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11/02/2026
Location: Yokne`am and Tel Aviv-Yafo
Job Type: Full Time
We are currently seeking a Power Integrity Engineer. You will collaborate closely with our teams in the USA and India, drawing on extensive knowledge, technologies, and tools. As part of our team, you will contribute to the development of our Ethernet switch system product line, supporting the process from concept through design, implementation, verification, and release to customers. If you enjoy working with talented individuals to achieve ambitious goals, we could be the ideal place for you. Our team is dynamic, working with cutting-edge and unique technology. If youre someone who thrives on challenges, we invite you to join this diverse team and make a significant impact!

What you'll be doing:

Ensuring robust power integrity in physical design to optimize power delivery.

Design and optimize physical design solutions for power integrity.

Perform power integrity analysis and mitigation.

Focal point for PI for partitions owners.

Collaborate with hardware and design teams on power delivery strategies.

Utilize tools and flow in advance technology to meet project development.
Requirements:
What we need to see:

B.Sc. or higher in Electrical Engineering or related field: Solid educational foundation in electrical engineering principles, particularly in power integrity and physical design.

3+ years of experience in power integrity engineering: Proven experience in power integrity analysis, mitigation, and optimization, especially in the context of high-performance computing or networking hardware.

Proficiency with industry-standard PI tools: Hands-on experience with tools such as Cadence, Ansys, or other EM simulation tools, including power delivery network (PDN) analysis and design.

Ability to collaborate across teams: Strong communication and teamwork skills, with a track record of working closely with hardware and design teams to implement power delivery strategies.

Adaptability and problem-solving skills: Ability to thrive in a dynamic, fast-paced environment where quick thinking and creative solutions are often required.

Ways to stand out from the crowd:

Advanced degree (M.Sc./Ph.D.) in Electrical Engineering: Specialization in power integrity, signal integrity, or related fields, with a focus on cutting-edge research or projects.

Programming skills: Proficiency in Python, tcl, or other relevant programming languages for automating analysis or enhancing tool capabilities.

Innovative mindset: A demonstrated ability to push the boundaries of whats possible in power integrity design, contributing to NVIDIAs legacy of continuous innovation.
This position is open to all candidates.
 
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08/02/2026
Location: More than one
Job Type: Full Time
We are looking for a Senior Signal & Power Integrity Engineer. We work closely with NVIDIA sites in USA and China and have access to extensive knowledge, technologies and tools. Yet we are responsible for our own product line of PHY ICs . Taking the products from concepting, through design, implementation, verification and release to customers. If you thrive working with highly skilled people that enjoy reaching challenging goals then NVIDIA in might be the perfect workplace for you. This is a dynamic team working with state of the art, unique technology. If you are someone that loves a challenge, come join this diverse team and help move the needle !

What you'll be doing:

Design high frequencies channels up to 400Gb/s per lane for PCBs, packages, connectors and cables.

Design layout guidelines for our systems.

Simulate passive and active elements in 3D and 2D simulation tools.

Measure systems in the lab using Network Analyzer, TDR and scope.

Master InfiniBand, Ethernet and PCI-Ex Layer 1 specifications and implementation methods.

Work in an intense environment and control multi-discipline expertise.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering (or equivalent experience)

5+ years of experience

Familiar with electromagnetics, specifically electromagnetic waves including transmission line theory and via properties.

Expert level proficiency with EM tools (such as Ansys EM, CST, etc.).

Familiarity with high-speed I/O design concepts including clock generation, transmitter & receiver design, and equalization schemes.

Experience in Lab measurements including VNA & TDR experience, interface timing budgets, and system modeling.

Master InfiniBand, Ethernet, and PCI-Ex Layer 1 specifications and implementation methods.

Ability to work in an intense environment and control multi-discipline expertise.

Ways to stand out from the crowd:

M.Sc./Ph.D. in Electrical Engineering and PDN analyses including model generation and time domain simulation.

Familiar with NRZ/PAM-4 signaling schemes.

Analyses involving co-simulation of circuits and PDN models.

Experience with MATLAB, Python, and C.

Exposure to TSV (Through-Silicon-Via) modeling and analysis.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
2 years of experience in the signal and power integrity field.
Preferred qualifications:
5 years of experience with signal and power integrity modeling and simulation for high-speed interfaces (e.g., LPDDR, MIPI, UFS, PCIe, USB).
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Experience in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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08/02/2026
Location: Yokne`am
Job Type: Full Time
We are looking for a Senior PCB Design Layout Engineer join the Hardware Layout team.

