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30/07/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
Were looking for a IT infrastructure engineer to troubleshoot and solve data center IT hardware issues, process the RMA. This is a position for a technical expert working at the intersection of multiple technical and operational domains.

Your responsibilities will include
Solve the most challenging firmware and hardware related issues with servers, involving in-depth knowledge of system architecture and advanced troubleshooting

Execute workarounds and solutions for IT hardware issues

Act as a subject matter expert and point of escalation for L1 and L2 technicians

Create new processes and documentation for IT hardware team

Collaborate with related departments to im

Collaborate with vendors on warranty replacements (RMA), create requests and manage.

Improve support processes, documentation and training materials
Requirements:
Requirements
Knowledge of datacenters, and server equipment

Deep knowledge of IT hardware and practical experience of troubleshooting

Skills working with the Unix/linux operating system and command line

Experience with equipment monitoring, data analysis and presentation

Proactiveness and sense of responsibility

High proficiency in spoken and written English
This position is open to all candidates.
 
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8761623
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30/07/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
Were looking for a IT infrastructure engineer to troubleshoot and solve data center IT hardware issues, process the RMA. This is a position for a technical expert working at the intersection of multiple technical and operational domains.

Your responsibilities will include
Solve the most challenging firmware and hardware related issues with servers, involving in-depth knowledge of system architecture and advanced troubleshooting

Execute workarounds and solutions for IT hardware issues

Act as a subject matter expert and point of escalation for L1 and L2 technicians

Create new processes and documentation for IT hardware team

Collaborate with related departments to im

Collaborate with vendors on warranty replacements (RMA), create requests and manage.

Improve support processes, documentation and training materials
Requirements:
Requirements
Knowledge of datacenters, and server equipment

