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1 ימים
חברה חסויה
Location: More than one
Job Type: Full Time
The System-On-Chip (SOC) group is looking for a strong RTL Design Engineer to own the SOC clocking logic for our next-generation networking chips. Clocks are the backbone of the SOC. In this role you will own the clock generation, distribution, and control logic for the entire chip - PLL and reference clock integration, clock muxing and dividers, glitchless switching, clock gating, reset synchronization, and the clock domain crossing infrastructure that every unit on the die depends on.

This is an RTL design role, not a circuit or transistor-level design role. You will translate micro-architecture specifications into high-quality synthesizable RTL, and drive that RTL through to silicon in close partnership with the micro-architecture, Design Verification, and Physical Design (backend) teams. You will also interact with CAD, Package Design, Software, and DFT teams.

What you'll be doing:

Owning the SOC clocking logic end to end: writing synthesizable Verilog/SystemVerilog RTL for clock generation, distribution, muxing, division, glitchless switching, gating, and reset synchronization, from micro-architecture specification through tape-out.

Defining and implementing the SOC clock and reset architecture together with the micro-architecture team - collecting clocking requirements from every unit on the chip and turning them into a coherent, verifiable design.

Owning clock domain crossing infrastructure and CDC closure across the SOC.

Partnering with the micro-architecture team to review specifications, close on design intent, and provide feedback on implementation cost, timing, area, and power.

Working hand-in-hand with the Physical Design (backend) team on clock tree implementation and constraints, partitioning, floorplan and timing feedback, trial synthesis, congestion and timing convergence, and physical design readiness.

Supporting Software and firmware teams on clock programming sequences, DVFS, and low-power/clock-shutdown flows.

Driving design quality: lint, CDC/RDC, formal checks, synthesis QoR, connectivity and structural checks.

Supporting SOC-level chip build and assembly, and developing/deploying automation flows that make RTL integration and design quality checking repeatable and scalable.

Supporting emulation, firmware, and post-silicon bring-up customers of your design.
Requirements:
What we need to see:

B.Sc./M.Sc. in Electrical Engineering or Computer Engineering.

3+ years of relevant experience in RTL/logic design.

Solid hands-on RTL design skills in Verilog/SystemVerilog, with a good understanding of synthesis, timing, and how RTL choices affect the physical implementation.

Experience taking a design from micro-architecture specification through verification and physical implementation.

Solid understanding of clocking and reset concepts: clock gating, clock muxing and dividers, glitchless clock switching, reset synchronization, and clock domain crossing.

Familiarity with design quality tooling (lint, CDC/RDC, formal, synthesis).

Great teammate with strong communication skills across micro-architecture, DV, and backend teams.


Ways to stand out from the crowd:

Passion for quality, and a track record of clean deliveries to physical design, DV, emulation, firmware, and other downstream customers.

Prior ownership of SOC-level clocking or reset architecture on a taped-out chip.

Experience with PLL/clock generator integration and clock tree constraint development with backend teams.
This position is open to all candidates.
 
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1 ימים
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
The System-On-Chip (SOC) group is looking for a Senior RTL Design Engineer to serve as the technical lead for clocks development on our next-generation networking chips. Clocks are the backbone of the SOC. In this role you will lead the development of the chip's clocking logic - PLL and reference clock integration, clock generation, distribution, muxing and dividers, glitchless switching, clock gating, reset synchronization, and the clock domain crossing infrastructure that every unit on the die depends on.

This is an RTL design and technical leadership role, not a circuit or transistor-level design role. Working from the clock architecture defined with the architecture and micro-architecture teams, you will lead its implementation in RTL, guide other engineers contributing to it, and drive it through to silicon in close partnership with Design Verification and Physical Design (backend). You will also interact regularly with CAD, Package Design, Software, and DFT teams.

What you'll be doing:

Acting as the technical lead for SOC clocks development - leading the implementation of the clocking logic from specification through tape-out and bring-up.

