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לפני 5 שעות
Location: More than one
Job Type: Full Time and Hybrid work
Collaborate with the design engineering team to review and improve mechanical designs for manufacturability and cost-effectiveness.
Support the development of prototypes and testing of new designs. Plan, design, and perform prototype builds, including tests for functionality, durability, and reliability.
Ensure product designs are optimized for manufacturing.
Support production lines across multiple contract manufacturers, implement design improvements, and drive continuous product optimization.
Work with suppliers and manufacturers to ensure they understand the design and meet required specifications.
Identify and resolve mechanical design issues and challenges during the transition from prototype to production.
Prepare and maintain comprehensive product documentation, including technical drawings for tools, specifications and manufacturing instructions.
Requirements:
3-5 years of experience in new product introduction, product development, or manufacturing engineering, preferably in the medical device industry.
Hands-on experience with SolidWorks for mechanical design.
Familiarity with product lifecycle management (PLM) tools and processes.
Strong understanding of materials, manufacturing processes, and product testing methodologies.
Proficiency in root cause analysis and solving complex mechanical problems.
Excellent communication skills, both written and verbal.
Ability to work effectively in cross-functional teams and manage multiple projects simultaneously.
This position is open to all candidates.
 
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8646100
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1 ימים
דרושים באיילת אלבז
Job Type: Full Time
A Defense Technology startup is looking for a
Senior Mechanical Engineer.
Full Time - Sharon area.


Responsibilities -
Design and develop aero-mechanical assemblies for airborne platforms.
Lead the mechanical integration of the platform.
Manage and support development and production through subcontractors.
Lead mechanical projects from requirements definition through customer
delivery.
Oversee testing and Quality Assurance across design and production phases.
Prepare design reviews, assembly instructions, and design verification and
feasibility documentation.
Solve complex engineering challenges under tight schedules and
technological constraints.
Requirements:
BSc. in Mechanical Engineering or Aeronautical Engineering.
5+ years of experience in mechanical design.
Proven experience with mechanical integration and hands-on engineering
work.
Experience designing structures and integrating assemblies for airborne
systems.
Full proficiency in SolidWorks, demonstrated in production-grade designs.
Experience designing for manufacturability using composite, plastic, and
aluminum materials.
Familiarity with New Product Introduction (NPI) methodologies
Experience managing mechanical databases and documentation
Ability to implement best practices for part numbering and configuration
control.
Ability to work effectively in a fast-paced environment with frequent
iterations and changing timelines.
Hebrew, English - Speaking, reading and writing at high level.
Experience in the defense industry - Advantage.
This position is open to all candidates.
 
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הגשת מועמדות
עדכון קורות החיים לפני שליחה
8498153
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חברה חסויה
Location: Yokne`am
Job Type: Full Time
we are looking for a NPI Quality Engineer.
Key Responsibilities:
Coordinate Cross-Functional Teams: Collaborate with R&D, design, procurement, and production teams to ensure smooth product launches.
Process Development: Develop and optimize manufacturing processes for new products using quality tools.
Documentation: Review and maintain process documentation, work instructions, and operator training materials.
Prototype Builds: Support PT builds and production ramp-up activities, ensuring product quality, yield, and cycle times meet expectations.
Issue Resolution: Identify and resolve production issues during development and transfer phases.
Compliance: Ensure compliance with quality and regulatory standards.
Continuous Improvement: Implement continuous improvement practices to enhance production efficiency and product quality.
Requirements:
Education:
CQE or B.sc in quality engineering.
Bachelors degree in mechanical, Electrical, Industrial Engineering, or a related field - advantage.
Minimum 3 years of experience in NPI or manufacturing engineering, with a focus on transferring products from development to production.
Knowledge of manufacturing processes and materials and familiarity with quality systems and regulatory requirements.
ability to manage multiple projects simultaneously.
Strong problem-solving and analytical abilities (8D /A3 method)
Interpersonal and communication skills.
Familiarity with ISO 9001 and /or AS9100.
Certified internal auditor - advantage
Complete Control of MS Office with advanced Excel Skills
ERP / PLM knowledge.
Fluent Hebrew and English (Reading, Writing and Speaking)
Preferred Qualifications:
Experience in industries such as electronics and mechanics and multidiscipline systems.