Deep knowledge of IT hardware and practical experience of troubleshooting

Skills working with the Unix/linux operating system and command line

Experience with equipment monitoring, data analysis and presentation

Proactiveness and sense of responsibility

High proficiency in spoken and written English
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8761617
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09/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, We are looking for a Physical Design CAD Engineer with at least 3 years of hands-on experience in digital implementation flows. The ideal candidate is highly technical, curious, and eager to drive innovation by combining strong physical design knowledge with modern automation and GenAI-based methodologies.
This is a unique opportunity to take on meaningful technical ownership in a new site, implementing the parasitic extraction (PEX) methodologies and flows for chips that power the world's largest AI clusters. As a foundational member of the team, you will be responsible for the accuracy and efficiency of our extraction environment, ensuring that our high-speed designs are modeled with the highest precision from RTL to GDSII.
Key Responsibilities
The Engineer will develop, maintain, and improve CAD flows and methodologies for physical design teams, supporting advanced implementation stages from synthesis through place and route, timing closure, power optimization, and signoff readiness.
Key responsibilities include:
Develop and support physical design CAD flows using industry-standard EDA tools
Build automation infrastructure for implementation, analysis, reporting, and debug
Support design teams in areas such as synthesis, floorplanning, placement, CTS, routing, timing, power, and physical verification
Create scripts and utilities to improve productivity, quality of results, and flow robustness
Support and enhance flows based on Synopsys Fusion Compiler
Explore and integrate GenAI solutions to accelerate debug, automate repetitive tasks, improve reporting, and enhance engineering productivity
Analyze tool results, logs, QoR metrics, timing reports, congestion, utilization, power, and design-rule issues.
Requirements:
At least 3 years of experience in Physical Design, CAD, or implementation methodology
Strong understanding of digital physical design concepts, including synthesis, placement, CTS, routing, timing closure, and physical verification
Hands-on experience with Synopsys Fusion Compiler
Experience with scripting languages such as Tcl, Python
Ability to develop automation around EDA tools and large-scale design flows
Good understanding of timing, power, congestion, floorplanning, and QoR analysis
Strong debugging and problem-solving skills
Ability to work closely with multiple engineering teams and support complex design environments
High motivation to learn and apply GenAI technologies in semiconductor design flows.
Preferred Experience
Experience with additional tools such as PrimeTime, StarRC, ICC2, Innovus, Voltus, RedHawk, Calibre, or similar
Knowledge of STA, low-power design, UPF, EM/IR, extraction, or signoff flows
Experience building dashboards, regression systems, flow checkers, or automated report analyzers
Familiarity with LLMs, prompt engineering, AI agents, or GenAI-based coding/debug tools
Experience with Git, CI/CD, databases, or cloud-based compute environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8773828
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC DFT Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design for Test (DFT) Engineer, you will be responsible for defining, implementing, and deploying advanced DFT methodologies for digital or mixed-signal chips. You will define silicon test strategies, DFT architecture, and create DFT specifications for next generation SoCs. You will design and verify the DFT logic and prepare for post silicon and co-work/debug with test engineers.
Responsibilities
Develop DFT strategy and architecture (e.g., Memory Built-In Self Test (MBIST), Automatic Test Pattern Generation (ATPG), hierarchical DFT).
Complete all Test Design Rule Checks (TDRC) and design changes to fix TDRC violations to achieve high-test quality.
Insert DFT logic, boundary scan, scan chains, DFT Compression, Logic Built-In Self Test, Test Access Point (TAP) controller, clock control block, and other DFT IP blocks.
Insert MBIST logic including test collar around memories, MBIST controllers, eFuse logic, and connect to core and TAP interfaces.
Document DFT architecture, test sequences, and boot-up sequences associated with test pins.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related field, or equivalent practical experience.
4 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with ASIC DFT synthesis, simulation, and verification flow.
Experience in DFT specification, definition, architecture, and insertion.
Preferred qualifications:
Master's degree in Electrical Engineering, or a related field.
Experience working with ATE engineers (e.g., silicon bring-up, patterns generation, debug, validation on automatic test equipment, debug of silicon issues).
Experience in IP integration (e.g., memories, test controllers, Test Access Point (TAP), and Memory Built-In Self Test (MBIST)).
Experience in SoC cycles, silicon bringup, and silicon debug activities.
Experience in fault modeling.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785692
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC and IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
We're the driving team behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block-level design document (e.g., interface protocol, block diagram, transaction flow, pipeline, etc.).
Perform Register-Transfer Level (RTL) coding (coding and debug in Verilog, SystemVerilog), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power closure activities.
Contribute to test plan and coverage analysis of the block and SoC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages, such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power, as well as low-power design techniques.
Experience with design sign-off and quality tools (e.g., Lint , CDC , etc.).
Experience with SoC or IP architecture.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
Knowledge of high-performance and low-power design techniques, assertion-based formal verification, Field-programmable Gate Array (FPGA) and emulation platforms, and SoC architecture.
Knowledge in one of the following areas such as Double Data Rate (DDR)/Low Power Double Data Rate (LPDDR), High-bandwidth memory (HBM).
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8783519
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required SoC Test Engineer Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and Outsourced Semiconductor Assembly and Tests (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You'll help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will need to have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in product engineering or test engineering.
3 years of experience in people management, developing employees.
Experience with product engineering, supply chain data analytics or diagnostics for manufacturing or New Product Introduction (NPI).
Preferred qualifications:
Experience with industry standards, design tools, and DFT best practices, including at-speed TDF, ATPG, MBIST, Memory Repair, diagnostic tools, yield improvement.
Experience with product engineering, supply chain data analytics and diagnostics for High Volume Manufacturing and NPI.
Experience evaluating customer returns with ATE and SLT, identifying coverage gaps, developing incremental structural and functional patterns to address quality issues, Statistical analysis (e.g., JMP), Yield Management Systems (e.g., Exensio, YieldExplorer, JMP), and Python for data analytics.
Understanding of skew lot definition, data collection, characterization, data analysis and report.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785661
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
3 ימים
Location: Rosh Haayin
Job Type: Full Time
The wireless system engineer is a key position in a multidisciplinary R&D organization and acts as a technical lead for all matters related to wireless system design in new and existing products.
In this role you will be part of a dynamic team responsible for defining the architecture of a product, targeted to the Wireless Backhaul Market for 5G deployments.
Understand and analyze customer needs and market trends.
Define hardware, firmware and software requirements while supporting other R&D and Engineering teams, during all project phases.
Support field trials, customer challenges and production processes.
Requirements:
B.Sc in Electrical Engineering.
At least 4 years of experience with system design - concept to complete product of telecommunication systems.
Understanding of digital signal processing and Modem - A must.
Experience in defining and working with RF systems - A must.
Experience in defining SW & HW requirements and supporting design teams - A must
Good inter-personal skills and teamwork, ability to work in a multi-tasking and dynamic environment.
Experience with multidisciplinary products.
Self-learner. Ability to learn and lead new subjects from scratch.
Ability to guide and support others.
Creative, innovative and open to absorb and share knowledge and ideas.
Customer oriented.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8796580
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09/08/2026
Location: Merkaz
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our company products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.
This position is open to all candidates.
 
