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לפני 17 שעות
חברה חסויה
Location: Haifa
Job Type: Full Time
The main scope of this role is to lead our silicon debug efforts and provide insights related to complex design issues, open test holes, low yield events and reliability failures, related to our cutting-edge silicon-based products embedded into our cloud.

Key job responsibilities:
Your responsibilities will include, but not be limited to:
Utilizing testers and system boards in combination with optical debug and fault isolation (FI) techniques such as: laser stimulation operations (OBIRCH, LADA, etc.), laser probing and emission microscopy.
Root cause failures and performance limitations and drive decision making related to test coverage and yield issues.
Analyzing and diving deep into fundamental aspects of material/device operations and light-matter interactions.
Owning the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products.
Using test diagnostic techniques.
Working directly with other teams: Test, DFT, HW, SW, Backend, Q&R & foundry.
Research and development of novel and new debug techniques.
Requirements:
Basic Qualifications:
- B.Sc. degree in electrical engineering with at least 5 years of experience in FI and optical debug in the Industry, or alternatively, a Ph.D./M.Sc. in electrical engineering.
- Basic knowledge in IC design and manufacturing.
- Strong education background in semiconductor and device physics.
- Solid understanding in electro-optics and lab experience.

Preferred Qualifications:
- Experience with electronic test equipment: testers, scopes, spectrum analyzers, lock-in amplifiers, etc...
- Hands on lab work, including experience with optical equipment.
- Experience in device characterization.
- Experience or knowledge in SEM and FIB. Knowledge in DFT (SCAN, BIST, JTAG, diagnostic tools, etc.) and debug.
This position is open to all candidates.
 
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27/01/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
AWS Utility Computing (UC) provides product innovations - from foundational services such as our companys Simple Storage Service (S3) and our company Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWSs services and features apart in the industry. As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (Iot), Platform, and Productivity Apps services in AWS. Within AWS UC, our company Dedicated Cloud (ADC) roles engage with AWS customers who require specialized security solutions for their cloud services.
Annapurna Labs develops the semiconductor platforms of the future for AWS, creating amazing products with complex architectures that push the boundaries of many fields. our company Web Services, the world's largest cloud provider, offers a highly reliable, scalable, and cost-effective infrastructure platform that powers hundreds of thousands of businesses in more than 190 countries. This is an exciting opportunity to join our company and contribute to bringing our next-generation products for the cloud market to the production stage.
Key job responsibilities
Analyze foundry Wafer Acceptance Test (WAT) data from development, corner lots, and qualification lots.
Collaborate with Test Engineering (TE) and Quality & Reliability (Q&R) teams to ensure test quality.
Recommend test plans and limits for production lots, corner lots, and pre-/post-qualification lots based on system specifications, yield, and Cpk targets.
Identify quality and reliability concerns and collaborate with TE, Q&R, and Failure Analysis (FA) teams to drive resolution.
Manage Continuous Improvement Process (CIP) activities with the foundry.
Drive test-time reduction activities based on Wafer Sort (WS) and Final Test (FT) production data.
A day in the life
As a Senior Product Engineer, you will play a crucial role in ensuring that the production of Annapurna Labs semiconductor products meets our customers' demands. Your responsibilities will include monitoring and analyzing production data, collaborating with various teams including Test Engineering and Foundry, Quality & Reliability (Q&R), Failure Analysis (FA), leading process and yield improvement initiatives
optimizing throughput, enhancing test quality, and reducing test time.
In this role, you will be fully exposed to the semiconductor production flow of all Annapurna Labs products, all semiconductor testing methodologies, and FAB process yield improvement activities.
Requirements:
- Bachelor's/Master's degree in Electrical Engineering, Physics or other relevant Engineering degree, with practical work experience.
- At least 10 years experience working in the semiconductor industry, in one of the following post-silicon fields - Q&R, Test, Foundry, or Product Engineering.
- Demonstrate broad experience with semiconductor fabrication processes - preferably experience working with TSMC.
- Solid understanding of semiconductor devices, layout, and device characterization.
- Familiar with silicon manufacturing and testing flows on various test platforms.
