in scripting languages (Tcl, Python, Perl, or tcsh).
A team player with excellent communication skills and a can-do attitude
Experience in developing or maintaining implementation tools and design flows - an advantage
Experience with high-speed interfaces (DDR/PCIE) - an advantage.
Experience with advanced nodes (5nm and below) - an advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Lead physical design of complex SoC to tape-out while working with multiple team members.
Evaluate and develop physical design methodologies and decide on the SoC flow.
Work with architects and logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure.
Participate in design reviews and track issue resolution, and engage in technical and schedule tradeoff discussions. Create execution plans for projects and manage team efforts from concept to working silicon in volume.
Understand architecture and design specifications with the larger team, and define physical design strategies and tactics to meet quality and schedule goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
Experience in silicon implementation and chip integration.
Experience in ASIC development teams.
Experience in managing physical design teams working on digital designs that produce and deliver silicon.
Preferred qualifications:
Experience in extraction of design parameters and analyzing data trends.
Experience and breadth in engineering across physical design, top-level implementation, GDS tape-out.
Experience in top-level floor planning, block integration, static timing analysis, and sign-off.
Understanding of circuit design, device physics, and deep sub-micron technology.
Knowledge of delivery of high complexity silicon in technology process nodes.
Ability to lead cross-functional teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
We are seeking a CAD Engineer to join the Silicon One Physical Design team.
Meet the Team:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As part of our team, youll contribute to the development of our next-generation network devices. Our team operates in a startup-like environment within a stable and leading corporation.
Our design center is uniquely equipped, hosting all silicon hardware and software development fields under one roof.
We are revolutionizing the industry by building a new internet for the 5G era, providing a unified, programmable silicon architecture that serves as the foundation for all of our future routing products. Our devices are designed to be universally adaptable across service providers and web-scale markets, catering to both fixed and modular platforms. They deliver high speed without compromising on programmability, buffering, power efficiency, scale, or feature flexibility.
We are a ground-breaking, groundbreaking technology that will serve our customers and end users for decades to come. The Internet now has a new, faster, better, and safer engine!
Your Impact:
You'll be joining our Physical Design team within Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be the tech lead for CAD within the team, leveraging your extensive backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.
We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Requirements:
Minimum Qualifications
A VLSI Design Engineer with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevent background.
5+ years of hands-on experience in a relevant domain
Strong understanding of Place & Route flow
Preferred Qualifications
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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24/06/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, We are looking for a Physical Design CAD Engineer with at least 3 years of hands-on experience in digital implementation flows. The ideal candidate is highly technical, curious, and eager to drive innovation by combining strong physical design knowledge with modern automation and GenAI-based methodologies.
This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.
Key Responsibilities
The Engineer will develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
Key responsibilities include:
Develop and support physical design CAD flows using industry-standard EDA tools
Build automation infrastructure for implementation, analysis, reporting, and debug
Support design teams in areas such as synthesis, floorplanning, placement, CTS, routing, timing, power, and physical verification
Create scripts and utilities to improve productivity, quality of results, and flow robustness
Support and enhance flows based on Synopsys Fusion Compiler
Explore and integrate GenAI solutions to accelerate debug, automate repetitive tasks, improve reporting, and enhance engineering productivity
Analyze tool results, logs, QoR metrics, timing reports, congestion, utilization, power, and design-rule issues.
Requirements:
At least 3 years of experience in Physical Design, CAD, or implementation methodology
Strong understanding of digital physical design concepts, including synthesis, placement, CTS, routing, timing closure, and physical verification
Hands-on experience with Synopsys Fusion Compiler
Experience with scripting languages such as Tcl, Python
Ability to develop automation around EDA tools and large-scale design flows
Good understanding of timing, power, congestion, floorplanning, and QoR analysis
Strong debugging and problem-solving skills
Ability to work closely with multiple engineering teams and support complex design environments
High motivation to learn and apply GenAI technologies in semiconductor design flows.
Preferred Experience
Experience with additional tools such as PrimeTime, StarRC, ICC2, Innovus, Voltus, RedHawk, Calibre, or similar
Knowledge of STA, low-power design, UPF, EM/IR, extraction, or signoff flows
Experience building dashboards, regression systems, flow checkers, or automated report analyzers
Familiarity with LLMs, prompt engineering, AI agents, or GenAI-based coding/debug tools
Experience with Git, CI/CD, databases, or cloud-based compute environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
We are seeking a CAD Engineer to join the Silicon One Physical Design team.
Meet the Team:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As part of our team, youll contribute to the development of our next-generation network devices. Our team operates in a startup-like environment within a stable and leading corporation.
Our design center is uniquely equipped, hosting all silicon hardware and software development fields under one roof.
We are revolutionizing the industry by building a new internet for the 5G era, providing a unified, programmable silicon architecture that serves as the foundation for all of our future routing products. Our devices are designed to be universally adaptable across service providers and web-scale markets, catering to both fixed and modular platforms. They deliver high speed without compromising on programmability, buffering, power efficiency, scale, or feature flexibility.
We are a ground-breaking, groundbreaking technology that will serve our customers and end users for decades to come. The Internet now has a new, faster, better, and safer engine!
Your Impact:
You'll be joining our Physical Design team within Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.
Requirements:
Minimum Qualifications:
A VLSI Design Engineer with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering or Computer Engineering with relevant background.
2+ years of hands-on experience in a relevant domain
Strong understanding of Place & Route flow
Preferred Qualifications:
Deep understanding of Physical construction and Integration.
Knowledge of Physical Design Verification methods like LVS/DRC and formal verification.
Experience with PD CAD and Physical Design EDA tools (e.g., Synopsys, Cadence).
Ability to support technology adoption and new tool integration.
Great teammate, self-learner, and able to work independently.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
We are seeking a Physical Design Manager.
Meet the Team:
Physical Design team within Silicon One is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.
We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.
Your Impact:
You'll be part of the Silicon One team, which is at the heart of our software and ASIC design efforts.
As the Physical Design Manager, you will provide strategic and technical leadership to a team of engineers, guiding them through the entire chip design lifecycle. You will be responsible for the group's output, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.
Requirements:
Minimum Qualifications
A VLSI Design with extensive experience in backend design
B.Sc./M.Sc. in Electrical Engineering.
Strong understanding of Place & Route flow.
10+ years of hands-on experience in a relevant domain
4+ years of proven Management or Technical Leadership experience.
Preferred Qualifications
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8716804
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
21/06/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be in charge of developing full-chip physical design methodologies, Physical Verification development and support through all the projects, Tapeout activities for implementation of networking chips and SOCs.

Work closely with Full Chip Layout owners and block owners, project managers to assure high quality and timely convergence.

Come up with unique and creative solutions to the state of the art FCL physical design problems that are needed for our chips.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

Participating and developing flow and tool methodologies for fullchip, physical design verification across multiple projects.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering/Computer Engineering (or equivalent experience).

You should have at least 5+ years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodology, including DRC / LVS / ANT / ERC / DFM in advanced process nodes is necessary.

Proficiency using Python, Tcl, Shell, Make scripting.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre)

Self-motivation, attention to detail, and good interpersonal skills.


Ways to stand out from the crowd:

Experience with data collection and analysis

Experience in methodology definition / flow owner of Full-chip / Place and Route

Great teammate.

Ownership, self-learning skills, and ability to work autonomously.
This position is open to all candidates.
 
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