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8773916
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff RTL IP/Component Design Engineer, Cloud
About the job
In this role, you will contribute in all phases of complex application-specific integrated circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis and etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next-generation of our platforms, we make product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Define the block level design document such as interface protocol, block diagram, transaction flow and pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, and VHDL), function/performance simulation debug and Lint/CDC/FV/UPF checks.
Support synthesis, timing/power closure, and Field Programmable Gate Array (FPGA)/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
Experience with ASIC design verification, synthesis, timing/power analysis, and Design for Testing (DFT).
Experience in ASIC development with Verilog/SystemVerilog, VHDL or Chisel.
Experience with System on a Chip (SoC) development cycles.
Preferred qualifications:
Proficiency with a scripting language (e.g., Python or Perl).
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Knowledge of FPGA and emulation platforms.
Knowledge of SOC architecture.
Knowledge in one of these areas: arithmetic units, bus architectures, processor design, accelerators or memory hierarchies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8786943
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03/08/2026
Location: Herzliya
Job Type: Full Time
SolarEdge (NASDAQ: SEDG) is a global leader in high-performance smart energy technology, with over 3000 employees, offices in 34 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and with a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and just about everywhere we thrive. We are looking for an experienced PCB Layout Designer to join our Layout Design team within the SolarEdge Hardware division. The Layout Design team is responsible for the layout of all core Hardware products, including High-Voltage power boards, optimizers, communication circuits, and complex battery management systems (BMS). This is a highly challenging role where you will work in a dynamic, fast-paced environment, handling multiple priority projects under tight schedules while working closely with Hardware, Q&R, and Mechanical engineers. What you will do:
* Design and develop multi-layer PCB layouts from concept to production, including placement, routing, and final manufacturing outputs.
* Translate schematics into optimized layouts considering Signal Integrity (SI), Power Integrity (PI), EMI/EMC mitigation, thermal, and manufacturability constraints.
* Work in a Cadence Allegro and OrCAD Capture environment, including the use of parallel layout tools like Symphony to accelerate delivery.
* Collaborate closely with Mechanical engineers (handling 3D IDF/IDX transfers), R&D teams, and Reliability (Q&R) teams to meet strict mechanical constraints.
* Strictly adhere to our internal "Design Considerations" guidelines and the team's layout "Cookbook" methodologies to ensure standardized execution.

