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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SOC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the SoCs that power these data centers by driving quality and reliability processes from the integrated circuit perspective. You will create silicon and follow it into the field (and back) to drive improvements for the next generations of chips.
You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.

Responsibilities
Drive the strategic definition and development of design-for-reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure silicon and package verification.
Execute comprehensive silicon and package qualification programs (including high-temperature operating life (HTOL), early life failure rate (ELFR), electrostatic discharge/latch-up (ESD/LU), biased highly accelerated stress test (b/HAST), etc.) and conduct failure analysis to resolve quality issues.
Extract and analyze data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, time-dependent dielectric breakdown (TDDB), negative bias temperature instability (NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability lifecycle from post-tapeout through high-volume manufacturing.
Experience with semiconductor complementary metal-oxide-semiconductor (CMOS) technology, device physics, and failure mechanisms.

Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related field.
Expertise in statistical data analysis using tools such as JMP, Python, or JSL.
Knowledge of design-for-reliability (DfR) rules and implementation techniques.
Familiarity with electrical failure analysis (EFA) and physical failure analysis (PFA) techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Technical Lead, Custom Digital Circuit Design, Mixed Signal
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for our custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
Responsibilities
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout.
Experience delivering GDS for advanced nodes.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience in custom digital design and low power design techniques.
Experience with custom design tools and methods.
Experience in Electromagnetic Modeling (EM) and its impact on physical layout (Inductors, T-lines).
Experience in Co-Packaged Optics (CPO) physical implementation.
Ability to build strategic goals for the intersection of AI-driven layout and traditional custom design.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785630
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Design Engineer, Edge AI, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make our product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement groundbreaking data center.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
5 years of experience with RTL development for ASIC subsystems using Verilog.
Experience with speed interfaces such as PCIe, InfiniBand, and their low latency, security, and reliability principles.
Experience with micro architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience with scripting languages (e.g., Python or Perl).
Knowledge of arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Knowledge of high performance and low power design techniques.
Knowledge of FPGA, emulation platforms, and SoC architecture.
Knowledge of assertion-based formal verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785625
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Validation and Debug Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Contribute to developing and improving post-silicon test content that exercises both IP and SoC levels workloads and other compute-intensive scenarios.
Collaborate with architecture, design, and firmware teams to define comprehensive validation plans for SoC features, focusing on power consumption, thermal management, sensors behavior, and performance metrics.
Work closely with design and firmware teams to propose and implement solutions for optimizing SoC power efficiency and performance, including tuning core-to-memory latencies and bandwidth, power control loops, thermal control loops, etc.
Develop and maintain automated test scripts and frameworks (primarily in Python) to improve validation efficiency and coverage.
Participate in early silicon bring-up and platform bring-up activities, ensuring the stability and functionality of high-power multi-core SoCs.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical/Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with functional tests for silicon validation (i.e., writing in C, C++ or Python, or similar).
Experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Experience in debugging and triaging.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Familiarity with pre-silicon development environments (e.g., emulation, software modeling).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785603
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop ATE test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Product sustain support, including volume data analysis, test time and yield improvements, assess test escapees and Return Merchandise Authorization (RMAs), localize failures, implement containment measures and partner with design, manufacturing, quality and reliability teams to root cause and implement corrective actions.
Develop tools, flows and methodologies to continuously improve and automate the testing life cycle.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, ATE program development, and post-silicon enabling from New Product Introduction (NPI) through High Volume Manufacturing (HVM).
Experience in Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Experience with ASIC test methodologies (e.g., mbist, atpg, dft serdes, sensors).
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Ability to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785600
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Verification Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design Verification Engineer, you will be a part of the Research and Development team to verify digital designs, develop constrained-random test environments and drive system testing to closure. You will collaborate with design and verification teams, manage the verification life-cycle and uncover bugs through corner-case testing.
Responsibilities
Plan and execute the verification of digital design blocks by understanding specifications and working with design engineers to define key verification scenarios.
Develop and refine random verification environments using SystemVerilog/Universal Verification Methodology (UVM) or Specman to ensure effective test coverage.
Define and implement various coverage measures to capture stimulus and corner-case scenarios.
Collaborate with design engineers to debug tests and ensure functional correctness of design blocks.
Drive coverage analysis to identify verification gaps and demonstrate progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, or equivalent practical experience.
4 years of experience verifying digital logic at Register-Transfer Level (RTL) using SystemVerilog or Specman/E for Field Programmable Gate Arrays (FPGAs) or Application-specific integrated circuit (ASICs).
Experience with Central Processing Unit (CPU ) implementation, assembly language, or compute System on a Chip (SOC).
Experience verifying digital systems using standard IP components/interconnects (e.g., microprocessor cores, hierarchical memory subsystems).
Experience creating and using verification components and environments in standard verification methodology.

Preferred qualifications:
Masters degree in Electrical Engineering or Computer Science.
2 years of experience verifying digital logic at Register-Transfer Level (RTL) using SystemVerilog or Specman/E for Field Programmable Gate Arrays (FPGAs) or Application-specific integrated circuit (ASICs).
