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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a Post-Silicon Validation Engineer with strong hands-on experience in PCIe link bring-up, physical-layer debug, and silicon validation. Engineer will work closely with Design, Architecture, Firmware, Software, Engineering teams.

Key Responsibilities
Perform hands-on post-silicon validation
Debug PCIe link issues including link training, LTSSM, equalization, recovery, resets, and link stability.
Analyze PCIe state-machine traces, protocol traces, registers, logs, eye diagrams, and lab measurements.
Drive complex issues from initial failure through root-cause analysis and final resolution.
Work closely with silicon, firmware, software, architecture, and signal-integrity engineers to isolate issues across HW/FW/SW boundaries.
Validate PCIe functionality across different generations, platforms, configurations, and operating conditions.
Develop and execute PCIe validation plans, stress tests, corner-case scenarios, and interoperability tests.
Develop automation to improve validation coverage, debug efficiency, and regression testing.
Requirements:
Required Qualifications
BS/MS in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
5+ years of engineering experience in silicon validation, post-silicon debug, or high-speed interface development.
Strong hands-on knowledge of PCIe architecture and protocol.
Experience working with PCIe analyzers, state traces, registers, logs, eye diagrams, and/or signal-integrity measurements.
Strong problem-solving skills and ability to independently drive issues to root cause.
Experience working across hardware, firmware, and software boundaries.
Good scripting/programming skills, preferably Python
Good Linux knowledge and experience with Linux PCIe debug tools.
Strong communication and collaboration skills.

Preferred Qualifications
Experience with PCIe Gen4/Gen5/Gen6/Gen7
Hands-on experience with PCIe PHY, SerDes, equalization, lane margining, or signal integrity.
Experience with PCIe compliance and interoperability testing.
Experience debugging intermittent, marginal, thermal-sensitive, or corner-case PCIe failures.
Experience with PCIe switches, or networking/accelerator platforms.
Practical experience using AI/ML tools for engineering debug and automation.
This position is open to all candidates.
 
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8831936
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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8831923
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24/09/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.
Requirements:
Basic Qualifications
10+ years of hands-on IC BIG package design experience for high-performance semiconductor products, with full ownership from concept through tape-out.
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and experience designing complex packages (BGA, FCBGA, FCCSP).
Strong package architecture & integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership.
Deep understanding of signal, power, and thermal integrity at the package level, with ability to drive design tradeoffs based on analysis.
Proven manufacturing and release experience, including DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs.

Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces.
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.).
Experience supporting chiplet-based architectures and heterogeneous integration.
Prior technical leadership or package ownership on high-volume products.
This position is open to all candidates.
 
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23/09/2026
Location: Haifa
Job Type: Full Time
We are looking for a Seinor Logic Design Engineer to join the ride as we spearhead the next revolution in electronics!.

Our Logic Design team builds the on-chip monitoring IP at the heart of the product - digital blocks that ship inside some of the most advanced chips in the industry. Were growing the team and looking for a Logic Design Engineer to take ownership of that logic, working alongside circuit, verification, physical design, EDA, and AE engineers. A strong fit if you enjoy hard digital design problems in a collaborative, technically demanding environment.

Responsibilities
Define and implement digital logic micro-architecture - in plain English, diagrams, and SystemVerilog.
Verify design quality against industry standards using static analysis tools (Lint, CDC, RDC).
Work with Circuit Engineers to turn low-level circuit designs into the well-behaved, insightful agents at the core of the solution.
Work with Verification Engineers to simulate and debug the digital logic.
Work with Physical Design Engineers to ensure correct implementation of our special circuits.
Requirements:
Requirements:
B.Sc. or M.Sc. in Electrical or Computer Engineering.
5+ years as a VLSI front-end engineer (logic/ASIC/chip design) or in a similar domain.
Strong background in RTL design, handoff methodologies, and signoff tools (Lint, CDC, RDC).
Close familiarity with python, Git, Unix-like environment - an advantage.
Experience with low-power design techniques (clock gating, power domains, DVFS) - an advantage.
Knowledge of DFT design and flows - an advantage.

Personal skills:
Self-driven - takes a task from definition to signoff, pulling in whoever is needed along the way.
Detail-oriented, with a sharp eye for issues others miss.
A clear communicator who can convey technical tradeoffs to cross-functional teams.
Curious about new design techniques and methodologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8831015
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
23/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a C++ Senior Software Engineer to join the ride as we spearhead the next revolution in electronics!

Responsibilities
Design and implement multi-architecture and cross-platform software solutions in C++ for Linux and Windows OS.
Maintain software application interfaces in Java, Python, and C#.
Contribute to the full life-cycle development, integration, and deployment of software solutions in advanced testing equipment.
Collaborate within a multidisciplinary team environment across scientific and engineering disciplines.
Conduct code reviews to enhance software engineering quality.
Requirements:
Requirements
Bachelors degree in Electrical, Computer, or Software Engineering, or Computer Science.
7+ years of experience in software design and development in C++11/14/17 for edge devices / host machines.
Experience with build systems, scripts, and tools (e.g., CMake, Bash Scripts, Docker, GitHub Actions).
Strong foundation in programming: data structures, algorithms, version control, performance, and testing.
Attention to coding standards, including formatting, conventions, and documentation.
Excellent team player with strong communication skills.

Preferred Qualifications:
Familiarity with multiple programming languages, such as Python, Java, and C#.
Knowledge of SQLite3 for database management.
Experience working closely with customers on software integration and debugging.
Past experience as a post-silicon test engineer working with Advantest or Teradyne automated test equipment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8830582
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