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Job Type: Full Time and Hybrid work
We are looking for a Senior Verification engineer to be a significant part in developing a complex and innovative SOC chip in a start-up company.
Taking full ownership of entire domain, defining the verification strategy, writing, and executing verification plan in system Verilog UVM.
About Us:
VLSI group is responsible for the development of our next generation SOC for AI Compute.
The development starts from product definition through architecture, design, verification and up to implementation.
The complex SOC is a high-performance device running AI compute for vision and audio processing, with technologies from multi-disciplines.
Requirements:
5+ years of experience as a Verification engineer.
B.Sc./M.Sc. in Electrical/Computer Engineering from a leading university.
Strong knowledge of system Verilog and UVM methodology.
Experience in pre-silicon functional unit level/cluster/full chip verification.
Experience in verification of packet processing/Ethernet/RDMA/InfiniBand
Familiarity with SOC architecture, CPU subsystems, and multi-core designs.
Advantages
Knowledge of formal verification and emulation/FPGA prototyping.
Exposure to AI/Networking workloads and performance validation.
This position is open to all candidates.
 
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8454048
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חברה חסויה
Job Type: Full Time and Hybrid work
Our group is responsible for the development of the company next generation SOC for AI Networking Compute. The development starts from product definition through architecture, design, verification and up to implementation.

The complex SOC is a high-performance device running AI scale-out for inference workloads computer for vision and audio processing, with technologies from multi-disciplines.
In this position you will have end-to-end responsibility for all design flow. In this position you will be responsible for full cluster/block uarch, design, initial synth, lint, integrating and supporting PD, DFT and verification.

If you are curious, innovative, have strong technical skills with a hands-on approach, and understand the full design, system view and SW integration requirements, this position is for you!
Requirements:
7+ years of experience as a VLSI design engineer
B.Sc./M.Sc. degree in electrical/computer engineering from a leading university
Experience in defining uarch and design of complex design units.
SOC design experience.
full cluster/block uarch, design, inital synth, lint, integrating and supporting PD, DFT and verification.
Advantages
Experience in HW implementation of packet processing / Ethernet / Infiniband / RDMA Experience in high-speed interfaces DDR/PCIe - great advantage!
Leading VLSI teams/projects
Verification experience and knowledge with SV/UVM
CPU subsystem multi-core designs experience
Experience with Synthesis and STA analysis
This position is open to all candidates.
 
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הגשת מועמדות
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8454122
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לפני 17 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
Lead verification for advanced ASIC/FPGA designs in a top-tier R&D team developing high-performance network interface solutions and customer-focused hardware.
Location: Tel Aviv office or our Beer Sheva office, which is located next to the train station
Responsibilities:
Drive verification of complex, high-speed ASIC/FPGA designs
Define and implement advanced verification methodologies
Collaborate with architecture, software, and validation teams
Mentor engineers and promote technical excellence
Work with technologies like high-speed interfaces, network processors, and SoCs.
Requirements:
B.Sc. in Computer Science or Electrical Engineering
7+ years of hands-on verification experience
Proven end-to-end ASIC flow experience (design to tapeout)
Strong teamwork and communication skills
Advantage:
Leadership or technical management experience
Ability to guide teams toward successful delivery
Bonus Skills:
Python/Bash scripting
SoC integration
Formal verification
Palladium, GLS.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8462050
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3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We operate in true startup mode: fast-paced, ambitious, and deeply technical. The project is challenging across architecture, RTL, verification, and schedule and we are looking for a Senior Design Engineer who wants to push boundaries, work hard, and help build something that has never been done before.

The Senior Design Engineer will join a team responsible for the architecture, design, and verification of a high-performance controller ASIC at the core of this new computational paradigm.

Your Day to Day
Own the design, micro-architecture, and implementation of digital logic for a high-performance ASIC
Translate system-level requirements into detailed micro-architecture and RTL designs
Develop high-quality RTL code in Verilog/SystemVerilog
Work closely with the algorithm, verification, analog, and software teams to define interfaces and ensure end-to-end functionality
Participate in design reviews, propose improvements, and ensure compliance with coding and design guidelines
Integrate and debug digital modules in simulation and lab environments
Support synthesis, timing closure, performance optimization, and power reduction activities
Collaborate with verification teams to define test plans and ensure thorough coverage
Contribute to a high-intensity startup environment where solving tough technical challenges and meeting ambitious schedules is part of the mission
Requirements:
Required:
At least 5 years of experience in digital design for ASIC.
BSc/MSc in Electrical Engineering, Computer Engineering, or related field
Strong RTL development experience in Verilog/SystemVerilog.
Solid understanding of computer architecture, logic design, and digital system fundamentals.
Experience with micro-architecture specification and documentation.
Strong communication skills and the ability to work cross-functionally.
Self-driven, detail-oriented, capable of owning complex design challenges
Fluent in English, both verbal and written.