- Excellent written and verbal communication skills.
- A proactive team player, with the ability to work in a rapidly evolving environment.
- Strong analytical and problem-solving skills.
- Experience in analyzing production data using BI tools and analysis tools such as JMP.
Preferred Qualifications
- Knowledge of advance technologies - GAA and backside power grid.
- Knowledge of DFT methodologies for SCAN and MBIST.
- Experience working with external test/assembly OSATs.
- Familiar with failure analysis techniques such as LADA, FIB, SEM, IR, EMMI, and CSAM.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Material Science, Physics, Microelectronics, a related technical field, or equivalent practical experience.
8 years of experience in semiconductor foundry technologies, advanced process nodes and product engineering or yield analysis.
Experience in leading post-silicon yield improvement, including root cause analysis, defect correlation, and process debugging.
Experience with characterization of silicon interaction with package thermal and mechanical stress.
Preferred qualifications:
15 years of experience in test engineering, product engineering, foundry technology, advanced packaging development, or product yield engineering.
Experience in debugging IP integration issues (e.g., HBM, SerDes, PCIe) and advanced packaging failures (2.5D/3D, flip-chip).
Ability to drive technical feedback loops between foundry partners, internal architecture and design teams, and Post-Silicon (Post-Si) teams to resolve manufacturing limiters.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
our company's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets our company's standards of quality and reliability.
As a Senior SoC System Test Engineer, you will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization, and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will work with various groups to deploy screening methodologies and flows for data processing, analytics, and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, qualification strategies, and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Validate test solutions on system-level platforms and prepare for mass production.
Work with hardware and software teams to evaluate functional device yield and performance across various operating conditions.
Develop effective production screens to reduce Defective Parts per Million (DPPM).
Assess test escapees and localize failures, implement containment measures in the manufacturing test flow, and partner with manufacturing, test, quality and reliability teams to identify root cause and implement corrective actions.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
5 years of experience in system level test engineering.
Experience with Python or C/C++.
Experience in silicon System level components/LinuxOS.

Preferred qualifications:
Masters degree in Electrical Engineering, Computer Engineering, Computer Science, or related fields.
10 years of experience in test engineering and product engineering.
Experience with CPU/GPU and SoC architecture, design, validation and debug.
Experience in SLT hardware design and proliferation (e.g., system boards, peripheral devices, sockets, handler kits, and thermal control solutions).
Ability to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the whole ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in JTAG and iJTAG protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help build SoCs by driving quality and reliability processes from the Integrated Circuit (IC) perspective. Working with various cross-functional teams, you will develop quality and reliability specifications, develop and deploy design guidelines, and develop and execute test plans. Within the larger organization, you will collaborate with global hardware quality and reliability, silicon design, validation, and engineering teams. You will have an understanding of IC flows, wafer processing, testing, qualification, yield, reliability, and failure analysis.
The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define and lead qualification hardware and test developments in front of internal teams and external vendors.
Define and execute Silicon and package qualification activities (e.g., HTOL, ELFR, ESD/LU, b/HAST, THB, etc.).
Extract, manipulate, and analyze large volumes of data from Silicon and package qualification programs (e.g., HTOL, ELFR, ESD, LU, UHAST, TCT, etc.), High Volume MFG, and field returns to identify failure mechanisms, reliability trends, and opportunities for yield, quality, and reliability improvement.
Own cross-functional investigation of IC quality and reliability issues to identify root causes and develop solutions (e.g., RMA Triage, Analytics, Failure Analysis, etc.).
Develop and implement physics-based statistical Quality and Reliability models (e.g., ELF, TDDB, NBTI, HCI, Time zero failures, etc.) to predict silicon device failure mechanisms, degradation patterns, and lifetime behaviors.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Materials Science, a related technical field, or equivalent practical experience.
2 years of experience in IC silicon quality or reliability.
Experience in semiconductor CMOS technology, device physics, failure mechanisms, and accelerated test methodologies.
Experience in reliability modeling, data analytics, and statistics.
