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3 ימים
Location: Yokne`am
Job Type: Full Time
Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.

What you'll be doing:

You own silicon bring-up schedule from power on to production release.

Negotiate silicon and board demand with teams and drive a bottom-up forecast.

Oversee and manage chip and board allocations across the company.

Lead prototype chip delivery to internal customers.

Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase.

Identify and mitigate risks to schedules and programs.

Communicate status to cross-functional teams as well as upper management.

Continuously evaluate internal tools and processes and drive fixes to improve productivity.

Create new and fix existing processes between different teams.

Drive implementation of SW tools for data analytics and process evaluation.
Requirements:
What we need to see:

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.

At least 5 years of relevant experience.

Proven experience in engineering roles, with a significant portion focused on semiconductors industry.

Strong background in planning methodologies.

Excellent communication, interpersonal, and leadership skills to effectively collaborate with internal teams.

Ability to travel internationally to supplier sites as needed.

Ways to stand out from the crowd:

Deep understanding of ASIC Technology and Productization requirements.

Strong verbal and written communication skills, and the ability to coordinate with multiple technical and business teams.

Self-directed and driven, highly motivated, creative, and have a consistent record of handling multiple tasks at any given time.

Have the ability to work independently and follow complex procedures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 10 שעות
Location: More than one
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
You will be responsible for complex physical design unit designs, ensuring integration within our innovative builds.
We expect you to run, debug, and approve PnR and verification flows across multiple projects, ensuring strict adherence to our high standards.
You will perform physical design implementation, planning and optimization, contributing to the development of our groundbreaking chips.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering
You should have at least 5+ years of hands-on Physical Design 'Place and Route' experience, demonstrating your proven expertise.
A strong background in Physical Design methodology, including Synthesis, Floorplan, CTS and Routing, is necessary.
Sign-off stages experince such as , 'STA', 'PV', 'LEC' and 'EMIR'.
In-depth knowledge of advanced silicon process technologies.
Familiarity with physical build EDA tools, including Synopsys and Cadence.
A great teammate who thrives in a collaborative environment.
AI tools orientation or alternatively a desire to learn.