Advantages:
Experience with high-speed SERDES or parallel interfaces (PCIe, Aurora, Ethernet PHYs, custom links, etc.).
Background in high-speed ASIC design, timing closure at high frequencies, and complex synchronization schemes across clock domains.
Familiarity with verification methodologies (UVM), simulation flows, and coverage-driven verification.
Experience with scripting languages (Python, Perl, Tcl).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
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8456457
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3 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented engineers to help us develop a semiconductor platform based on revolutionary architecture.
Take part in the development of cutting-edge products within a disruptive system architecture. Youll have the opportunity to work on the technologies that power the worlds largest cloud provider, in a dynamic, open, and fast-paced environment. our Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud, which powers hundreds of thousands of businesses in 190 countries around the world.
We are looking for talented physical design implementation engineers to join our excellent Physical Design team, which develops our next generation of products for the cloud market.
Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.
A day in the life
Your day will be filled with dynamic technical challenges that push the boundaries of semiconductor design. You'll collaborate with cross-functional teams, diving deep into intricate physical design processes, and translating complex architectural concepts into tangible technological solutions. Expect to engage in cutting-edge problem-solving that requires both creative thinking and precise technical execution.
Requirements:
Basic Qualifications
- Understanding the entire physical design flow (RTL to GDS)
- Deep understanding of sign-off activities (timing and physical verification)
- Experience in advanced nodes technologies and Implementation tools
- Process and technology oriented
- Leadership and mentoring skills
Preferred Qualifications
- Full-chip experience (floor plan, layout, timing)
- Previous experience in high-speed designs, multi-voltage (low power) designs.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8455967
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a NPI and Layout package Engineer on the packaging team, you will be working on fast-paced products for consumer devices. In this role, you will work with Hardware Designers and Mechanical Engineers throughout the full product development life-cycle, supporting package outline, component placement and routing, using advanced package technologies while analyzing package reliability and manufacturability aspects.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users , Cloud customers and the billions of people who use our company services around the world.

We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Design the layout of package substrates using Cadence Allegro Package Designer.
Apply package substrate layout design rules from manufacturing point of view and electrical requirement considerations.
Generate high-quality design documents for substrate manufacturers and package assembly houses.
Enhance the package design work continuously by developing initiatives that drive efficiency and improve quality/cost/schedule of the package layout work.
Manage new ASIC packages during the NPI phase as the primary engineering owner, overseeing the product life-cycle from design lockdown to mass production release.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical , Electrical Engineering, Material science, or equivalent practical experience.
5 years of experience in one of the following: Package/PCB layout design using Cadence/Mentor tools, semiconductor manufacturing processes, PCB manufacturing processes.
Experience in package/PCB designs for high-speed/power ICs such as CPUs, GPUs/ASIC/Chipset.
Preferred qualifications:
Experience with industry standards and regulatory requirements related to semiconductor manufacturing and packaging (e.g., JEDEC standards).
Experience with simulation and analysis tools (e.g., thermal, mechanical, signal integrity, power integrity analysis).
Experience in scripting and programming languages (e.g., Python, Perl, Tcl) for automation and data analysis.
Experience with Failure Analysis (FA) techniques and root cause investigations.
Knowledge of Design for Excellence (DFx) such as Design for Manufacturability, Testability principles.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
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8412907
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a System on a Chip (SoC) Design for Test (DFT) Engineer, you will be responsible for defining, implementing, and deploying advanced DFT methodologies for digital or mixed-signal chips. You will define silicon test strategies, DFT architecture, and create DFT specifications for next generation SoCs. You will design and verify the DFT logic and prepare for post silicon and co-work/debug with test engineers.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers , our company Cloud customers, and billions of our company users worldwide.

We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Develop DFT strategy and architecture (e.g., Memory Built-In Self Test (MBIST), Automatic Test Pattern Generation (ATPG), hierarchical DFT).
Complete all Test Design Rule Checks (TDRC) and design changes to fix TDRC violations to achieve high-test quality.
Insert DFT logic, boundary scan, scan chains, DFT Compression, Logic Built-In Self Test, Test Access Point (TAP) controller, clock control block, and other DFT IP blocks.
Insert MBIST logic including test collar around memories, MBIST controllers, eFuse logic, and connect to core and TAP interfaces.
Document DFT architecture, test sequences, and boot-up sequences associated with test pins.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related field, or equivalent practical experience.
3 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with ASIC DFT synthesis, simulation, and verification flow.
Experience in DFT specification, definition, architecture, and insertion.
Preferred qualifications:
Master's degree in Electrical Engineering.
Experience working with ATE engineers (e.g., silicon bring-up, patterns generation, debug, validation on automatic test equipment, debug of silicon issues).
Experience in IP integration (e.g., memories, test controllers, Test Access Point (TAP), and Memory Built-In Self Test (MBIST)).
Experience in SoC cycles, silicon bringup, and silicon debug activities.
Experience in fault modeling.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will be part of a team developing ASICs used to accelerate networking in data centers. You will have dynamic, multiple responsibilities in areas such as project definition, design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators.You will also be responsible for performance analysis for an end-to-end networking stack using your knowledge.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers , our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement data center networks.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
Experience developing RTL for ASIC subsystems.
Experience with cross-functional engagement in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with software teams optimizing the hardware/software interface.
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in TCP, IP, Ethernet, PCIE and DRAM including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
Proficiency in a procedural programming language (e.g. C++, Python, Go).
This position is open to all candidates.
 
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