Country:
Israel

City:
Herzliya
Requirements:
* At least 3 years of hands-on experience with complex PCB layout.
* High proficiency with OrCAD PCB Designer / Cadence Allegro.
* Deep experience with constraint-driven layout design and Allegro Constraint Manager.
* Proven experience with High-Voltage (HV) design, heavy copper routing, and advanced grounding/net-spacing practices.
* Strong understanding of Signal Integrity (SI), Power Integrity (PI), high-speed routing, and mixed-signal (digital/analog) considerations.
* Deep knowledge of DFM/DFA/DFT considerations, including ICT/ATE test point placement, thermal reliefs, and manufacturing limitations such as wave, laser, and robotic soldering.
* Experience in tape-out procedures, generating ODB++/Gerber files, and preparing complete manufacturing packages.
* Highly motivated, self-learning, with excellent communication skills to thrive in a cross-functional team.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
8701139
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16/07/2026
Location: Yagur
Job Type: Full Time
Smart Shooter is seeking a highly skilled Computer Vision & Image Processing Engineer to join our innovative team in developing cutting-edge technology solutions. In this role, you will design, develop, and implement cutting-edge image processing and computer vision algorithms. You will work on complex, real-world visual tasks, taking algorithms from theoretical concepts to production-grade deployment on cutting-edge systems.
?About Smart Shooter Smart Shooter is a world-class designer, developer, and manufacturer of innovative Fire Control Systems that significantly increase the accuracy and lethality of small arms. With a rich record in designing unique solutions for the warfighter, Smart-Shooter’s technology enhances mission effectiveness through the ability to accurately engage and eliminate ground, aerial, static or moving targets during day and night operations.
Key Responsibilities
* Research, design, and develop innovative computer vision and image processing algorithms.
* Implement and train Deep Learning models tailored for challenging visual tasks.
* Optimize algorithms and write scalable, clean, and efficient production code.
* Collaborate closely with hardware, software, and systems engineering teams to deliver end-to-end solutions.
Requirements:
Requirements Education & Experience: M.Sc. or Ph.D. in Computer Science, Electrical Engineering, or a related field—with a distinct specialization in Computer Vision or Pattern Recognition. At least 3 years of proven industry experience developing algorithms in the fields of Image Processing and Computer Vision. Technical Skills:
* In-depth knowledge and hands-on experience in classic Image Processing & Computer Vision methods.
* Strong familiarity with Deep Learning frameworks and solutions for complex visual tasks.
* Extensive, hands-on experience in C and C++ programming for large-scale applications.
Advantages (Nice to Have)
* Experience implementing and deploying algorithms on low-power, Real-Time (RT) Embedded systems.
* Practical knowledge and programming experience in Python
* Practical knowledge and experience in Matlab
This position is open to all candidates.
 
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Location: Haifa
Job Type: Full Time
Our Automated Driving group in Haifa is looking for an experienced DFT Engineer.
This is an exciting opportunity to join a team of highly talented engineers, working on one of the most cutting edge technologies - Autonomous Vehicle (AV) SoC.
We know that the idea of a fully autonomous car is no longer science fiction, but a reality that we are creating!
We have spent more than 15 years developing the world's most Advanced Driver Assistance Systems (ADAS) and we are now leading the computer vision and machine learning domain, reaching fully automated driving experience (AV).
What will your job look like:
Develop all the necessary HW / FW / SW for the different modules
Verify and Validate our design
Debug and analyze coverage and yield loss
As a cutting edge technology company, we are working only with the very advanced DFT tools and features, while developing our own methods and DFT concepts - as it required by the Automotive and Safety related products market (ISO26262).
Requirements:
At least 5 years of experience in the ASIC/SoC industry
Excellent communication skills
BSc or MSc in Computer Engineering or Electrical Engineering
The following knowledge/experience will serve as a big advantage for candidates
Proven Experience in either SCAN or MBIST tools and flows
Knowledge of Hierarchical SCAN methodology
Knowledge of Logic BIST (LBIST) and Test Point Insertion (TPI) flows
Knowledge of TAP protocols IEEE 1149.1/1500/1687 (iJTAG)
Knowledge of Synthesis flows.
This position is open to all candidates.
 
