We are a rapidly growing startup company, developing the next-generation smart-infrastructure solution based on novel fiber-sensing technology (smart roads, smart cities, perimeters, and grid monitoring, etc). The company offers an award-winning disruptive solution; a sensor free approach to smart infrastructure. The company is VC backed and in the revenues stage. Combining pioneering technology in optical fiber sensing with state-of-the-art Machine Learning, we help prevent environmental disasters, protect human lives, and keep critical energy and transportation backbones running smoothly.
We are looking for a talented, self-driven, and hands-on Electro Optics Systems Engineer to join Photonics R&D team. In this role, you will develop and advance next-generation distributed fiber-optic acoustic sensing (DAS) systems, combining electro-optic system design, performance modeling, simulations, experimental validation, and field data analysis. You will tackle complex physical and engineering challenges, contribute to next-generation product development, and collaborate closely with multidisciplinary teams to bring innovative sensing technologies from concept to real-world deployment. This role is ideal for someone who thrives in a fast-paced, hands-on R&D environment, enjoys working across disciplines, and wants to see their work translate into real-world impact.
What Youll Do:
* Lead experimental and theoretical R&D efforts for the development of Prismas next-generation distributed fiber-optic acoustic sensing systems.
* Design, evaluate, and optimize electro-optic interrogation systems for distributed acoustic sensing applications.
* Develop system -level models and simulations for optical signal generation, fiber propagation, coherent detection, system noise, SNR, and sensing performance.
* Build software tools and simulations in Python, C ++, or similar languages for system evaluation, signal processing, field data analysis, and performance modeling.
* Plan, execute, and analyze laboratory and field experiments to validate system performance and support product development.
* Gain unique end-to-end expertise across the full sensing system pipeline, spanning fiber optics, electro-optics, coherent detection, DSP algorithms, and advanced data analysis.
* Lead product development activities from ideation and proof of concept through design, qualification, validation, and deployment.
* Collaborate closely with multidisciplinary R&D teams, including physicists, software engineers, algorithm developers, and hardware engineers.
* Communicate effectively with both technical and non-technical stakeholders, translating complex system behavior into clear insights and actionable recommendations.

Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're behind groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.

Required ASIC Design Verification Technical Lead, High-Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an ASIC Design Verification Technical Lead, you will define how we verifiy the physical-layer Digital Signal Processing (DSP) pipelines powering our next-generation AI hardware accelerators. You will drive the shift toward Emulation and Post-Silicon Correlation, ensuring that our architectural reference models and pre-silicon simulations perfectly match the physical behavior of the high-speed silicon in our planetary-scale AI data centers.
Responsibilities
Design, build, and scale constrained-random verification environments using SystemVerilog and UVM for high-speed physical-layer DSP blocks.
Build co-simulation frameworks and predictors to compare RTL implementation output against high-level algorithmic models.
Define and execute functional coverage plans, utilizing covergroups and SystemVerilog Assertions to verify architectural corner cases, fixed-point quantization effects, and numerical overflows.
Author dynamic stimulus sequences and virtual sequencers to stress-test adaptive feedback loops under realistic channel impairments, including noise, ISI, and high-frequency jitter profiles.
Lead the debugging of RTL and environment failures, collaborating closely with algorithm and DSP designers to isolate and resolve discrepancies between the RTL implementation and the specification.

Required Staff Embedded Firmware Engineer, High Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a Staff Embedded Firmware Engineer for High-Speed DSP, you will architect and define the low-level firmware and control loops powering the world's most advanced physical-layer communications silicon. Sitting at the critical intersection of digital signal processing (DSP), hardware-software co-design, and real-time systems, you will lead the development of adaptive algorithms, error correction (FEC), and link-telemetry frameworks. Your work will directly bridge the gap between high-performance hardware pipelines and our planetary-scale AI infrastructure, transforming complex communication systems theory into reliable, real-time silicon execution.
Responsibilities
Define the long-term firmware roadmap and hardware-software partitioning for physical-layer interfaces, determining the optimal balance between hardware-fixed logic and programmable firmwarm.
Architect advanced "in-situ" monitoring systems and firmware-driven diagnostics to track physical-layer link health, Bit Error Rate (BER) trends, and channel quality across millions of ports in real-time.
Design, model, and implement bare-metal or RTOS firmware to control high-speed transceivers, managing real-time adaptive loops, clock and data recovery (CDR), and physical-layer calibration.
Partner with TPU Systems, Networking Software, and High-Performance Computing (HPC) teams to ensure silicon firmware integrates seamlessly with global cluster management and collective communication frameworks.
Identify and de-risk hardware-software interface bottlenecks (e.g., register maps, driver latencies, and boot-up sequencing) that impact our AI infrastructure.