We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing. We are a learning machine that constantly evolves by adapting to new opportunities that are hard to seek, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence. Make the choice to join us today.

What youll be doing:

Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all our business units (Information Network, GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI).

Complete development of CAD layout from detailed component placement, constraints management, with a concept of topology and signal and power integrity.

Be responsible for the design releases required generation of artwork files, ODB++, test reports, and electronic PCB documentation.

Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specification.
Requirements:
What we need to see:

B.Sc. in Electrical Engineering or related field; advanced degree preferred.

5+ years of overall relevant practical experience

Proven leadership experience, with a track record of successfully managing teams and projects.

Excellent communication and interpersonal skills, with the ability to collaborate effectively across teams.

Detail-oriented approach with a focus on quality and reliability in PCB layout design.

Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities.

Strong problem-solving skills and the ability to troubleshoot complex design issues.

Ways to stand out from the crowd:

Proficiency in PCB design tools such as Cadence Allegro, or Mentor Graphics.

Familiarity with industry standards and regulations related to PCB layout and manufacturing processes.

Strong understanding of high-speed digital design principles and signal integrity considerations.
This position is open to all candidates.
 
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08/02/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
Are you ready to be part of a team that's pushing the boundaries of technology and innovation? At NVIDIA, we're leading the way in transforming computer graphics, PC gaming, and accelerated computing. We're now beginning the next era of modern AI computing. As a Backend Chip Integration Engineer, you will play a crucial role in building the future of our powerful technologies. This is an outstanding opportunity for those who are passionate about VLSI physical design and automation flows.

What you'll be doing:

Define chip interface and silicon interposer interface, focusing on their physical location and netlist.

Develop automation flows for chip integration and power grid implementation.

Perform power integrity analysis of the interposer power grid to ensure flawless performance.

Collaborate with cross-functional teams to successfully implement world-class solutions.

Contribute to the continuous improvement of our integration processes with your innovative ideas and expertise.
Requirements:
A degree in Electrical Engineering or a related field.

2+ years of experience in VLSI physical build and integration flows automation.

Strong knowledge in VLSI build/layout and basic programming/scripting skills.

Familiarity with EDA layout tools such as Cadence Virtuoso, Synopsis Fusion Compiler, or Siemens Calibre.

Advantageous to have experience with UNIX, VBA, TCL, or PERL scripting.