Knowledge of lean manufacturing principles, Six Sigma methodologies, and quality systems.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8625577
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חברה חסויה
Location: Haifa
Job Type: Full Time
Required Advanced Manufacturing Engineer
Job Description
Role Summary
The Advanced Manufacturing Engineer (AME) is responsible for industrializing and sustaining complex PET and SPECT imaging products at a high‑complexity electromechanical manufacturing site. The AME ensures robust manufacturability of high‑level mechanical assemblies, electronics integration, wiring, detector modules, motion systems, and system‑level testing. The role drives process development, tooling, validation, DFM/DFA, quality improvement, and readiness for production and NPIs.
NPI Leadership for PET & SPECT Imaging Systems
Lead manufacturing readiness for new PET/SPECT products, including process layout, tooling development, and new equipment introduction.
Participate in design reviews and influence DFM/DFA/DFT across mechanical assemblies, detector modules, power systems, wiring harnesses, and electromechanical subsystems.
Translate design intent into controlled, stable manufacturing processes.
Coordinate ECO implementation and ensure smooth manufacturing release.
Assembly Process Development & Optimization
Develop robust assembly processes for mechanical and electronic integration, alignment, torque control, and detector installation.
Define and design manufacturing jigs, tools, fixtures, and lifting/handling solutions required for large subsystems.
Lead design/manufacture of equipment, tooling, and jigs internally or via suppliers to eliminate defects.
Drive LEAN manufacturing implementation and support continuous improvement.
Conduct PFMEA for existing and new processes.
Quality & Problem Solving
Drive product quality improvements by identifying manufacturing issues and implementing cost‑effective solutions.
Work with Production Associates to resolve manufacturing and quality problems.
Oversee corrective action implementation in production or suppliers.
Support RCA through structured failure analysis.
System Integration & Testing Support
Support integration/testing of assembled PET/SPECT systems including calibration, alignment, motion validation, detector gain calibration, and safety checks.
Work with System Engineering to define test protocols and acceptance criteria.
Troubleshoot system issues related to electromechanical assemblies.
Validation & Regulatory Compliance
Own IQ/OQ/PQ for equipment, tools, and manufacturing processes.
Ensure compliance with ISO 13485, ISO 14971, 21 CFR 820, IEC 60601, and internal QMS requirements.
Maintain strong documentation practices including control plans, validation protocols, and DHR/DMR accuracy.
Ensure traceability for critical parameters, torques, and calibration data.
Supplier & Cross‑Functional CollaborationCollaborate with suppliers of mechanical assemblies, detector modules, wiring harnesses, and PCBs.
Lead technical discussions with suppliers for tooling, process capability, and quality issues.
Train and qualify production and supplier teams on processes and inspection/assembly methods.
EHS & Plant Compliance
Lead and support Environment, Health & Safety efforts aligned with site goals.
Ensure safe handling of large assemblies, HV systems, and radiation‑related components.
דרישות:
Drive product quality improvements through systematic problem solving.
Lead design requirements for manufacturing processes, tools, and fixtures.
Design and manufacture jigs, fixtures, and tooling (internal or supplier‑managed).
Strong experience with LEAN manufacturing and PFMEA execution.
Ability to resolve complex manufacturing and quality issues.
Leadership of NPI activities including tool development and equipment introduction.
ECO coordination and controlled release management.
Strong understanding of compliance, EHS, and regulated manufacturing.
Ability to train and qualify production and supplier teams.
Mechanical/electromechanical assembly expertise.
Experience with HV/LV wiring, detector systems, and motion integration.
Strong המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8629912
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לפני 2 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for an experienced Senior Fuse Configuration Manager for the IC Product Engineering organization, responsible for fuse configuration management across all our Networking products. You will drive execution and scheduling of all fuse-related configuration aspects across our Networking teams while aligning with corporate priorities, constraints, and methodologies.
We are a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer best-in-class solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance and deliver industry-leading bandwidth and scalability. We serve a wide range of sectors including high-performance computing, enterprise, data centers, cloud computing, big data and Web 2.0. Our product line focuses on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our Datastream and TCP/IP acceleration.