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Location: Petah Tikva
Job Type: Full Time
Our Imaging Radar group develops innovative high-performance Imaging Radar solutions for ADAS and Autonomous Driving markets. We are looking for a Software Architect to join the development of state-of-the-art products in mmW frequencies.
You will be part of a winning team in a fast-paced startup-like environment, working on many different components of the entire system. You will have an opportunity to make an impact on the design and implementation of an innovative technology in its early stages.
What will your job look like:
Clearly define the requirements. Research the hardware, firmware, and software existing support and define the solution to match the requirements.
Hands-on resolution of complex issues
Resolve issues raised during implementation stages or feedback from customers.
Develop & communicate high-level designs and technical specifications
Define responsibilities of system components and interfaces
Identify risks and propose solutions in system designs
Define aspects of development; appropriate technology, workflow and standards
Evaluate existing system designs and propose improvements
Collaborate with other architects
Foster innovation through research, recommending the use of new technologies, processes or standards
Prepare, lead and participate in design reviews
Take part in all phases of the software development cycle
Requirements:
B.Sc/ M.Sc in Computer Engineering, Computer Science or Electrical Engineering.
At least 5 years of experience as a Software Architect \Senior Developer \Software Team Lead - Must
Experience developing software for complex embedded products in c\c++ - Must
Team player with a positive attitude and a cooperative mindset
Deep understanding of technology and passion for what you do.
This position is open to all candidates.
 
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09/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Formal Verification Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the formal verification strategy for chips that power the world's largest AI clusters.
As the Formal Verification Engineer, you will be a foundational member of our Israel R&D center. You wont just execute tasks; you will define the Formal verification strategy for chips that drive the worlds largest AI clusters. You will dive deep into the technical details, proving the correctness of complex designs and ensuring they flawlessly meet specifications.
Key Responsibilities
Own and develop formal verification environments from scratch through to sign-off
Apply formal verification methodologies and strategies to prove the correctness of intricate designs
Work closely with the Architecture, Design, and DV teams to identify verification needs and pinpoint design requirements
Create robust formal environments, analyze complex RTL designs, and apply advanced formal techniques to find corner-case bugs
Analyze verification results, identify failures, and collaborate directly with designers to resolve issues efficiently
Architect and develop generic, common formal functions and properties to be reused across multiple projects.
Requirements:
Bachelor's degree in Electrical Engineering or a related technical field
4+ years of hands-on experience in Formal Verification within semiconductor companies
Deep expertise in formal verification methodologies, tools, and flows
Strong understanding of RTL design and verification principles
Experience with industry-standard formal verification tools (Jasper, VC Formal, or similar)
Excellent communication skills, strong analytical thinking, and a proactive, "can-do" approach to problem-solving
Preferred Qualifications
Track record of successfully taking complex blocks or subsystems through the entire formal verification lifecycle
Experience with SystemVerilog UVM-based design verification
Knowledge of networking standards (Ethernet, NVLink, UALink, PCIe)
Background in high-speed serial interface verification.
This position is open to all candidates.
 
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Location: Herzliya
Job Type: Full Time
As a member of our CAD team, you will architect, develop, maintain and improve physical design verification (PDV) flows. The role requires you to work on flow and run-set development for various technology nodes and tool sets. Working alongside the CAD team, you will be collaborating with the custom digital/analog/mixed-signal design, physical design (PD) and chip integration teams. You will need to have a deep understanding of design rule checks (DRC) and layout versus schematic (LVS) runsets, writing from scratch and/or modify existing ones. Also, you should have worked with Dummy Metal Fill generation and Design for Manufacturability (DFM) rules at different technologies.
Responsibilities
Develop, improve and maintain all aspects of physical verification flow and methodology
Coordinate the effort of validating flows, improving for custom checks and data generation
Work with the design and PD teams to facilitate the chip design process
Code custom PDV rule decks such as Electrical rule checks (ERC) and Programmable ERCs
Collaborate with tool vendors and foundries for PDK performance enhancements
Requirements:
Educatio: Minimum requirement of BS + 8 years of relevant industry experience
Key qualifications
Requires experience in Silicon chip design flows, including place-and-route (PnR) implementation flows
Expertise in Calibre/ICV runset coding for DRC/LVS/ERC/MFILL is required. Rule coding in PERC is a plus
Tapeout support and SoC chip-level PDV debug experience in various technology nodes is desirable
Hands-on experience with PnR tools and physical implementation flow is preferred
Knowledge/scripting in programming languages such as Perl, Python, Tcl, Shell, Makefile and/or C++
Deep understanding of Silicon technology and experience with flow development in advanced nodes
This position is open to all candidates.
 
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