לוח משרות דרושים מהנדס חשמל משרה מלאה

Requirements:
BSc in Electrical engineering or related fields.
3+ years of experience in managing complex technological projects.
Technological knowledge and experience in the cellular field.
Experience in writing requirements documents and technical specifications.
Familiarity with procurement processes.
Familiarity with GSM, UTMS, LET and MR technologies.
Familiarity with cellular procedure and protocols (primarily in the Air Interface)
Technological knowledge and experience working with measurement and analysis tools: Spectrum, Network Analyzer, Nemo, TEMS.
Technical knowledge in positioning methods DF, TDOA.
Technical knowledge and experience in the following areas.
Computer networking, protocols, Ethernet, TCP\IP, HTTP, SSL.

Requirements:
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Solid understanding of general purpose CPU micro-architecture, including load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory technologies and memory controllers.
Ability to make trade-offs between power, performance and area to meet the requirements of the product.
Hand-on experience with high power-efficient CPU on chip interconnect, coherent fabric, memory controllers.
At least 8 years experience in architecture in one of the leading CPU companies
Experience modeling microprocessors using higher-level languages, like C/C++.
DESIRED
Co-operate and communicate well with the architecture and design teams.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Minimum of 10 years of proven design experience in complex processor projects.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Software development (C, assembly).
Experience modeling microprocessors using higher-level languages, like C/C++.
Excellent verbal and written communication skills.
Co-operate and communicate well with the architecture team and other members of development team.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to US, Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills
MINIMAL REQUIREMENTS
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Ability to make trade-offs between power, performance and area appropriately to meet the requirements of the product.
Hand-on experience with high power-efficient CPU core successfully.
Understanding of CPU instruction set architecture and assembly language.
Ownership of the overall verification methodology for a CPU project.

Requirements:
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Good understanding of CPU design methodology
Excellent verbal and written communication skills.
CPU related Experience in one of the leading CPU companies or in academia.
Willing to relocate to China for extended period.
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Experience modeling microprocessors using higher-level languages, like C/C++.

Requirements:
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Ability to make trade-offs between power, performance and area appropriately to meet the requirements of the product.
Hand-on experience with high power-efficient CPU core successfully.
Understanding of CPU instruction set architecture and assembly language.
At least 20 years of experience in one of the leading CPU companies
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Software development (C, assembly).
Experience modeling microprocessors using higher-level languages, like C/C++.
Excellent verbal and written communication skills.
QUALIFICATIONS
Co-operate and communicate well with the architecture team and other members of development team.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Good understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store units, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory controller.
Good understanding of high speed digital VLSI design flow and methodology
Understanding of trade-offs between power, performance and area appropriately to meet the requirements of the product.
At least 6 years of experience in one of the leading CPU companies
Familiarity with the ARM\IA architecture and the micro-architecture for current ARM\IA CPU cores.
Software development (C, assembly).
Hands on experience as a Front end ASIC designer
DESIRED
Co-operate and communicate well with the architecture team and other members of the development.
Excellent verbal and written communication skills.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
MSc or BSc in computer science/EE or area related to computer architecture, or equivalent research experience in industry
At least 7 years of relevant research and development experience in industry and academia in the following areas:
Computer architectures: instruction set architecture, microarchitecture, cache sub-system, memory sub-system, NOC, interconnect
Workload characterization and analytical model generation
System Modelling and emulation of HW.
Simulation of Software workloads and Software applications on HW simulator
Ability to provide innovation and global vision throughout the company
Excellent communication, presentation and reporting skills
Experience working with highly technical teams and communicating to non-technical partners.
Excellent oral and written English.

Requirements:
* Highly motivated, self-learning, good communication skills.
* At least 5 years of experience with PCB layout.
* At least 3 years of experience with OrCad PCB designer / Cadence Allegro.
* Experienced with constraint driven layout design and Allegro Constraint Manager.
* Familiar with controlled impedance design.
* Familiar with HV Design and grounding practices.
* Familiar with digital / analog mixed signal considerations.
* Experience with DFM considerations and DFA/DFM reports and their consequences.
* Experience in tape-out procedures, manufacturing files preparation, readme files.