What you'll be doing
Coordinate between all project collaborators such as Chip Design, Q&R, Architecture, ICPE, and others from initial fuse definition stage through product end-of-life, including release to mass production.
Own and manage all fuse CCB (Change Control Board) activities.
Collaborate closely with domain owners and stakeholders across various teams to gather and validate inputs required for product fuse configuration, ensuring alignment with overall project and product strategies.
Manage and coordinate configuration files and parameters for multiple products, maintaining accuracy, traceability, and consistency throughout the product lifecycle.
Contribute hands-on to product execution activities by actively working on configuration management, including updates, troubleshooting, and validation of fuse-related configuration settings.
Support the integration of product fuse configurations into the overall product development, test, and manufacturing processes, ensuring smooth deployment and operational readiness across multiple product lines.
Requirements:
B.Sc. in Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related engineering fields.
Strong, hands-on engineering experience (design, test, integration, manufacturing, or similar) is a must.
5+ years of experience in program, project, or configuration management in a technical/engineering environment.
Background or strong familiarity with IC design, fabrication processes, and/or testing.
Excellent program and configuration management skills - familiar with project management methodologies and tools.
Proven ability to lead multi-functional teams and initiatives.
Good written and verbal communication skills in English.
Personal skills: team player, strong problem-solving skills, independent, accountable, adaptable to a fast-paced environment, ability to drive people and tasks, leadership qualities, excellent communication skills.
Ways to stand out from the crowd
Direct experience in fuse configuration or fuse program management in IC or semiconductor products.
Experience with long-term planning and execution across full product lifecycles for networking or semiconductor solutions.
Demonstrated technical leadership in complex, multi-disciplinary engineering projects.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8646350
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01/04/2026
Location: Haifa
Job Type: Full Time
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8599381
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1 ימים
Location: Yokne`am
Job Type: Full Time
Required Senior NPI to Mass Production Engineer
As an NPI to Mass production Engineer, you'll work in a fast-paced multi-disciplinary group, highly involved on products engineering design from early stages, develop and qualify solutions in a manufacturing environment, including review and support our global CEM production capabilities, quality, and readiness to Mass production. Ensure excellent standards of manufacturability, yield improvement, and advanced process controls. Collaborate with our greatest teams to maintain strong functional relationship to meet our team requirements and delivery schedules (SOL).
What you'll be doing:
Lead products transition from NPI to MP. Assure products are at highest quality, capacity and material availability readiness when moving to MP. Find opportunities for potential processes improvements and collaborate with multi-functional teams to implement.
You will be working concurrently with our phenomenal NPI and engineering teams on production processes, products design, and readiness to MP.
Working with our worldwide CEMs to ensure excellent standards of manufacturability. Assure CEM production capabilities and readiness on early product stages driven by company forecast requirements. Assure CM high performance execution for products under our team responsibility.
Be our excellent team key part of new products designs and processes. Represent mass production requirements and contract manufacture capabilities.
Requirements:
B.Sc. in Industrial and Management Engineering or equivalent experience
5+ years of practical experience on semiconductors production line company
Phenomenal person with Technical knowledge and production processes experience in an enterprise global company
Creativity, motivation, team player, fast learning skills and independence.
Advance MS Office and Excel skills.
Excellent English written and oral communication skills, powerfully motivated to provide highly responsive support as needed.
Ways to stand out from the crowd:
Results oriented, analytical, self-motivated and high level of attention to details.
Ability to demonstrate experience in creative problem-solving skills, out of the box thinking.
Motivate and lead other teams members to achieve required missions.
Organized and detailed oriented, hard worker and dedicated.
Excellent interpersonal and written communication skills required.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8644511
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
1 ימים
Location: Yokne`am
Job Type: Full Time
Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager.! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.
Our Networking division is a leading supplier of innovative end-to-end NVLINK, InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize data center performance, using Our AI solution and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors, including high-performance computing, enterprise, data centers, cloud computing, big data, and Web 2.0.
What you'll be doing:
You own silicon bring-up schedule from power on to production release
Negotiate silicon and board demand with teams and drive a bottom-up forecast
Oversee and manage chip and board allocations across the company
Lead prototype chip delivery to internal customers
Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase
Identify and mitigate risks to schedules and programs
Communicate status to cross-functional teams as well as upper management
Continuously evaluate internal tools and processes and drive fixes to improve productivity
Create new and fix existing processes between different teams
Drive implementation of SW tools for data analytics and process evaluation.