Working with the architecture and micro-architecture teams on the SOC clock and reset scheme: collecting clocking requirements from units across the chip, feeding back implementation and timing considerations, and translating the agreed scheme into a verifiable design.

Writing and reviewing synthesizable Verilog/SystemVerilog RTL for clock generation, distribution, muxing, division, glitchless switching, gating, and reset synchronization.

Leading and mentoring other RTL engineers working on clocking: reviewing designs, setting coding and quality standards, and distributing work across the team.

Working hand-in-hand with the Physical Design (backend) team on clock tree implementation, SDC/timing constraints, partitioning, floorplan feedback, trial synthesis, and timing convergence.

Partnering with Design Verification on clocking testplans, functional and gate-level debug, and coverage closure.

Supporting Software and firmware teams on clock programming sequences, DVFS, and low-power/clock-shutdown flows.

Representing clocking implementation in cross-functional design reviews with architecture, PD, DV, DFT, and CAD stakeholders.
Requirements:
What we need to see:

B.Sc./M.Sc. in Electrical Engineering or Computer Engineering.

8+ years of relevant experience in RTL/logic design, with multiple chips taken to tape-out.

Demonstrated technical leadership: leading a design area through implementation and tape-out, mentoring engineers, and coordinating across teams.

Expert hands-on RTL design skills in Verilog/SystemVerilog, with strong understanding of how RTL choices affect synthesis results, timing, area, and power.

Deep understanding of clocking and reset design: clock gating, clock muxing and dividers, glitchless clock switching, reset synchronization, and clock domain crossing.

Proficiency with design quality tooling - lint, CDC/RDC, formal verification, synthesis, and static timing analysis (STA) - including the ability to interpret results and drive fixes back into the RTL.

Experience taking a design from architecture and micro-architecture specification through verification, physical implementation, and silicon bring-up.

Great teammate with strong communication skills across micro-architecture, DV, backend, DFT, and software teams.


Ways to stand out from the crowd:

Prior hands-on experience with SOC-level clocking or reset logic on a taped-out chip.

Experience with PLL/clock generator integration and clock tree constraint development with backend teams.

Experience with high-speed networking, interconnect, or fabric designs.

Background with low-power design techniques (clock gating, DVFS, power domains, UPF).

Experience building automation for RTL integration, chip assembly, or design quality flows.
This position is open to all candidates.
 
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6 ימים
חברה חסויה
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
The complexity of the chip has greatly increased over the years. We are now packing tens of billions of transistors in a chip to meet the growing computing demand in a footprint that is responsible to our environment. The NVIDIA System-On-Chip (SOC) group is looking for a top physical design engineer with a curiosity about SOC design optimization, physical integration, chip build and assembly and verification. You should have real passion for methodologies and clock distribution solutions that enable SOC creation in the most optimized way. In this position, you will get the opportunity to build complex networking chips and directly contact unit-level owners, Physical Design, CAD, Package Design, Software, DFT and other teams.

What you'll be doing:

Designing and implementing SOC level clock requirements.

Daily work involves aspects of chip level design, including partitioning, CDC, trial synthesis, design quality checks.

Be exposed and work on a variety of functional and structural challenges. Including functional debug, physical design readiness, resolve design quality issues.
Requirements:
What we need to see:

B.SC. in Electrical Engineering/Computer Engineering.

3+ years of confirmed experience in chip design.

Shown hands on physical design skills in clock distribution in tight multi power and timing/layout constrained products.

Proficiency in at least one common scripting languages like perl, python, bash, Tcl.

Phenomenal teammate.


Ways to stand out from the crowd:

Passion for quality. Experience with delivery back to RTL, to physical design, and other customers
This position is open to all candidates.
 
