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As a Design Verification Manager for the IP Group, you will lead a focused team responsible for the quality and reliability of our critical IP blocks. You will steer the IP verification roadmap, oversee the development of complex testbenches, and ensure our next-generation AI silicon meets the highest standards. Leading a team of talented engineers, you will tackle challenges at the unit and sub-system levels, playing a pivotal role in delivering high-performance hardware for the worlds largest AI clusters.

Key Responsibilities



Lead and mentor a team of design verification engineers, defining the technical roadmap and methodology for ASIC verification across unit and IP/sub-system levels
Drive the creation and execution of comprehensive design verification plans, ensuring all functional requirements are met on schedule for complex digital IPs
Oversee the architecture and maintenance of block-level verification strategies, heavily utilizing SV-UVM, alongside Formal Verification where applicable
Define functional coverage goals and quality metrics, driving the IP team toward 100% verification closure and sign-off
Partner closely with IP Design and Architecture teams to align on specifications, root-cause complex bugs, and optimize the IP development cycle

As an Expert EMIR & Power Integrity Lead, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon. You will own from block level to full-chip the Electro-Migration and IR Drop (EMIR) methodology, analysis, and sign-off, working at the intersection of Physical Design, Analog/Mixed-Signal design, and Package Engineering.

You will be responsible for defining power grid architectures and validating that products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes. Your work will directly impact the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities

Lead static and dynamic IR drop analysis, signal/power electromigration (EM) verification, and self-heat analysis from block level to full-chip sign-off
Define and implement robust EMIR flows and methodologies using industry-standard tools (Ansys RedHawk-SC, Cadence Voltus, or equivalent)
Collaborate with Physical Design teams to define optimal power grid structures, via pillars, and strap distributions to minimize voltage drop while maximizing routing resources
Work closely with Analog/SerDes designers to analyze current profiles and ensure robust power delivery to sensitive high-speed IP blocks
Partner with Package Design engineers to perform Chip-Package-System (CPS) co-analysis, optimizing bump patterns and package routing for superior Power Integrity
Drive root-cause analysis for voltage drop violations and EM risks; propose and implement layout fixes alongside the PD team
Verify current density rules for ESD protection networks and ensure compliance with foundry reliability constraints
Support silicon bring-up by correlating simulation results with actual silicon measurements and yield data

we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities

Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews

As the Physical Design Chip Top Expert you will be a Key member of our PD Team in Israel R&D center. You will run PD execution of SoC Top level for chips that drive the worlds largest AI clusters. As PD Top Level Lead, you will own all PD disciplines of the Chip and own the T.O GDS that meet the chip signoff Criteria (Timing, LVS, EMIR, DRC, PV etc. ) ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities

SoC Top level Ownership and oversee the Chip convergence.
Take full ownership of Top Level physical implementation, including floor planning, P&R, CTS, Power/Clock distribution, Power integrity and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power Performance Area (PPA). This involves conducting feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Address complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Work Closely with Package team on Bump map to Ballout taking into consideration all Signal integrity aspects