Requirements:
Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field
At least 5 years of relevant experience
Proven experience in engineering roles, with a significant portion focused on semiconductors industry
Strong background in planning methodologies
Excellent communication, interpersonal, and leadership skills to effectively collaborate with internal teams
Ability to travel internationally to supplier sites as needed
Ways to stand out from the crowd:
Deep understanding of ASIC Technology and Productization requirements
Strong verbal and written communication skills, and the ability to coordinate with multiple technical and business teams
Self-directed and driven, highly motivated, creative, and have a consistent record of handling multiple tasks at any given time
Have the ability to work independently and follow complex procedures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8644529
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27/04/2026
Location: Haifa
Job Type: Full Time
We are looking for a Senior Thermal Design & Equipment Engineer to join a team focused on advancing next-generation testing capabilities. In this role, you will contribute to thermal and mechanical design, simulation, and validation efforts - working with a high degree of independence across vendors and internal teams to ensure hardware performs reliably in production environments.

Key job responsibilities
- Own the thermal and mechanical design of test equipment from concept through production, including heat sink and cold plate design, thermal interface material selection, fan selection, and airflow/liquid-flow architecture.
- Perform thermal simulations using CFD tools and validate simulation accuracy against real-world test data.
- Develop and execute thermal validation test plans; debug and resolve thermal failures identified during bring-up and qualification.
- Collaborate with ODMs, OSATs, and internal cross-functional teams (Product Engineering, NPI, Operations) to drive hardware from prototype to mass production.
- Mentor and develop junior engineers; lead process improvement initiatives and contribute to team capability building in thermal and mechanical simulation.
- Author clear technical documentation to communicate design decisions, trade-off analyses, and validation results to stakeholders.
Requirements:
Basic Qualifications
- Bachelor's degree in Mechanical Engineering.
- 5+ years of experience in thermal and mechanical design.
- 5+ years of experience with thermal simulation (CFD tools such as Flotherm, ANSYS Icepak, or equivalent).

Preferred Qualifications
- Masters degree in mechanical engineering or equivalent.
- 7+ years of experience in thermal and mechanical design of actively controlled thermal solutions.
- Experience with design of optical testing solutions for semiconductors.
- Experience working with interdisciplinary teams to execute product design from concept to production.
- Experience developing and mentoring engineers; track record of leading process improvement initiatives.
- Strong written communication skills with experience conveying technical design decisions to cross-functional stakeholders.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8626354
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
01/04/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews
Requirements:
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8599399
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 2 שעות
Location: Yokne`am
Job Type: Full Time
We are looking for hardworking Senior NPI infrastructure manager for a full-time position. The responsibility of this position is full ownership of production infrastructure readiness for NPI production lines, worldwide. You will join a team entitled to ensure streamline production readiness on a changing environment. A wonderful place to work at and an outstanding team to work with!
What youll be doing:
End-to-end management of NPI production Infrastructures supply chain, from design review to infrastructure delivery and implementation at production sites
Responsibilities of ongoing NPI production capacity management and support, risk assessment, infrastructure establishment, maintenance activities, budgeting, and process improvements
Be the key-point for multiple production sites to ensure full infrastructure support for our NPI production CMs.
Requirements:
B.Sc. in Industrial Engineering & Management, Mechanical Engineering or equivalent experience
5+ years of relevant experience
Creative - with initiative skills, sharp thinking and good decision-making skills, Independent & capable of leading tasks from the beginning to closure, multi-tasking, performs well in an intensive and dynamic environment
A phenomenal teammate with good interpersonal skills
Knowledge: Microsoft Office tools, Excel and PowerPoint, Wrike is an advantage
Good written and oral communication skills in English
Ways to stand out from the crowd:
Background with Contract Manufacturers management, in a production environment or mechanical design
Familiar with production processes as: SMT assembly, electro-mechanical assembly, mechanical integration.
Be familiar with transfer to production activities, SAP & Agile systems,
Budgeting / supply - demand background.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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