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05/07/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

If you want to build silicon that leads the cloud world, this is where it happens.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications:
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications:
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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22/07/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers us at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
22/07/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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6 ימים
Location: More than one
Job Type: Full Time
We are looking for a dedicated SoC Clocks Design Automation Engineer to join our Networking Silicon team. In this role, youll focus on developing and supporting clock-related design flows and methodologies for SoC and networking chips, ensuring efficient and high-quality design implementation. Youll also chip in to SoC top-level automation and integration activities, building on existing flow infrastructure to improve efficiency and consistency across projects. Introduction

What you'll be doing:

Develop and maintain design automation and methodologies for SoC and networking clock flows.

Collaborate with design, STA, and project teams to ensure timely and high-quality design closure.

Develop and improve SoC top-level automation scripts and flows built upon existing infrastructure and tools.

Support SoC integration and construction flow activities across multiple projects.

Assist in timing, power, and noise analysis to ensure efficient performance.
Requirements:
What we need to see:

B.Sc. or M.Sc. in Electrical or Computer Engineering, or relevant professional experience.

At least 2 years of confirmed experience in SoC design, design automation, or methodology development.

Strong programming or scripting skills in at least one language (Python preferred; Perl, Tcl, or Make are advantages).

Understanding of physical design concepts including placement, routing, timing closure, and ECO implementation.

Familiarity with EDA tools for synthesis, place-and-route, and timing analysis (Synopsys or Cadence flows).

Strong analytical, problem-solving, and soft skills.


Way to stand out from the crowd:

Experience developing or maintaining SoC design or automation flows.

Knowledge of timing-related analysis (crosstalk, noise, delay).

Background in power or timing optimization techniques.

Collaborative attitude with the ability to work effectively across multi-functional teams.

Self-motivated and eager to learn while improving existing design flows.
This position is open to all candidates.
 
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1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
5+ years of experience in logic design at semiconductor companies
Knowledge and experience in Verilog and/or SystemVerilog
Excellent communication skills with ability to work effectively across teams
Understanding of digital design principles and RTL coding best practices
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Knowledge of DDR and PCIe protocols and implementation
Understanding of power management techniques for low-power design
Familiarity with Clock Domain Crossing, simulation, debugging, synthesis, and timing analysis
Proficiency in scripting languages such as Python or Perl
Experience with high-speed serial interface designs or connectivity protocols.
This position is open to all candidates.
 
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4 ימים
Job Type: Full Time
The complexity of the chip has greatly increased over the years. We are now packing tens of billions of transistors in a chip to meet the growing computing demand in a footprint that is responsible to our environment. The System-On-Chip (SOC) group is looking for a top ASIC Engineer with a curiosity about SOC design automation, RTL integration, chip build and assembly, and padring design and verification. You should have real passion for methodologies and automation solutions that enable SOC creation in the most optimized way.

In this position, you will get the opportunity to build complex networking chips and interact directly with unit-level ASIC, Physical Design, CAD, Package Design, Software, DFT and other teams.


What you'll be doing:

Implement chip level design through collaboration with cross-functional teams (Functional Design, DFT, Design Verification, System Verification, STA, and Physical Design).

Be exposed and work on a variety of functional and structural challenges. Including functional debug, physical design readiness, emulation, resolve design quality issues.

Daily work involves aspects of chip level design, including partitioning, CDC, RDC, trial synthesis, design quality checks.

Taking part in flows development and deployment.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering/Computer Engineering.

7+ years of actual design experience in chip design.

Solid hands-on RTL design skills in System-Verilog.

Proficiency in at least one scripting languages like python, bash, tcl.

Great teammate.


Way to stand out from the crowd:

Passion for quality. Experience with delivery to physical design, emulation, firmware and other customers
This position is open to all candidates.
 
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לפני 7 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.
As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing
Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness
Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Bachelors degree in Electrical Engineering or a related technical field
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows
Preferred Qualifications
Experience with full-chip level implementation and integration
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus)
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
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1 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.
As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.
Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below)
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus)
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration
Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR)
Experience with DFT (Design for Test) integration into the physical design flow
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8773841
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