Ways to stand out from the crowd:
AI prompting experience.
Experience in Linux environments.
TCL, Python, shell scripting abilities.
Experience with data collection and analysis.
Understanding of the chip and die verification process.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8586970
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Location: Tel Aviv-Yafo
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
our companys data centers are the most advanced in the world. Developing and deploying comprehensive manufacturing test and data analytics solutions for volume manufacturing at wafer fabs and OSATs. In this role, you will help to manufacture the SoCs that power these data centers. You will create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. To assure performance and screen devices, you will help to integrate SoC technologies into devices and drive manufacturing test flows. You will drive yield improvement, cost optimization and work closely with cross functional teams to ensure the optimal test coverage in production to ensure SoCs. An understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis is expected. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics, you will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design, and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies, as well as manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop ATE test modules, DC tests, binning, production, and characterization flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Develop tools, flows, and methodologies to continuously improve and automate the testing life cycle.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field, or equivalent practical experience.
5 years of experience in test engineering.
Experience in pre-silicon validation, test content generation, ATE program development, and post-silicon enabling from New Product Introduction through High Volume Manufacturing.
Experience with ASIC test methodologies (e.g., mbist, atpg, dft serdes, sensors).
Experience in automating test generation, validation, and analysis solution.
Experience in Python, Java, C# or C/C++ and Advantest or Teradyne ATE platforms.
Preferred qualifications:
Experience in creating end-to-end manufacturing test strategies for PCBA and systems that cover structural through functional and system tests.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544163
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you will manage the complex supply chain and logistics network that brings the silicon powering these data centers to life. You will own the planning strategy for new product introduction, bridging the critical gap between initial silicon development and mass production. This is an opportunity to orchestrate a global material flow that enables the creation of cutting-edge technology.
As a part of the role you will manage engineering labs capacity and inventory. It includes chips and hardware. You'll ensure our engineering teams have the components and materials they need to succeed, exactly when they need them. You will drive operational excellence, optimize inventory utilization, and work closely with cross-functional teams and external vendors to maintain a seamless flow of chips and hardware.
In addition, you will work with various groups to deploy best practices for material tracking and allocation. You will drive the readiness of the supply chain to meet mass production ramp requirements.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive end-to-end NPI build schedules, coordinating across product, operations, and external suppliers to ensure material readiness aligns perfectly with engineering timelines.
Manage complex supply chain logistics, working directly with vendors, foundries and OSATs to secure critical components, resolve shortages, and mitigate risks before they impact the launch.
Collaborate with cross-functional teams to translate engineering requirements into actionable supply capacity plans, anticipating demand changes and adjusting forecasts dynamically.
Create infrastructure for execution, establishing a reporting status, allocation metrics, and tracking tools to ensure process transparency and efficiency.
Execute global shipment operations, coordinating the movement of materials to and from vendors and between engineering teams, ensuring import/export compliance and on-time delivery.
Requirements:
Minimum qualifications:
Bachelors degree in Industrial Engineering, Logistics, or equivalent practical experience.
2 years of experience in NPI supply chain management in semiconductors industry.
Experience in managing Silicon NPI build schedules and material readiness, with a focus on product development requirements and samples milestones.
Experience working with Foundries, OSATs, and coordinating supply chains around the globe.
Experience working in a multinational corporate environment.
Experience with global logistics operations, including import/export compliance, customs clearance, and managing shipments between vendors and engineering teams.
Preferred qualifications:
Experience in managing complex logistics in a corporate high-velocity environment, including crisis management and rapid problem-solving.
Experience in working with cross-functional stakeholders and with external vendors.
Experience with data analysis and visualization tools to create dashboards and drive data-backed decision-making.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8545344
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Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time and Hybrid work
Join the Front-End Design team, at the core of our development. Our engineers cover the full spectrum of chip design: definition, architecture, micro-architecture, RTL design, verification, signoff, and validation.
We leverage cutting-edge silicon technologies and methodologies to develop the largest-scale and most advanced devices, pushing the boundaries of whats possible.
We are transforming the industry with a unified, programmable architecture powering our future routing portfolio and shaping the Internet for decades to come.

Your Impact:

Review micro-architecture specifications.

Implement Verification environment UVM based.

Collaborate with Design engineers to resolve bugs and achieve coverage closure.

Work with the firmware/Lab teams to verify chip flows.

Perform debug, root-cause analysis, and post-silicon validation in the lab.
Requirements:
Minimum Qualifications:

B.Sc./M.Sc. in Electrical Engineering from a top university.

3+ years of experience in the filed.

knowledge with UVM and functional verification methodologies.


Preferred Qualifications:

Experience with MATLAB simulations and bit-exact modeling environments.

Familiarity with mixed-signal systems and environments.

Knowledge and hands-on experience with Clock Domain Crossing (CDC).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8545673
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4 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.

Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.

Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.

Taking part inflows development.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience.

Knowledge in physical design flows and methodologies (PNR, STA, physical verification).

Deep understanding of all aspects of Physical construction and Integration.

Knowledge in Physical Design Verification methodology LVS/DRC.

Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).

Great teammate.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8583558
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4 ימים
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a creative and experienced Senior Firmware Engineer to join our PCIe Firmware team-someone passionate about using artificial intelligence to engineer the foundational hardware of the AI revolution.

As an integral part of our team, you'll architect and implement the core of our next-generation devices. This senior role places you at the center of innovation, where you will have a direct impact on our business and technology by solving sophisticated technical challenges. Its a unique opportunity to shape our technology and empower customers to build the supercomputers and AI fabrics of tomorrow.

What You'll Be Doing:

Lead the architectural design, development, and optimization of cutting-edge PCIe firmware, using AI-driven modeling and insights to deliver exceptional performance.

Serve as a trusted technical expert by investigating, debugging, and resolving challenging PCIe firmware issues for our most important customers.

Collaborate closely with our Chip Design, Verification, Software, and Architecture engineers to find root causes and develop robust, long-term solutions.

Champion the integration of AI-assisted diagnostics and generative AI tools across the entire development lifecycle to boost team productivity and innovation.

