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Location: Haifa
Job Type: Full Time
We are looking for
Elbit Systems is looking for a Board Design Engineer for our Haifa site within the Aerospace Division. Join a leading global technology company developing advanced mission-critical systems and cutting-edge solutions across a wide range of defense applications. As part of our multidisciplinary engineering teams, you will take part in the development of advanced hardware platforms while working with cutting-edge technologies and complex engineering challenges
Requirements:
Bachelor's degree in electrical engineering
At least 3 years of experience in digital electronic board design
Experience with requirements capture and top-level architecture
Understanding of PCB layout methodologies and high-speed PCB design concepts
Experience working with signal integrity simulation tools such as Hyperlynx, Ansys, or similar tools
Experience with PCB design tools such as Altium Designer, Mentor Expedition, or Cadence
Experience in Voltage Regulated Modules DC/DC (VRM) design - Advantage
Background in retimers and redrivers - Advantage
Experience in Analog Circuit Design (amplifiers, filters, etc.) - Advantage
Problem-solving skills, teamwork abilities, and effective communication skills

*Only relevant applications will be answered
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Package Design/Layout Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Dive into the architecture and microarchitecture of complex hardware units and features, such as packet processing pipelines and advanced networking capabilities. Develop comprehensive post-silicon validation test plans based on a thorough understanding of the design and specifications.
Write, execute, and debug validation tests using Python and/or C/C++, running on Pre-Si emulation platforms and primarily on the silicon.
Lead the bring-up, troubleshooting, and debug efforts on silicon, identifying root causes of hardware and software issues. Collaborate closely with architects, designers, and other teams to drive bug fixes and ensure feature functionality.
Contribute to the development of test infrastructure and methodologies to improve validation efficiency and coverage. Mentor and guide junior engineers as the team grows.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with functional tests for silicon validation (i.e., writing in C or C++ or Python or similar).
5 years of experience in pre-silicon or post-silicon validation.
5 years of experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Ability to learn new systems quickly and work independently in a fast-paced environment.
Excellent communication and collaboration skills.
A passion for deep technical challenges, excellent problem-solving skills, and a strong sense of ownership.
Interest in hardware and a desire to transition into silicon validation.
This position is open to all candidates.
 
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8785673
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Technical Lead, Custom Digital Circuit Design, Mixed Signal
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As the Lead Architect for our custom back-end solutions for high-speed internal connections, you will set the design standards for our custom silicon. You will ensure our physical design methods can support data speeds of 1.6T and above while maintaining high manufacturing reliability and performance. You will create the design framework for our future hardware, solving complex engineering challenges in the latest manufacturing processes.
Responsibilities
Define the global back-end and custom Physical Design methodology, driving the transition to automated Analog and Mixed-Signal (AMS) flows and "Layout-Aware" design.
Lead full custom digital circuit design at the transistor level optimized for low power.
Evaluate and de-risk new process features in GAA (Gate-All-Around) nodes (e.g., Backside Power Delivery, Buried Power Rails) for high-speed analog use cases.
Drive the long-term Roadmap for Area and Power density, ensuring our PHYs remain the most efficient in the industry.
Act as the primary liaison with foundries to optimize Design for Manufacturing (DFM) and maximize yield for massive TPU-scale chips.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
12 years of experience in Physical Design, Custom Digital Circuit Design, or Custom Layout.
Experience delivering GDS for advanced nodes.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience in custom digital design and low power design techniques.
Experience with custom design tools and methods.
Experience in Electromagnetic Modeling (EM) and its impact on physical layout (Inductors, T-lines).
Experience in Co-Packaged Optics (CPO) physical implementation.
Ability to build strategic goals for the intersection of AI-driven layout and traditional custom design.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8785630
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