Experience with UVM, SystemVerilog, or other scripting languages (e.g., Python, Perl, Shell, Bash, etc.).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785595
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Embedded Firmware Engineer, High Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a Staff Embedded Firmware Engineer for High-Speed DSP, you will architect and define the low-level firmware and control loops powering the world's most advanced physical-layer communications silicon. Sitting at the critical intersection of digital signal processing (DSP), hardware-software co-design, and real-time systems, you will lead the development of adaptive algorithms, error correction (FEC), and link-telemetry frameworks. Your work will directly bridge the gap between high-performance hardware pipelines and our planetary-scale AI infrastructure, transforming complex communication systems theory into reliable, real-time silicon execution.
Responsibilities
Define the long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces, determining the optimal balance between hardware-fixed logic and programmable firmwarm.
Architect advanced "in-situ" monitoring systems and firmware-driven diagnostics to track physical-layer link health, Bit Error Rate (BER) trends, and channel quality across millions of ports in real-time.
Design, model, and implement bare-metal or RTOS firmware to control high-speed transceivers, managing real-time adaptive loops, clock and data recovery (CDR), and physical-layer calibration.
Partner with TPU Systems, Networking Software, and High-Performance Computing (HPC) teams to ensure silicon firmware integrates seamlessly with global cluster management and collective communication frameworks.
Identify and de-risk hardware-software interface bottlenecks (e.g., register maps, driver latencies, and boot-up sequencing) that impact our AI infrastructure.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
10 years of industry experience in embedded systems/firmware, communication systems engineering, or digital signal processing (DSP) development.
Experience developing embedded software (C/C++) for high-speed physical-layer interfaces (PHY), digital transceivers, or communication subsystems.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Expertise in Forward Error Correction (FEC) algorithms and advanced modulation schemes.
Track record defining firmware framework specifications, register maps, and Silicon Lifecycle Management telemetry for high-volume networking or AI silicon.
Background in wireless communications with deep domain knowledge of channel modeling, noise mitigation, and digital transceiver architectures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8785577
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
16/08/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time and Hybrid work
we are looking for a AI Applied Scientist - Insights & Recommendations.
As AI Applied Scientist, youll be at the intersection of advanced technology and meaningful impact with clear business cases. You will have access to real-time (RT) big data from multiple Sensors & Data sources, and a chance to discover, explore research, and develop cutting-edge models that directly impact industrial manufacturers around the globe. As part of the Applied AI/ML Science team , you will have the opportunity to continuously grow and learn while building and deploying advanced models directly into our products, and stay at the forefront of the world's technologies, witnessing firsthand their impact on our customers.
A Day In Your Life:
Own the algorithm lifecycle from problem definition and data analysis to prototyping and delivering production-ready models.
Combine classic methods with inference techniques: statistics, Time series, Deep learning, anomaly detection, Recommendation Systems, Transformers, and Inference to extract data-driven insights.
Research, design, and build Agentic applications on top of sensor time-series data, textual data, images, ML applications, and other various data sources.
Engage with customers and collaborate with our product team to develop innovative solutions utilizing new types of data.
Leverage modern technologies: work with cloud-based big data platforms for storage, distributed processing, LLMs and agents (GPT, Claude, Gemini), defining & building Gurdrails, reasoning chain as function call, planning, ML-based vectorization and embeddings, and stream analysis.
Requirements:
M.Sc., or Ph.D. in Electrical Engineering, Computer Science, Physics, Mathematics, or a related field.
5+ years of experience in ML applications in modeling Time-series data, & ML-based vectoring, and Embeddings for insight & recommendations systems (Transformers included) - Mandatory
2+ years of experience in LLM and Agentic applications, Eval tools, methods, and workflows (HITL, LLM-as-a-judge, deterministic, Metrics & Embeddings), Fine-Tuning, and AI workflows and lifecycle (e.g. LangSmith, CrewAI, LangGraph, Embedding (BERT, w2v, FastText, FastEmbed, GloVe, etc.), Tokenizations (GPT. TikToken, Token validators, etc.), & Vector Similarities & search methods
Proficiency in Python for model development, deployment, and monitoring.
Experience working on Agile teams with a passion for fast iterations, feedback, and continuous learning.
Proven ability to collaborate with diverse, cross-functional groups, including product managers, infrastructure, and data engineering teams.
The ability to translate research into scalable, production-ready solutions.
Experience in anomaly detection and AI/ML - an advantage.
Experience in feature engineering-based signal processing - an advantage
Experience in optimizing costs of API calls - Nice to have
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783852
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
16/08/2026
Location: Haifa
Job Type: Full Time and Hybrid work
we are looking for a Algorithm and Applied AI Scientist (DSP).
As an Algorithm and Applied AI Scientist (DSP), you will serve as the technical lead for an innovative project focused on advanced signal processing and data analytics applications. You will work with unique datasets from various signal-generating sources, researching and developing novel models, and analysing, maturing, and extracting features that have a significant impact on industrial manufacturers globally. In this role, you will be instrumental in defining project objectives, identifying customer value, and pushing the team toward successful outcomes. Joining AI team offers ongoing professional growth in leadership, algorithm development, research, innovations, and technical data analysis.