Translate customer needs and field data into actionable feedback that directly shapes the future of our products.
Requirements:
What We Need to See:

A degree in Electrical Engineering, Computer Science, Computer Engineering, or equivalent practical experience.

8+ years of significant professional experience in embedded firmware development, with a deep understanding of PCIe.

A strong foundation in computer architecture, operating systems, and object-oriented programming.

Proficiency in scripting languages like Python to automate tasks and workflows.

An innovative approach with a genuine desire to apply AI and machine learning to accelerate firmware development.

Ways to Stand Out from the Crowd:

Track record of applying AI-powered tools like Cursor to accelerate the development lifecycle.

Previous experience in a customer-facing or application engineering role.

Direct, hands-on experience with PCIe switch architecture and its firmware in high-performance applications.

Deep knowledge of hardware verification concepts and tools (e.g., C++, Python, Jenkins).

Extensive knowledge of networking protocols and the Linux operating system.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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11/02/2026
Location: Yokne`am
Job Type: Full Time
We are looking for talented and ambitious individuals to join our Yoqneam IC team.
Roles and responsibilities:
Join a team of VLSI frontend design engineers in Chain-Reactions projects.
Define, plan and implement our next chip in Chain-Reactions on-going product line and in a new product line of cryptography algorithms acceleration SoCs.
Work closely with multiple teams within organizations such as Architecture, BE, Circuit, Analog and FW
Responsible for scaling up the frontend design environment methodologies.
Requirements:
BSc or MSc in Electrical Engineering or Computer Engineering
8+ years of VLSI experience.
Experience with multi clock domain, multi power domain designs (UPF).
Methodologic approach.
Strong Motivated to learn quickly, hard-working, and is results-oriented.
Great interpersonal relations skills.
Preferred
Networking design experience - Major Advantage
Backend experience: STA tools, formal equivalence tools, frontend/backend handoff methodologies.
SoC design/Integration experience.
Proven Methodologies and Environmental Building Experience.
Strong proficiency in scripting language, such as, Perl, Tcl, Python, Make, and automation methods/algorithms.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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02/03/2026
Location: Yokne`am
Job Type: Full Time
We are looking for an experienced, forward-thinking, focused, analytical, and motivated Engineer to take ownership for the NPI and suppliers management in order to meet company targets. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which NV products acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. Youll be immersed in a diverse, supportive environment where everyone is encouraged to do their best work. Come join the team and see how you can make a lasting impact on the world.

What you'll be doing:

The NPI engineer will work alongside with R&D BU, finance, engineering and various multi-functional teams, leading NPI products from am operational perspective.
Work with our partners worldwide to establish a supply chain incorporating business, manufacturing, technology, Engineering, quality, and additional aspects to assure design acceptance and manufacturability
Identify critical-paths, bottlenecks and implement risk management methodologies.
Define and lead execution to ensure delivery on schedule according to SOW and budget.
Pave the way for NPI Production transition: Active participation from very early pre-design stages, highlighting needed operational related aspects while defining the infrastructure for the future transfer to production stage.
Develop an in-depth understanding of the vendors manufacturing capabilities and influence current and future product qualifications and loading decisions
Develop and implement project management methodologies and processes to improve tracking, transparency, execution, and day-to-day efficiency
Report program status to senior management.
Requirements:
What we need to see:
B.Sc. in Industrial/Electrical/Material engineering or a related field.
Strong engineering background with business and operations proficiency.
8+ years of proven experience in leading sophisticated, highly technology-intensive projects.
Sharp thinking, attention to details, and outstanding decision-making skills
Independent and proactive approach - being able to own a task but also to deep dive into the relevant details surrounding it.
Performs well in an intensive environment - Working hour flexibility (working with global parties).
Ability to manage schedule and meet deadlines.
Multitasking, good interpersonal skills and a team player.
Fluent English - reading, writing, and speaking.
Proficiency in Microsoft Office tools including Word and Excel.

