דרושים » הנדסה » Hardware Lead Engineer

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (IoT), Platform, and Productivity Apps services in our company, including support for customers who require specialized security solutions for their cloud services.

Take part in the development of cutting-edge products within a disruptive system architecture. You will have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. We provide a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world. Annapurna Labs, as part of us, is looking for talented engineers to help us develop a semiconductor platform based on a revolutionary architecture.

Looking for exceptional senior engineers to join the top-tier team that is developing the next generation semiconductor platform, based on a revolutionary architecture. Engineers will participate in design activities, working on the next generation of our products.

You are invited to take part in developing, integrating and deploying cutting-edge technologies, starting with identification and definition of project requirements, architecture, feature development, and collaboration with the different groups.
Your design will be integrated into the nitro SoC, on millions of servers worldwide. This is an opportunity to have a large-scale impact.
As a VLSI engineer and a member of the Nitro project, you will have an impact over the device through its entire lifecycle, from the product definition stage to mass production. You will work in close collaboration with multiple groups, including Architecture, Software, Verification, Backend, and DFT.

Key job responsibilities
*Full ownership of one or more IPs within the product:
-Micro-architecture.
-RTL coding and debug.
-Synthesis and timing closure.
-Sign-off.
* Supporting the Verification and Emulation teams: Test plan, Coverage review.
* Ensuring that the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical design.

We are looking for an Experienced HW SERDES Engineer to join Annapurnas SPIV (System Platform Interface validation) team.
As a member of the SPIV team, you will own End-to-end subset of system PCIe SERDES interfaces across range of products through product life cycle:
1. Validation and qualification.
2. Integration.
3. Deployment and post-deployment support.
4. Failure analysis.
5. Pre silicon activities for new technologies.
As owner, you will set the strategy for PCIe SERDES qualification over multiple platforms, ensure the design worked well and drive complex system debugs involving HW and FW components.

You will define NPI practices and engage in pre-silicon efforts to explore new technologies and mitigate integration risks. You will enhance SERDES qualification results with large scale customer performance analysis to discover SERDES life-cycle issues and mitigate them.

This is a fast-paced, intellectually challenging position, and you will work with thought leaders in multiple areas of technology. We are changing industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Approve future products PCIe SERDES technologies.
- Define new products SERDES qualification and validation strategy and lead the execution.
- Engage integrations of Annapurna Labs products with other vendors PCIe HW components.
- Support ongoing integrations of PCIe SERDES in new products.
- Lead triage, PCIe SERDES debug and root cause analysis of systems in AWS data centers.
- Drive and maintain training, quality documentation and collateral to improve in-fleet operation.

We are seeking an exceptional an exceptional leader to build and lead our next-generation internal Analog IP design team. This is a unique opportunity to create a world-class analog design center from the ground up, developing the critical IP blocks that power all of our custom silicon products, including Graviton (server CPUs) and Nitro (networking/security accelerators).

Key job responsibilities
Build the team: Recruit, hire, and develop a world-class analog/mixed-signal design team from the ground up. Define the org structure, roles, and growth path.

Define the IP strategy: Own the analog IP roadmap across all Annapurna Labs products. Evaluate build vs. buy decisions and drive internal capability development.

Drive execution: Lead the full design cycle from architecture through silicon validation - spec, schematic, layout, simulation, tapeout, and bring-up.

Collaborate cross-functionally: Partner with SoC architecture, digital design, physical design, DFT, packaging, and system teams to integrate analog IP seamlessly.

Set technical direction: Define design methodologies, flows, and best practices. Evaluate and select EDA tools, PDKs, and foundry processes.

Innovate at scale: Develop IP that is reusable, portable across process nodes, and designed to meet the performance, power, and area (PPA) needs of multiple products simultaneously.

Engage with leadership: Communicate strategy, progress, and risk to senior leadership. Influence the overall silicon roadmap with analog capabilities and constraints.

We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match - powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
- Micro-architecture definition.
- RTL coding and debug.
- Synthesis and timing closure.
- Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.

We're looking for a talented SoC Integration Lead to join our Nitro team and help shape what comes next. You will spearhead the SoC integration activities of sophisticated networking chips, collaborating closely with Architecture, RTL Design, Physical Design, Package Design, Verification, Software, DFT, and additional teams in a dynamic, open, and fast-paced environment. As a member of the Nitro project, you will have influence over the device through its entire lifecycle from product definition to mass production. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match, powering hundreds of thousands of businesses across 190 countries.

Key job responsibilities
Take full ownership of SoC integration, including IPs development, partitioning, clock domain crossing (CDC), reset domain crossing (RDC), exploratory synthesis, and design quality verification.
Drive chip-level design implementation by partnering with multiple teams including Architecture, RTL Design, DFT, Verification, System Verification, STA, and Physical Design.
Oversee the creation of SoC-level IP blocks such as fabrics, interfaces, and security modules.
Lead RTL integration activities including micro-architecture definition, RTL coding and debug, synthesis and timing closure, and sign-off.
Address diverse functional and structural challenges, encompassing functional debugging, physical design preparation, emulation, and design quality issue resolution.
Contribute to the creation and implementation of design flows and automated solutions that facilitate efficient SoC development.
Support Verification and Emulation teams through test plan development and coverage review.
Ensure the chip meets quality and reliability standards while delivering to physical design teams, emulation platforms, firmware developers, and other stakeholders.

Required Hardware Emulation Technical Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Define the emulation strategy, identify platforms and technologies to support all customers.
Explore emulation methodologies, gather feedback from customers, and implement emulation workflows at scale.
Support emulation customers with debugging hardware, software, tooling, and project-specific issues.
Create tooling and automation to support emulation tools, licensing, and job management in our infrastructure.
Act as a primary interface to emulation vendors.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

We are looking for a System Engineer with Software Engineering background to be part of defining, shaping and integrating solutions to next generation of our cloud platforms.

We are looking for an exceptional engineer to own the development, testing, and monitoring of the manufacturing health of Amazon Graviton server products. You will be part of a team integrating new silicon, hardware, firmware, and software into a revolutionary system architecture.

Key job responsibilities
Lead triage, debugging, and root cause analysis of systems in our data centers.
Enhance troubleshooting capabilities and drive closure of in-fleet problems.
Analyze customer workflows and requirements to provide targeted resolutions.
Collaborate with Annapurna Labs monitoring team and root cause teams to improve product quality and reliability in fleet operations.
Represent the customer voice by providing fleet operation insights and requirements to Annapurna Labs' ASIC design, software development, QA, and architecture teams.
Develop and maintain training materials, quality documentation, and collateral to improve in-fleet operations.
Design and implement tools and scripts to support projects and customize solutions based on requirements.
Travel as needed, approximately 2-4 times per year.