דרושים » הנדסה » NPI Project Leader

Requirements:
B.Sc. in Mechanical / Mechatronics Engineering (or related field).

5+ years of experience in Process / Production / NPI Engineering.

Strong background in manufacturing environments.

Knowledge of Lean, SPC, PFMEA, and problem-solving methodologies.

Hands-on, analytical, and detail-oriented with strong ownership.

Excellent communication and teamwork skills.

Requirements:
Required Qualifications:
* B.Sc. or M.Sc. in Electrical Engineering, Materials Engineering, Industrial Engineering (with semiconductor background), Computer Engineering, or a related discipline.
* 5+ years of experience in Product Engineering within the semiconductor industry.
* Strong understanding of semiconductor manufacturing processes and CMOS technologies.
* Knowledge of semiconductor device physics and fabrication processes.
* Experience with product qualification, reliability testing, and characterization data analysis.
* Familiarity with semiconductor packaging and assembly technologies.
* Understanding of Failure Analysis methodologies and common FA techniques.
* Knowledge of JEDEC qualification and reliability standards.
* Experience with statistical analysis, Design of Experiments (DOE), and yield analysis.
* Proficiency with Microsoft Office tools, including Excel and Project.
* Strong analytical and problem-solving skills.
* Ability to manage multiple activities independently while collaborating across global teams.
* Excellent communication skills in English. Nice to Have
* Background in semiconductor device physics.
* Experience with Electrical Test (ET) analysis.
* Hands-on Failure Analysis (FA) experience.
* Knowledge of assembly design rules (Assembly DR).
* Understanding of ASIC/VLSI design flow.
* Experience with scripting languages (Python, Perl, TCL, or similar).
* Experience working directly with foundries and OSAT partners.
Why Join Nuvoton? At Nuvoton, you'll work on cutting-edge semiconductor products alongside highly experienced engineers in a collaborative environment. You'll have the opportunity to influence products from early development through mass production while working with leading global customers and advanced manufacturing technologies.

Requirements:
B.Sc. in Electronics, Electrical, Mechatronics, Industrial Engineering, or related field.
5+ years of experience in Process/Manufacturing/NPI Engineering within an electronics production environment.
Strong knowledge of electronic manufacturing processes, PCBA technologies, SMT/THT, soldering, and IPC standards.
Experience with Lean Manufacturing, SPC, PFMEA, Control Plans, Six Sigma methodologies, and process validation.
Hands-on, analytical, and proactive approach with excellent problem-solving and teamwork skills.

Requirements:
B.Sc in Mechanical Engineering from an accredited university.
2+ years of experience as a team manager with multidiscipline knowledge and capabilities.
Soft skills ability to create an engaging relationship , strong communication skills, problem-solving abilities, leadership qualities.
Hard skills: High level of technical knowledge.
Fluent English.
Full time position located in Yokneam.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering / Physics / Material Engineering or higher, with 5+ years of experience in opto-mechanical and electro-mechanical product development, including PCB/PCBA design.

Strong understanding of failure analysis methodologies, root cause investigation, reliability engineering principles, and physics-of-failure analysis.

Hands-on experience debugging complex opto-electro-mechanical systems and identifying thermal, mechanical, assembly, manufacturing, and reliability-related failure mechanisms.

Experience leading complex technical investigations, including DOE execution, 8D methodology, and preparation of detailed investigation and failure analysis reports.

Strong background in mechanical simulations for components and assemblies as part of product design and failure analysis activities.

Hands-on experience with laboratory and analytical tools such as microscopy, X-ray, CT scanning, thermal imaging, strain/stress measurements, and optical lab equipment in clean room environments.

Knowledge of optical manufacturing processes, inspection methods, optical modules, fiber-optic interconnects, and multidisciplinary system integration.

Excellent hands-on experience with 3D CAD tools; Creo is an advantage. Strong understanding of manufacturability, GD&T, CTF dimensioning, and statistical tolerance analysis techniques.

Self-motivated team player with strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Active involvement in the development of opto-mechanical telecommunication devices.

Exposure development of advanced thermal solutions such as heat-pipes, vapor chambers and liquid cooling.

Experience working in high-volume manufacturing environments with a strong focus on reliability, yield improvement, and design for manufacturability (DFM).

Experience with mechanical stress simulation tools such as ANSYS Mechanical.

Record of working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering or higher degree.

8+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Self-motivated with a sharp learning curve and able to work independently and as a teammate.

Excellent hands-on experience with 3D CAD.

Strong background in design of components for high-volume manufacturing technologies, such as: stamping, die casting, extrusion, and injection.

Experience in developing fixtures/jigs for product assembly/testing.

High awareness for quality and manufacturability, and understanding of statistical tolerance analysis techniques, CTF dimensioning, and geometric tolerancing.

Experience in defining and executing DOE (design of experiment)

Strong verbal and written communication skills in both English and Hebrew.


Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

Requirements:
What we need to see:

B.Sc. in Mechanical Engineering.

2+ years of experience in electro-mechanical product design, including PCB/PCBA design.

Excellent knowledge & experience with 3D software for mechanical design (Inventor/Creo).

Knowledge with some of the following various production technologies: PCB design, Sheet metal, Electronic Liquid cooling, Metal die casting, Machining (Milling), Extrusion, Plastic injection molding.

Producing of manufacturing documentation (Drawing, Specs).

Computers & software: PDP (Advantage), Office.

Self-motivated with a sharp learning curve.

Ability to manage multiple tasks while being very well organized (know how to work in Multitasking mode and priorities the tasks).

Multi- disciplinary abilities.

Strong communication skills, English & Hebrew, written and verbal. strong Interpersonal relationship.

Team player. ability to work independently and as a member of a team as well.

High Service oriented.



Ways to stand out from the crowd:

Skilled in working with supply chains, contract manufacturers, and leading resources such as consultants, component suppliers, contractors, and manufacturing partners.

Proficient in mechanical stress simulation tools.

Background in developing liquid cooled systems.

Familiar with IDF file exchange processes with Layout engineers.

Expertise in designing PCIe and OCP3.0 standards compliant products, as well as implementing and training on new design and flow methodologies.

Requirements:
What we need to see:
B.Sc. in Electrical / Mechanical/ Material/ Chemical Engineering, or similar or equivalent experience.
12+ years of experience in the Hardware design development or testing arena or as Process Engineer.
Preferable 5+ years in the field of quality.
Experience in manufacturing process or test engineering, board design/assembly or semiconductors knowledge and previous experience.
Background with hardware qualification, reliability processes, quality procedures and tools.
Familiarity with quality methods Risk assessment failure analysis and FMEA.