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21/06/2026
חברה חסויה
Location: Yokne`am and Tel Aviv-Yafo
Job Type: Full Time
The System-On-Chip (SOC) group is looking for a top physical design engineer with a curiosity about SOC design optimization, physical integration, chip build and assembly and verification. You should have real passion for methodologies and clock distribution solutions that enable SOC creation in the most optimized way. In this position, you will get the opportunity to build complex networking chips and directly contact unit-level owners, Physical Design, CAD, Package Design, Software, DFT and other teams.

What you'll be doing:

Designing and implementing SOC level clock requirements.

Daily work involves aspects of chip level design, including partitioning, CDC, trial synthesis, design quality checks.

Be exposed and work on a variety of functional and structural challenges. Including functional debug, physical design readiness, resolve design quality issues.
Requirements:
What we need to see:

B.SC. in Electrical Engineering/Computer Engineering.

3+ years of confirmed experience in chip design

Shown hands on physical design skills in clock distribution in tight multi power and timing/layout constrained products.

Proficiency in at least one common scripting languages like perl, python, bash, Tcl.

Phenomenal teammate.

Ways to stand out from the crowd:

Passion for quality. Experience with delivery back to RTL, to physical design, and other customers
This position is open to all candidates.
 
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21/06/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

You will be in charge of developing full-chip physical design methodologies, Physical Verification development and support through all the projects, Tapeout activities for implementation of networking chips and SOCs.

Work closely with Full Chip Layout owners and block owners, project managers to assure high quality and timely convergence.

Come up with unique and creative solutions to the state of the art FCL physical design problems that are needed for our chips.

We expect you to run, debug, and approve Physical Verification flows across multiple projects, ensuring strict adherence to our high standards.

Participating and developing flow and tool methodologies for fullchip, physical design verification across multiple projects.
Requirements:
What we need to see:

B.SC./ M.SC. in Electrical Engineering/Computer Engineering (or equivalent experience).

You should have at least 5+ years of hands-on Full-chip layout and Physical Verification experience, demonstrating your proven expertise.

A strong background in Physical Verification methodology, including DRC / LVS / ANT / ERC / DFM in advanced process nodes is necessary.

Proficiency using Python, Tcl, Shell, Make scripting.

Experience in Linux environments.

AI tools orientation or alternatively a desire to learn.

Familiarity with physical build EDA tools, including Synopsys (ICC2/FC) and Cadence (Innovus).

Familiarity with Physical Verification tools: Synopsys (ICV), Siemens (Calibre)

Self-motivation, attention to detail, and good interpersonal skills.


Ways to stand out from the crowd:

Experience with data collection and analysis

Experience in methodology definition / flow owner of Full-chip / Place and Route

Great teammate.

Ownership, self-learning skills, and ability to work autonomously.
This position is open to all candidates.
 
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5 ימים
Location: Tel Aviv-Yafo
Job Type: Full Time
We're looking for an exceptional senior Chip Design Engineer to join our Nitro team and help shape what comes next. You'll work alongside a world-class, fast-moving engineering team, take full ownership of critical IP blocks, and see your work deployed at a scale no other platform can match- powering hundreds of thousands of businesses across 190 countries.

If you want to build silicon that leads the cloud world, this is where it happens.

As a Senior Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

Key job responsibilities
* Full ownership of one or more IPs within the product:
Micro-architecture definition.
RTL coding and debug.
Synthesis and timing closure.
Sign-off before tape-out.
* Supporting the Verification and Emulation teams: Test plan development, coverage review.
* Ensuring the chip meets quality and reliability standards.
* Collaborating with cross-functional teams, including Product Definition, Verification, Software, and Physical Design.
Requirements:
Basic Qualifications:
- 6+ years of experience in chip design.
- Hands-on experience in micro-architecture and RTL design (Verilog / System Verilog).
- Scripting expertise in C*, Perl, Python, or TCL.
- BSc in Computer/Electrical Engineering.
- Strong communication and collaboration skills.
- Strong leadership skills and ability to own complex units.

Preferred Qualifications:
- Strong knowledge of protocols (AXI, CHI, DDR, Networking, PCIe).
- Experience with Network-on-Chip (NOC) architecture.
- knowledge with coherent and non-coherent fabric design.
- Comprehensive SoC development cycle expertise (Synthesis, STA, CDC, Lint).
- Knowledge of Design Automation tools and techniques.
- Advanced degree in related technical field.
This position is open to all candidates.
 