Ways to stand out from the crowd:
Experience with supply chain management.
Vast Semiconductor experience and global market.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8566034
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Location: Petah Tikva
Job Type: Full Time
join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.
Requirements:
all you need is:
b.sc. or m.sc. in electrical engineering, materials science, or a related field.
3+ years of experience in semiconductor package design and assembly.
deep knowledge of package design, substrate engineering, and simulation methodologies.
hands-on experience with package layout tools such as cadence allegro package designer or xpedition package designer.
solid understanding of high-speed layout constraints (e.g., crosstalk, emi, rfi) and proven experience with interfaces like ddr, pcie, mipi, and ufs.
strong background in schematic review, capture, and system -level integration.
proficiency in scripting for automation and design optimization with tools like matlab or Python - advantage.
proficiency in layout design verification tool such as cam350- advantage.
experience working directly with osats - advantage.
proven experience with sipi simulation tools like ansys siwave, ansys hfss, cadence sigrity and siemens hyperlynx - advantage.
proven experience with thermal or thermo-mechanical simulation tools like cadence celsius, ansys icepak, ansys mechanical and flotherm - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8579216
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Location: Jerusalem
Job Type: Full Time
join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.
Requirements:
all you need is:
b.sc. or m.sc. in electrical engineering, materials science, or a related field.
3+ years of experience in semiconductor package design and assembly.
deep knowledge of package design, substrate engineering, and simulation methodologies.
hands-on experience with package layout tools such as cadence allegro package designer or xpedition package designer.
solid understanding of high-speed layout constraints (e.g., crosstalk, emi, rfi) and proven experience with interfaces like ddr, pcie, mipi, and ufs.
strong background in schematic review, capture, and system -level integration.
proficiency in scripting for automation and design optimization with tools like matlab or Python - advantage.
proficiency in layout design verification tool such as cam350- advantage.
experience working directly with osats - advantage.
proven experience with sipi simulation tools like ansys siwave, ansys hfss, cadence sigrity and siemens hyperlynx - advantage.
proven experience with thermal or thermo-mechanical simulation tools like cadence celsius, ansys icepak, ansys mechanical and flotherm - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8579212
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo
Job Type: Full Time
At Lumissil, we are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, Lumissil is the place to develop your skills, innovate, and grow your career. Why join us?
* Work on cutting-edge automotive projects
* Learn from a talented and supportive team
* Gain exposure to real-world automotive challenges
* Grow your career in a collaborative and inspiring environment If you’re ready to take the next step in your career and be part of something meaningful, we’d love to meet you! About The Position: As a Junior ASIC Design Engineer at Lumissil, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where you’ll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions
* Support and learn from real emulation platforms used in production-grade designs
* Contribute to RTL implementation and gain practical experience in design flows
* Assist with verification and backend (BE) activities, learning industry best practices
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.
Requirements:
* B.Sc. in Electrical Engineering (graduate with excellence)
* Strong interest in ASIC / chip design and hardware development
* Basic understanding of RTL design concepts – an advantage
* Any exposure to programming or scripting (e.g., Python, TCL, Perl) – an advantage
* Previous academic or practical experience in relevant fields – an advantage
* Good English communication skills, both written and verbal
* Team player with a positive attitude, curiosity, and willingness to learn
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8476259
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
our company's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets our company's standards of quality and reliability.
As a Silicon Validation Engineer at our company Cloud, you will play a pivotal role in the validation of our company's custom silicon solutions that power our cloud infrastructure bringing it to the highest quality level. With your expertise in post-silicon validation, you will be identifying and resolving issues before they impact our customers, ensuring a seamless and high-performance cloud experience.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define, develop and execute post-silicon validation content on both pre-silicon setups and real silicon platforms in the lab.
Drive silicon from being a chip towards becoming a product.
Debug and investigate issues along cross-functional teams such as Firmware, Software, Design, Design Verification, Architecture and multiple production teams.
Provide a quality functional coverage for our company designs.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
5 years of experience with functional tests for silicon validation (i.e., writing C or C++) or developing firmware, and embedded software.