A Day In Your Life:
Be the technical lead of an innovative project.
Develop a comprehensive understanding of industrial data by exploring its physical properties and the relationships among different data streams.
Oversee the full algorithm development cycle, spanning from initial problem definition to the deployment of production-ready feature-based AI models, SDLC starting from feature discovery that is being tracked by sensor behavior patterns.
Architect and build diverse predictive and anomaly classification models using sensor time-series and textual information.
You will gain a deep proficiency in the industrial world and the connection between datasets to generate actionable insights.
Utilize classic and cutting-edge technologies, such as Generative AI, transformers, TSFM, TGNN, deep learning, and traditional statistical methods, time-series, and textual data to generate actionable insights.
Partner with the product team and external customers to create data-driven solutions that address real-world business needs.
Requirements:
Advanced degree (M.Sc. or Ph.D.) in Physics, Electrical Engineering, Computer Science, Mathematics, or a related quantitative field.
Over 4+ years of experience, demonstrated expertise in DSP-based methods (e.g., STFT, FFT, Hilbert, Wavelet, etc.), to extract features and anomalies from the data.
Over 2 years of professional experience in ML/AI, with a proven track record in modeling and analyzing complex time-series data.
Proven technical leadership experience in large-scale, multidisciplinary projects.
Hands-on experience working with real-world physical data and sensor signals.
High proficiency in Python for the full development lifecycle, including model deployment and performance monitoring.
Ability to independently research, architect, and implement innovative technological solutions.
Prior experience in the industrial or manufacturing sector is advantageous.
Capability to translate theoretical research into robust, scalable, and production-ready systems.
Experience thriving in agile environments with a focus on rapid iteration, continuous feedback, and professional growth.
Excellent communication skills for collaborating with cross-functional teams, including Product Management and Engineering.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783849
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שליחה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Engineer, Edge AI, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement groundbreaking data center.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
3 years of experience with RTL development for ASIC subsystems using Verilog.
Experience with speed interfaces such as PCIe, InfiniBand, and their low latency, security, and reliability principles.
Experience with micro architecture, design, verification, logic synthesis, and timing closure.

Preferred qualifications:
Experience with scripting languages (e.g., Python or Perl).
Knowledge of arithmetic units, bus architectures, processor design, accelerators, or memory hierarchies.
Knowledge of high performance and low power design techniques.
Knowledge of FPGA, emulation platforms, and SoC architecture.
Knowledge of assertion-based formal verification.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783582
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. This is an opportunity to create silicon and follow it into the field (and back!) to drive improvements for the next-generations of chips.
In this role, you will understand Integrated circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related field or equivalent practical experience.
8 years of experience in IC silicon quality or reliability.
Experience leading the product reliability life-cycle from post-tapeout through manufacturing.
Experience with semiconductor Complementary Metal-Oxide-Semiconductor (CMOS) technology, device physics, and failure mechanisms.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience in statistical data analysis using tools such as JMP, Python, or JSL.
Familiarity with Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) techniques.
Knowledge of Design-for-Reliability (DfR) rules and implementation techniques.
Track record with silicon reliability on process nodes and advanced packaging technologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783569
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.
Requirements:
Minimum qualifications:
Bachelor's degree in Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, automatic test equipment (ATE) program development, and post-silicon enabling from new product introduction (NPI) through high-volume manufacturing.
Experience with ASIC test methodologies (MBIST, ATPG, DFT, SerDes, and sensors).
Experience with Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Masters in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
10 years of experience in test engineering, including product engineering.
Experience with CPU/GPU SoC architecture, design, validation and debug.
Experience in advanced testing methodologies and data analysis, including system to tester correlation, yield and test time analysis and improvement, etc.
Demonstrated expertise in developing automations for pre-silicon verification and post-silicon test-generation/test-program domains.
Inquisitive and motivated to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783563
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 2 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783553
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Junior SoC IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our Platforms Infrastructure Engineering team designs and builds the
hardware and software technologies that power all of our services. Our computational challenges are complex and unique, enabled by custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concepts all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our data centers, affecting millions of users.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog), function/performance simulation debug and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power closure and ASIC silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
1 year of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with design sign off and quality tools (Lint, CDC , etc.).
Preferred qualifications:
Master's degree or PhD in Computer Science, or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced eXtensible Interface (AXI), Advanced RISC Machine (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Knowledge of SOC architecture.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783541
סגור
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סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC and IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
We're the driving team behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital reasoning design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience with reasoning synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power and design techniques.
Experience in reasoning design and debug with Design Verification (DV).
Preferred qualifications:
Experience with a scripting language like Python or Perl.
Experience with design sign-off and quality tools (e.g., Lint, clock domain crossing (CDC), etc.).
Knowledge of System on a chip (SOC) architecture and assertion-based formal verification.
Knowledge of design techniques.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate SDRAM (DDR), Advanced Extensible Interface (AXI), ARM processors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783535
סגור
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