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21/06/2026
Location: Yokne`am
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.
Requirements:
What we need to see:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience.
Proven experience in RTL2GDS flows and methodologies.
Knowledge in physical design flows and methodologies (PNR, STA, physical verification).
Deep understanding of all aspects of Physical construction and Integration.
Knowledge in Physical Design Verification methodology LVS/DRC.
Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).
Great teammate.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon Physical Design Engineer
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design Team Manager, Servers, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design Team Manager within the Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will oversee the Intellectual Property (IP) and SoC VLSI design cycle from architecture to production. You will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads. You will be responsible for mentoring and developing team members and tech leads, driving improvements in leadership, technical execution, and design flows.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and System-on-Chips (SoCs).
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of one of the following areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Technical Lead, Servers, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use the ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
Responsibilities
Lead the Design Activities at IPs, SubSystems(S.S) and SoC.
Plan, execute, track progress, assure quality, report status of the assigned activity.
Lead a team of designers both directly and in teams.
Define the Block/SoC level design documents such as Micro Architectural Specifications.
Own IP, S, SoC strategies for clocks, resets, and debugs. Enforce global methodologies and drive enhancements.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
8 years of experience in RTL Design cycle from IP to SoC and from specification to production.
8 years of experience in Technical leadership.
Experience in the following areas: RTL Design, Design Quality checks, Physical Design aspects of RTL coding, and Power.
Preferred qualifications:
Experience with synthesis techniques to improve Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with Design For Test and its impact on Design and Physical Design.
Experience with a scripting language like Python or Perl.
Knowledge in one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, and ARM processors.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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21/06/2026
חברה חסויה
Location: Yokne`am
Job Type: Full Time
We are looking for a driven and enthusiastic Senior VLSI Engineer to join our outstanding Networking Silicon engineering team! You will be joining our rapidly growing Interposer team-a highly specialized and deeply impactful domain shaping the future of advanced silicon packaging.

If you have a strong background in the physical aspects of VLSI but haven't worked with interposer technology before, this is a unique opportunity to pivot and learn a cutting-edge domain. You will join a highly experienced group of industry-leading experts, working on the most advanced technology nodes in the world. Come take part in designing our groundbreaking chips, and enjoy working in a meaningful, growing, and highly professional environment where you make a massive impact.

What You Will Be Doing:

Mastering New Technologies: Learning the intricacies of advanced Interposer technology, working shoulder-to-shoulder with highly experienced domain experts.

Meticulous Execution & Ownership: Taking a high level of ownership over interposer projects. You will act as the technical anchor, driving timelines, managing complex workflows, and ensuring highly accurate, detail-oriented execution.

Driving Physical Implementation: Overseeing the physical design and integration aspects of complex VLSI designs.

Cross-Functional Collaboration: Taking part in project definitions towards POR, working in close interaction with other domains such as Architecture, Front-End, Back End and Packaging

Problem Solving & Automation: Resolving complex technical challenges in groundbreaking technology nodes and taking an active part in flow and methodology development.
Requirements:
What We Need To See:

B.Sc. / M.Sc. or equivalent experience in Electrical Engineering/Computer Engineering.

5+ years of overall experience in VLSI development, with a strong orientation toward the physical aspects of design (Physical Design, Backend, Chip Integration, etc.).

Exceptional attention to detail and program management skills. You are highly organized, timeline-driven, and thrive on structure and accuracy.

Proactive and independent mindset. We are looking for a highly motivated self-starter who can take ownership of complex tasks and independently drive technical efforts forward.

A strong passion and proven ability to learn new, highly complex technical areas.

Familiarity with physical design methodologies, flows, and EDA tools.

A proactive, creative mindset and a fantastic teammate.


Ways to stand out from the crowd:

Scripting and coding skills are a strong plus.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Design and Power Methodology Manager, Servers, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design and Power Methodology Team Manager within the Server Chip Design team, you will be responsible for managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL Design cycle IP and SoC.
8 years of experience in team management.
Experience with design methodologies, structural checks, and power estimation.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of IP and SOC architecture.
Knowledge of physical design techniques: SDC, Synthesis, EMIR, etc.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Lead physical design of complex SoC to tape-out while working with multiple team members.
Evaluate and develop physical design methodologies and decide on the SoC flow.
Work with architects and logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure.
Participate in design reviews and track issue resolution, and engage in technical and schedule tradeoff discussions. Create execution plans for projects and manage team efforts from concept to working silicon in volume.
Understand architecture and design specifications with the larger team, and define physical design strategies and tactics to meet quality and schedule goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
Experience in silicon implementation and chip integration.
Experience in ASIC development teams.
Experience in managing physical design teams working on digital designs that produce and deliver silicon.
Preferred qualifications:
Experience in extraction of design parameters and analyzing data trends.
Experience and breadth in engineering across physical design, top-level implementation, GDS tape-out.
Experience in top-level floor planning, block integration, static timing analysis, and sign-off.
Understanding of circuit design, device physics, and deep sub-micron technology.
Knowledge of delivery of high complexity silicon in technology process nodes.
Ability to lead cross-functional teams.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC and IP Design Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital reasoning design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience with reasoning synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power and design techniques.
Experience in reasoning design and debug with Design Verification (DV).
Preferred qualifications:
Experience with a scripting language like Python or Perl.
Experience with design sign-off and quality tools (e.g., Lint, clock domain crossing (CDC), etc.).
Knowledge of System on a chip (SOC) architecture and assertion-based formal verification.
Knowledge of design techniques.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate SDRAM (DDR), Advanced Extensible Interface (AXI), ARM processors.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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