Required Senior Software Engineer, CPU, Cloud
About the job
In this role, you will work at the center of our most strategic infrastructure investments. You will join a high-impact team operating on the critical path of our hardware and software evolution, bridging the gap between compute infrastructure and the massive scale of our software stack. You will be responsible for defining the methods and technologies required to model, simulate, and analyze complex hardware systems, with a core focus on security, performance, and correctness analytics, ensuring the efficiency of our future compute platforms. As a software engineer in this group, you will act as an architect, designer, and coder taking ownership of your goal and working in close partnership with cross-functional teams to make it a reality.
You will be at the intersection of hardware design and software optimization for our next-generation high-performance compute cores. You will not just support existing infrastructure; but will be helping build the foundation of our future hardware. Because this work is on the "most critical path" for our future, you will have visibility into and influence over the core technology that powers our most intensive services. You will bridge the gap between silicon-level security research and massive-scale software implementation, working with experimental AI tools that are shaping how we verify and optimize future hardware. You will be building the foundation of our future hardware.
Responsibilities
Drive performance modeling and analysis for next-generation CPUs, while identifying architectural bottlenecks, ensure system correctness, and implement optimization strategies across hardware-software stack to maximize efficiency for compute workloads.
Design, develop, and maintain software modeling tools and simulation environments, leverage C++, Python, and AI-driven methodologies to perform studies and automate analytical workflows.
Conduct security analysis and threat modeling for hardware-software interfaces, while developing and implementing methodologies for detecting, mitigating, and analyzing side-channel and micro-architectural vulnerabilities, ensuring systems meet safety and privacy.
Explore, deploy, and scale experimental AI-driven tooling to automate verification workflows, enhance predictive modeling, and accelerate development cycles, actively contribute to expanding the team's suite of AI-assisted capabilities.
Provide technical leadership in system integration projects, guide cross-functional teams to resolve large-scale compute bottlenecks, influence architectural designs, and facilitate the successful deployment of hardware-software solutions.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Silicon Technical Program Manager to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Technical Program Manager, you will be the key architect of our silicons operational reality. You wont just track timelines - you will help establish our local execution culture and technical standards, owning the cross-functional journey of transforming complex logic into high-performance silicon.
Key Responsibilities
Drive and manage ASIC development and subsystems from concept through to production in collaboration with internal teams and external vendors.
Provide hands-on program management throughout the full development cycle of silicon and firmware, including concept, design, development, fabrication, validation, and production release.
Work closely with the software, hardware, and architecture teams to align with product requirements and ensure all constraints are met.
Lead process improvements across multiple teams and functions to drive better collaboration and efficiency.
Independently manage complex projects with minimal supervision, ensuring timelines and milestones are met.
Deliver high-quality ASIC solutions products while collaborating with product management and architecture teams.

we are looking for a IC Package Design Engineer.
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.
You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.
Responsibilities:
As a member of the Package Design team, you will:
Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing suport.
Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.
Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.
Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.
Assist in developing and improving package design methodologies, flows, and best practices.
Contribute to debugging, issue resolution, and package bring‑up activities as needed.

We are currently seeking a skilled Algorithm/Signal Processing Engineer to join our R&D team and drive the development of advanced algorithms, perform in-depth signal analysis, and contribute to cutting-edge defense technologies.

Job Description:

The CTO team is tasked with promoting innovative next gen algorithms and sub-systems to meet current and future challenges.

In this role, you will lead R&D initiatives focused on RF Spectrum Detection and Jamming of Drones and communication devices.

Activities include Research, python/matlab simulations, fixed point modeling, Interaction with HW group and RF testing, Proof of concept, field-testing.

Required SoC Quality and Reliability Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Our data centers are the most advanced in the world. In this role, you will help build the state-of-the art SoCs that power these data centers by driving quality and reliability processes from the Integrated Circuit perspective. This is an opportunity to create silicon and follow it into the field (and back!) to drive improvements for the next-generations of chips.
In this role, you will understand Integrated circuit (IC) flows, wafer processing, testing, qualification, yield, reliability, and failure analysis. You will work with various cross-functional teams to develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute and test plans. Within the larger organization you will collaborate with global hardware quality and reliability teams, silicon design, validation and engineering teams.The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive the strategic definition and development of Design-for-Reliability (DfR) guidelines, collaborating with cross-functional subject matter experts to integrate reliability into early design stages.
Define and lead the development of qualification hardware and test methodologies, managing internal teams and external vendors to ensure robust silicon and package verification.
Execute comprehensive silicon and package qualification programs (including HTOL, ELFR, ESD/LU, b/HAST, etc.) and conduct in-depth failure analysis to resolve quality issues.
Extract and analyze large-scale data from qualification programs, high-volume manufacturing, and field returns to identify failure mechanisms and trends for yield and reliability optimization.
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI) to predict device failure mechanisms and lifetime behaviors.

Required Senior Silicon DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.