we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements: Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field
3+ years of hands-on experience in Physical Design at semiconductor companies
Proven expertise in the full RTL2GDS flow with deep hands-on experience in macro-level implementation, floorplanning, and complex routing
Experience working with advanced process technologies (7nm and below)
Solid experience with signoff tools and flows including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Proficiency in TCL or Python scripting to drive EDA tool flows and automate repetitive tasks
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.