Experience or knowledge in power integrity is a plus.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you will conduct Place and Route experiments and sensitivity analyses to influence standard cell library architecture, metal stack definitions, and design rules. You will collaborate with Foundry, IP, and Architecture teams to identify Power, Performance, and Area (PPA) bottlenecks and drive System Technology Co-Optimization (STCO) initiatives.
Your work will involve performing high-fidelity physical implementation sweeps, analyzing the impact of scaling boosters, and developing automated methodologies to quantify PPA gains. By navigating the trade-offs between process complexity and design performance, you will ensure our companys hardware achieves efficiency and power density.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute high-fidelity Place and Route experiments to evaluate the PPA impact of advanced process features, library architectures, and design rule variations on datacenter-class IP.
Drive Design Technology Co-Optimization by collaborating with foundries and internal technology teams to define optimal metal stacks, track heights, and scaling boosters (e.g., backside power delivery, buried power rails).
Quantify process entitlement through systematic benchmarking of logic and memory macros, identifying bottlenecks in power density and timing closure for next-generation nodes.
Develop automated physical design methodologies and flows to accelerate technology pathfinding and enable rapid what-if analysis of emerging transistor architectures.
Influence System Technology Co-Optimization by partnering with Hardware Architects and Circuit Designers to translate process-level innovations into system-level performance gains.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
2 years of experience in Physical Design (RTL-to-GDS) or Technology Development, focusing on advanced nodes (e.g., 7nm, 5nm, or below).
Experience with industry-standard Place and Route (P&R) tools and Static Timing Analysis (STA) tools.
Experience in CMOS device physics, FinFET/nanosheet architectures, and the impact of layout parasitics on PPA.
Experience in scripting and automation using Tcl and Python (or Perl) to manage design sweeps and data extraction.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in Design Technology Co-Optimization (DTCO), including standard cell library characterization, metal stack optimization, and evaluation of scaling boosters (e.g., backside power delivery).
Experience working with major foundry technology files (PDKs) and interpreting Design Rule Manuals (DRM) to guide physical implementation.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, RTL coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis dft etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power including low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Develop and optimize the overall layout of the chip, including partitioning, macro and IP placement, and pin placement.
Design and implement efficient power delivery networks power grids to ensure stable power to all parts of the chip.
Develop and validate high-performance, low-power clock networks (e.g., Clock Tree Synthesis (CTS)) to ensure proper synchronization across the entire chip.
Develop, enhance, and maintain custom scripts (e.g., Tcl, Perl, Python) for automation and improved efficiency.
Conduct extensive Design Rule Checks (DRC) to ensure the layout adheres to manufacturing rules, performing Layout Versus Schematic (LVS) checks to verify that the physical layout matches the logical design.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with physical design flows and methodologies (e.g., RTL2GDS).
Experience with semiconductor process technologies (e.g., deep submicron, advanced nodes like 5nm and below), and device physics (e.g., MOSFET/FINFET).
Experience with Design For Testability (DFT) and low-power design methodologies.
Experience with UPF (Unified Power Format) and its application in physical design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture, or a related field.
Experience with scripting languages such as Perl, Python, or Tcl.
Excellent analysis skills, with the ability to understand, debug, and resolve issues in the design flow.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo
Job Type: Full Time
We are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, we are the place to develop your skills, innovate, and grow your career.
Why join us?
* Work on cutting-edge automotive projects.
* Learn from a talented and supportive team.
* Gain exposure to real-world automotive challenges.
* Grow your career in a collaborative and inspiring environment.
If youre ready to take the next step in your career and be part of something meaningful, wed love to meet you!
About The Position:
As a Junior ASIC Design Engineer, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where youll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions.
* Support and learn from real emulation platforms used in production-grade designs.
* Contribute to RTL implementation and gain practical experience in design flows.
* Assist with verification and backend (BE) activities, learning industry best practices.
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.
Requirements:
* B.Sc. in Electrical Engineering (graduate with excellence or a 3rd-year student).
* Strong interest in ASIC / chip design and hardware development.
* Basic understanding of RTL design concepts - an advantage.
* Any exposure to programming or scripting (e.g., Python, TCL, PERL) - an advantage.
* Previous academic or practical experience in relevant fields - an advantage.
* Good English communication skills, both written and verbal.
* Team player with a positive attitude, curiosity, and willingness to learn.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8476259
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
08/02/2026
Location: Ra'anana and Yokne`am
Job Type: Full Time
We are now looking for Hardware Senior Manager for our Hardware Switch Group! The team leads the development of networking infrastructure for our next-generation data centers focusing on accelerated performance while enabling optimized end to end GPU connectivity. As a leader to our Hardware Engineering team, you'll guide, encourage, and drive a team of highly knowledgeable hardware engineers, providing them with interesting and ambitious assignments and enabling them to stay creative and motivated while delivering products on schedule.

What you'll be doing:
Build the best team to implement and executing high-performance systems
A key member of team technical management team developing world-class switch designs
Lead Pioneering Switch System design from concept to mass production
Collaborate and integrate with all HW project disciplines: Board Design, Mechanics, Thermal, PCB Layout, Production, Software/Firmware, RTL and more
Planning the work of your team on multiple simultaneous development projects with a broader leadership team
Managing direct reports, goal setting, coaching, performance appraisals, career planning and compensation recommendations
Schedule projects, make realistic estimates of outcomes and work to make projects timely and successful for high volume manufacture.
This position is very hands-on and will require you to be intimately familiar with the entire design flow. From a technical standpoint, you will be hands-on and driving the engineering teams working the following parts of the project: specification definitions, electrical schematics, component selection, layout guidance, hands-on testing in a lab environment, accompanying production and qualification processes, micro-architecture, verification, characterization, design for testability, cost ,reliability and more.
Requirements:
What we need to see:
A Bachelors, Masters Degree in Electrical Engineering or Computer Engineering or relevant related field (or equivalent experience).
12+ overall years of industry experience in architecture, design, and methodology of cutting-edge board design development. 8+ years of technical design management experience.
Proven experience in leading multi-disciplinary projects.
Hands-on lab skills.
Experience in leading Multi layer PCB design.
Experience in high current power delivery design.
Comprehensive understanding of RTL implementations (CPLD/FPGA).
Ability to provide insight and guidance on trade-offs between power, performance, and area appropriately to meet the requirements of the product.
Strong interpersonal and communication skills, ability to quickly build relationships and prioritize/align conflicting needs and teams.
Must have significant hands-on experience managing systems from concept through production.

Ways to stand out from the crowd:
Experience in data-center switches products design for high volume manufacturing
Proven knowledge in high speed design (25Gb/s and above)
Experience in embedded systems design
Knowledge in advanced PCB technology
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8535827
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