Preferred qualifications:
Experience in semiconductor reliability, manufacturing processes (e.g., fab, assembly, test), or IC and packaging failure mechanisms and related failure analysis.
Experience in data analytics, especially to identify commonalities and abnormalities.
Knowledge of Design-for-Reliability guidelines and implementation techniques.
Familiarity with test methods and hardware for silicon qualification (e.g., HTOL chambers, ESD, LU, etc.).
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
2 years of experience in the signal and power integrity field.
Preferred qualifications:
5 years of experience with signal and power integrity modeling and simulation for high-speed interfaces (e.g., LPDDR, MIPI, UFS, PCIe, USB).
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Experience in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, RTL coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis dft etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power including low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8544190
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27/01/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
AWS Utility Computing (UC) provides product innovations - from foundational services such as our companys Simple Storage Service (S3) and our company Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWSs services and features apart in the industry. As a member of the UC organization, youll support the development and management of Compute, Database, Storage, Internet of Things (Iot), Platform, and Productivity Apps services in AWS. Within AWS UC, our company Dedicated Cloud (ADC) roles engage with AWS customers who require specialized security solutions for their cloud services.
Annapurna Labs, as part of AWS, is looking for an IC Customer Q&R Engineer.
As an IC Quality and Reliability Engineer, you will play a crucial role in ensuring Annapurna Labs' semiconductor products meet customer demands. Your responsibilities will include direct work with Annapurna's customers to jointly debug failures and reduce IC related failures, support RMA analyses
In this role you will be completely exposed to the semi-conductor production flow of all Annapurna Labs products, semi-conductor testing methodologies and FAB process yield improvement activity.
Requirements:
Basic Qualifications
* B.Sc. degree (M.Sc an advantage) in Electrical Engineering, Applied Physics, Materials Science or related fields with practical work experience. * 5+ years' experience in semiconductor reliability test definition, execution and analysis. * Knowledge in semiconductor physics, VLSI IC design, manufacturing, testing and FA, reliability engineering and statistics fundamentals. * Good knowledge of semiconductor fabrication process. * Experience in IC- and system-level testing and debug.
Preferred Qualifications
* Familiar with semiconductor industry production flows. * Experience working with OSATs (Outsourced Semiconductor Assembly and Test) and ODMs (Original Design Manufacturers). * Programming capabilities.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8520010
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help to develop and maintain emulation infrastructure, tools, and workflow methodologies supporting our Application-Specific Integrated Circuit (ASIC) projects. You will provide emulation infrastructure and methodologies for supporting these projects. You will work with other emulation team members as well as designers, verification engineers, and software teams. You will work with our external vendors, lab support teams, networking and security, and Electronic Design Automation (EDA) tooling and methodology teams to deliver emulation-based prototyping capabilities for our ASIC projects. You will also assist in compiling projects specifying our prototyping platforms, debugging issues in both infrastructure and design, supporting the hardware and lab bring up, and verifying our ASIC systems.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Help in maintaining and upgrading emulation infrastructure and act as a primary interface to emulation vendors.
Explore emulation methodologies, gather feedback from the team, and implement emulation workflows and methodologies.
Create tooling and automation to support emulation EDA tools, licensing, and job management in our company infrastructure.
Support emulation team members with debugging hardware, tooling, and project-specific issues.
Help to bring up external interfaces (e.g., USB, PCIe, Ethernet, etc.) on the emulation platforms and create standalone test cases for tool issues encountered in the emulation compile and runtime flows.
Requirements:
Minimum qualifications:
Bachelor's degree in Computer Science, Electrical Engineering, or equivalent practical experience.
Experience with associated EDA tools, automation, and flow enhancements.
Experience using command debug tools (e.g., Verdi, SimVision/Indago, GDB) and programming in C, C++, Perl, TCL, or Python.
Experience with emulation systems, maintenance, upgrades, and methodology enhancements.
Preferred qualifications:
Master's degree in Computer Science, Electrical Engineering, or a related technical field.
Experience deploying EDA tools into distributed environments.
Experience with system administration, networking, and security systems.
Experience with Register-Transfer Level (RTL) design, Verilog, simulation, System Verilog, and assertions.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544172
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