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We are looking for a Post-Silicon Validation Engineer with strong hands-on experience in PCIe link bring-up, physical-layer debug, and silicon validation. Engineer will work closely with Design, Architecture, Firmware, Software, Engineering teams.

Key Responsibilities
Perform hands-on post-silicon validation.
Debug PCIe link issues including link training, LTSSM, equalization, recovery, resets, and link stability.
Analyze PCIe state-machine traces, protocol traces, registers, logs, eye diagrams, and lab measurements.
Drive complex issues from initial failure through root-cause analysis and final resolution.
Work closely with silicon, firmware, software, architecture, and signal-integrity engineers to isolate issues across HW/FW/SW boundaries.
Validate PCIe functionality across different generations, platforms, configurations, and operating conditions.
Develop and execute PCIe validation plans, stress tests, corner-case scenarios, and interoperability tests.
Develop automation to improve validation coverage, debug efficiency, and regression testing.

As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust

As we expand our presence in Israel, we're seeking a highly skilled Front-End CAD Engineer to join our local engineering powerhouse from the ground up.

As a Front-End CAD Engineer, you will be the backbone of our chip design ecosystem. You wont just be using tools; youll be architecting the methodologies, automation scripts, and design flows that enable our hardware teams to push the limits of silicon performance. Your work directly impacts the productivity of the design team and the time-to-market for our next-generation processors.


Key Responsibilities
Develop, maintain, and optimize RTL generation tools, building automated IPs and SoC schemes.
Create robust applications using Python and Tcl to automate models build, regression and analysis tools and other assisting tools for all disciplines in front-end flows.
Evaluate and integrate Electronic Design Automation (EDA) tools from vendors like Cadence, Synopsys, and Mentor Graphics.
Define the methodologies of usage and integrate AI tools in this fast-growing field impacting all VLSI development flows.

As we expand our presence in Israel, we're seeking a talented Senior Emulation Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful ownership in a new site, implementing the emulation strategy for chips that power the world's largest AI clusters.

As an Senior Emulation Engineer, you will be a core technical driver of our Israel R&D center, working at the intersection of hardware and software to ensure our silicon meets extreme quality and performance targets. You will execute end-to-end emulation flows, bridge the gap between RTL and functional validation, and partner with cross-functional teams to enable seamless hardware-software integration. If you thrive on solving complex technical challenges and want to play a key role in validating cutting-edge AI infrastructure connectivity solutions, this is your opportunity.

Key Responsibilities

Emulation Flow Execution & Implementation
Execute end-to-end emulation flow from high-level model generation and RTL synthesis to complex system-level testing and silicon-accurate debugging.
Work directly with next-generation emulation platforms (Zebu, Palladium, or Veloce) to implement cutting-edge methodologies.
Maintain and evolve emulation flows to reduce compile times and increase execution speed, directly impacting time-to-market.

System-Level Debug & Validation
Drive initial model bring-up process in high-stakes environment, identifying and resolving complex bugs.
Ensure rapid cycles from RTL to functional stability through systematic debug approaches.
Own technical blocks and drive them to completion independently.

Cross-Functional Collaboration
Partner with Firmware, Software, and Validation teams to debug complex system-level scenarios.
Ensure seamless hardware-software integration for AI infrastructure connectivity.
Collaborate with Design and Verification teams to optimize emulation strategies.

As we expand our presence in Israel, we're seeking a talented Senior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Senior ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration

We are looking for an experienced and hands-on Lab Manager to lead Lab operations.

The Lab Manager will be responsible for the day-to-day operation, maintenance, expansion, and continuous improvement of the lab environment supporting roadmap projects.

This role requires a highly organized, hands-on individual who can manage lab facilities and infrastructure, bring up and maintain testing setups, manage equipment and inventory, coordinate procurement and vendors, and provide timely support to validation and engineering teams.

Key Responsibilities

Lab Facilities & Infrastructure
Own and manage all lab facilities, infrastructure, and day-to-day lab operations.
Build and expand new lab facilities to support current and future roadmap requirements.
Plan lab space, power, cooling, networking, safety, and equipment placement according to project requirements.
Ensure the lab is organized, safe, reliable, and ready to support engineering activities.
Equipment & Test Setup Management
Set up, bring up, configure, maintain, and troubleshoot lab equipment and hardware testing environments.
Manage servers, networking equipment, test instruments, power supplies, cooling systems, environmental chambers, and other infrastructure.
Maintain high lab availability and minimize downtime impacting schedules.
Procurement & Vendor Management
Identify equipment and infrastructure requirements based on project needs and roadmap plans.
Manage the procurement process for new lab equipment, tools, components, and consumables.
Work with suppliers and vendors to obtain quotations, evaluate options, coordinate deliveries, and resolve technical or service issues.
Evaluate equipment based on technical requirements, availability, performance, power consumption, space, and cost.
Inventory Management
Own and maintain accurate lab inventory, including test equipment, servers, cables, adapters, components, tools, and consumables.
Establish and maintain an effective system for equipment tracking, allocation, and lifecycle management.
Ensure required equipment and materials are available in advance of project execution.
Track equipment status, calibration, repairs, and end-of-life requirements.
Hands-on Lab Support.
Perform hands-on assembly, cabling, soldering, rework, and modification of hardware setups when required - advance.
Assist engineers with hardware bring-up, and lab infrastructure issues.
Troubleshoot electrical, and system-level lab issues.
Support the integration of new equipment and test setups into existing lab infrastructure.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.