דרושים » הנדסה » Power Electronics Engineer

Rק/וןרקג Power and Signal Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.

Required Power and Signal Integrity Engineer
About the job
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
Responsibilities
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Senior Board Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of םור direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Hardware Board Design Engineer, you will own the electrical design of complex High Performance Computing (HPC) systems. You will drive the development of next-generation AI accelerator boards, ensuring they meet signal integrity, power delivery, and thermal requirements. You will work cross-functionally with Silicon (ASIC), Signal Integrity, Power, Mechanical, and Manufacturing teams to bring products from concept to mass production.
Responsibilities
Lead the schematic capture and component selection for high-density, multi-layer Printed Circuit Boards (20+ layers) incorporating high-power ASICs (TPUs/CPUs), FPGAs, and high-speed memory (High Bandwidth Memory/DDR5).
Design and validate high-speed interfaces including Peripheral Component Interconnect Express (PCIe) Gen 6.0/7.0, 400G/800G/1.6T ethernet (PAM4). Collaborate with Signal Integrity (SI) engineers to define routing constraints and stack-up.
Design multi-phase power regulators (VRMs) capable of delivering 1000A currents with fast transient response for AI processors.
Work closely with PCB layout designers to guide placement and routing of critical signals and power planes.
Lead the lab bring-up of first-silicon/first-board. Debug complex hardware issues using oscilloscopes, Time-Domain Reflectometers (TDRs), and logic analyzers. Root-cause failures to component, assembly, or design issues.

Required Staff Analog Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Analog Design Engineer, you will design and integrate analog sub-systems. You will be responsible for ensuring the analog front-end (AFE) communicates with the digital signal processor (DSP), the package and silicon are a single electrical entity. Your work will bridge the analog and digital worlds to enable industry-leading performance.
The ML, Systems, & Cloud AI (MSCA) organization, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our services (Search, YouTube, etc.).
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Own the architecture and implementation of a major sub-component, such as the entire receiver AFE or the clocking/phase-locked loop (PLL) distribution network.
Design the critical suspension system (e.g., equalization/continuous-time linear equalizer (CTLE), analog-to-digital converter (ADC) that allows the digital core to function perfectly despite a noisy, high-loss channel.
Lead the definition and design of test chips to prove out novel topologies and circuit techniques in next-generation gate-all-around (GAA) nodes.
Work with DSP, firmware, and system architects to define hardware/software partitioning and interface specifications.
Provide technical guidance and mentorship to engineers on the team.

we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.

As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities


Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews