דרושים » חומרה » system HW engineer (Haifa)

We are seeking a System HW Engineer to define, shape, and integrate solutions for the next generation of our cloud platforms.

As a System Engineer on the hardware team, you will define systems for our Labs' Network Interface Card (NIC) hardware, support the development and validation of our NIC, and help bring the NIC to mass production.
You'll lead the implementation of new hardware interface technologies and scale them to large-scale deployment, continuously delivering a world-class customer experience. This fast-paced, intellectually challenging position requires collaboration with technical experts, senior leaders, and multiple technology teams.


Key job responsibilities
Define and design systems to support K2 cards development and manufacturing.
Define and provide feedback to the design of the K2 Smart Network Interface Card.
Work with design partners and manufacturing sites, to enable healthy mass production of the K2 card.
Analyze and debug design/manufacturing/integration issues.
Continuously assess process capabilities and innovate to simplify processes, reduce costs, and shorten the time cycle of K2 cards development and manufacturing.
Collaborate with members of cross-functional teams, to gain knowledge and improve product design, processes, and quality.
Work with customers, to optimize the entire value stream and put together joint processes that will lead to improved time cycle and lower costs.
Willing to travel abroad one or two times a year, for a week at a time.

We are looking for a HW Lead Engineer to define, shape, and integrate cutting-edge solutions for the next generation of our cloud platforms.

As a HW Lead Engineer on the Nitro team, you'll own the hardware for Annapurna Labs' Network Interface Cards (NICs) used in compute and storage servers. You'll drive development and validation of Nitro cards from concept through mass production, ensuring they're ready to scale.

You'll lead new hardware interface technologies and bring them to large-scale deployment. This fast-paced role puts you at the intersection of technical innovation and customer experience. You'll collaborate with technical experts, senior leaders, and teams across multiple technology areas.

Key job responsibilities
- Design the Nitro Smart Network Interface Card for CMRI vertical use cases.
- Define Nitro card architecture that meets our server integration requirements.
- Partner with design teams and manufacturing sites to enable healthy mass production.
- Review, identify, and qualify second-source electrical components to ensure supply continuity.
- Debug design, manufacturing, and integration issues.
- Assess process capabilities and innovate to simplify processes, reduce costs, and shorten development cycles.
- Collaborate with cross-functional teams to improve product design, processes, and quality.
- Work with customers to optimize the value stream and create joint processes that reduce time and cost.
- Travel internationally 1-2 times per year for week-long trips.

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews

Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.

Required Design Team Manager, Servers, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design Team Manager within the Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will oversee the Intellectual Property (IP) and SoC VLSI design cycle from architecture to production. You will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads. You will be responsible for mentoring and developing team members and tech leads, driving improvements in leadership, technical execution, and design flows.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and System-on-Chips (SoCs).
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.

We are looking for an Experienced HW SERDES Engineer to join Annapurnas SPIV (System Platform Interface validation) team.
As a member of the SPIV team, you will own End-to-end subset of system PCIe SERDES interfaces across range of products through product life cycle:
1. Validation and qualification.
2. Integration.
3. Deployment and post-deployment support.
4. Failure analysis.
5. Pre silicon activities for new technologies.
As owner, you will set the strategy for PCIe SERDES qualification over multiple platforms, ensure the design worked well and drive complex system debugs involving HW and FW components.

You will define NPI practices and engage in pre-silicon efforts to explore new technologies and mitigate integration risks. You will enhance SERDES qualification results with large scale customer performance analysis to discover SERDES life-cycle issues and mitigate them.

This is a fast-paced, intellectually challenging position, and you will work with thought leaders in multiple areas of technology. We are changing industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Approve future products PCIe SERDES technologies.
- Define new products SERDES qualification and validation strategy and lead the execution.
- Engage integrations of Annapurna Labs products with other vendors PCIe HW components.
- Support ongoing integrations of PCIe SERDES in new products.
- Lead triage, PCIe SERDES debug and root cause analysis of systems in AWS data centers.
- Drive and maintain training, quality documentation and collateral to improve in-fleet operation.

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

We are looking for a System Engineer with Software Engineering background to be part of defining, shaping and integrating solutions to next generation of our cloud platforms.

We are looking for an exceptional engineer to own the development, testing, and monitoring of the manufacturing health of Amazon Graviton server products. You will be part of a team integrating new silicon, hardware, firmware, and software into a revolutionary system architecture.

Key job responsibilities
Lead triage, debugging, and root cause analysis of systems in our data centers.
Enhance troubleshooting capabilities and drive closure of in-fleet problems.
Analyze customer workflows and requirements to provide targeted resolutions.
Collaborate with Annapurna Labs monitoring team and root cause teams to improve product quality and reliability in fleet operations.
Represent the customer voice by providing fleet operation insights and requirements to Annapurna Labs' ASIC design, software development, QA, and architecture teams.
Develop and maintain training materials, quality documentation, and collateral to improve in-fleet operations.
Design and implement tools and scripts to support projects and customize solutions based on requirements.
Travel as needed, approximately 2-4 times per year.