5 years of experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Preferred qualifications:
Experience with CPU validation.
Experience with hardware prototyping, including hardware/software integration (i.e., pre-silicon use of emulation, software-based test, and diagnostics development).
Experience with board schematics, layout, and debug methodologies using lab equipment.
Experience in ready to launch design, verification, or emulation.
Knowledge of SoC architecture, including boot flows.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544078
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תודה על שיתוף הפעולה
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01/03/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
Required Infra Security Architect
Job Description
Lead security efforts in your domains and reflect the security posture and gaps to stakeholders
Define and execute annual roadmaps to mitigate security risks and design secure architectures in diverse business units
Review and assess newer complex environments, discovering security gaps and creating security control in the form of policies and other mitigations
Develop best practices and security standards for the organization
Carry out proof of concepts for the latest security tools based on security needs and your own research
Work closely with DevOps team and development teams.
Requirements:
5+ years of practical experience in leading complex cybersecurity projects and procedures using the latest security technology
Proficient in working with multiple cloud vendors (e.g., AWS, GCP, Azure) and knowledgeable about industry-leading security practices for configuration management in areas such as IAM, VPC, VMs, and more
Demonstrate expertise in deploying security measures within containerized environments, such as native Docker and managed Kubernetes platforms (e.g., Amazon EKS, Google GKE, Azure AKS)
Thorough understanding of network security architecture, as well as proficiency in utilizing security tools like zero trust network access, layer 3 and 7 firewalls, and micro-segmentation
In-depth understanding and practical experience with Infrastructure as Code (IaC) practices, tools, and frameworks (e.g., Terraform, Ansible, Puppet). Demonstrated ability to secure dynamically provisioned infrastructure.
Expertise in security domains, including but not limited to vulnerability and patch management, endpoint security, and configuration management, with a proven ability to design and implement robust security solutions across diverse environments.
Proven experience integrating security into Continuous Integration/Continuous Deployment (CI/CD) pipelines.
Ability to support an international, multi-cultural team with excellent oral and written communication skills in English and Hebrew
Exceptional at organizing methodologies and solving problems, with a deep understanding of security products and their security aspects
Self-learner with strong research capabilities and a delivery-oriented attitude.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8565138
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
01/03/2026
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
Were looking for an Sr Solutions Architect responsible for advising on Generative AI, core services and also to provide technical pre-sales guidance to strategic customers while building long-term relationships, identifying pain points, and addressing them.
📍 Work location - hybrid from Tel-Aviv
Responsibilities:
Strategic Advisory: Act as a technical and strategic advisor in the field to provide architectural guidance in the GenAI space and recommendations necessary to promote & help customers overcome technical challenges and scale securely on AWS.
Pre-Sales Architecture: Serve as a pre-sales Solutions Architect to guide customers on best practices and ensure cost optimization.
Relationship Management: Build strong connections with internal and external stakeholders, from technical teams to senior executives.
Business Growth: Collaborate with Account Executives to drive service adoption and ensure success in the long term.
Travels: locally (on-demand to meet with customers and partners and attend local events) and abroad (at least once a quarter).
Requirements:
5+ years of working experience as a Solutions Architect, DevOps, Cloud Architect, or Prototype Architect.
Experience with deploying and integrating GenAI models and applications on cloud infrastructure.
Ability to influence and engage strategic stakeholders effectively on pertinent technical matters.
Hands-on experience with an AWS environment
Experience in customer-facing roles, preferably with startups
Excellent written and verbal communication skills in both English and Hebrew
Strong organisational skills and attention to detail
Ability to effectively communicate technical design in verbal and written formats in front of customers (Project documentation and architecture diagrams)
Excellent interpersonal, critical thinking, and problem-solving skills
Share best practices and promote collaboration within the SA team
Good to have/ Advantage:
Relevant AWS certification(s): GenAI Developer Pro, ML Specialty, Generative AI Practitioner, ML Engineer
Familiarity with Infrastructure as Code tools and frameworks (Terraform, CDK, Pulumi)
Sound knowledge of machine learning fundamentals, with working knowledge of frameworks such as Pytorch, TensorFlow, JAX, or MXNet.
Knowledge of MLOps tools and workflows for model development, validation, and deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8565488
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