דרושים » הנדסה » CAD -Physical Design

משרות על המפה
 
בדיקת קורות חיים
VIP
הפוך ללקוח VIP
רגע, משהו חסר!
נשאר לך להשלים רק עוד פרט אחד:
 
שירות זה פתוח ללקוחות VIP בלבד
AllJObs VIP
כל החברות >
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 2 שעות
חברה חסויה
Location: Haifa and Herzliya
Job Type: Full Time
As a PNR/PD-CAD team member, you will have an impact on a wide range of activities and domains in the PD world. The team develops and supports utilities that enable an efficient work environment for the physical design teams across the world.

The role includes exploring new technologies and methodologies of first-of-its-kind designs, and the complex implementation of designs from small ones to the largest possible.
The job includes hands-on work and impact on all aspects of the design cycle, from infrastructure-related automation for design efficiency through developing internal PNR flows, which will enable improved designs - from PNR implementation through developing infra, signoff flows & verification utilities.

Responsibilities:
The job includes constant work with different teams and disciplines that interface with the PNR world, which includes Timing, power delivery, synthesis, Physical Verification, and more.
Along with the different disciplines, you will work with different teams, from vendors, PD team members and other CAD team members and discipline owners across the world to enable and improve the productivity of the PD flows.
Requirements:
Minimum Qualifications:
5+ years experience in ASIC P&R and flow development.
Experience with all aspects of ASIC physical design, including floorplanning, power-distribution, multi-voltage design, placement, CTS, and routing.
Strong TCL/Python scripting skills and LLM/GenAI implementation methods. Candidate should have experience developing complex algorithms, managing, and regressing P&R flows.
The candidate should be familiar with design signoff issues.
Hands-on Innovus experience.

Preferred Qualifications:
BSc/ MSc in Electrical Engineering or Computer Science.
This position is open to all candidates.
 
Hide
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8521552
סגור
שירות זה פתוח ללקוחות VIP בלבד
משרות דומות שיכולות לעניין אותך
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Lead and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Manage a DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the whole ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in JTAG and iJTAG protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8473549
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers include our companyrs, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Develop and optimize the overall layout of the chip, including partitioning, macro and IP placement, and pin placement.
Design and implement efficient power delivery networks power grids to ensure stable power to all parts of the chip.
Develop and validate high-performance, low-power clock networks (e.g., Clock Tree Synthesis (CTS)) to ensure proper synchronization across the entire chip.
Develop, enhance, and maintain custom scripts (e.g., Tcl, Perl, Python) for automation and improved efficiency.
Conduct extensive Design Rule Checks (DRC) to ensure the layout adheres to manufacturing rules, performing Layout Versus Schematic (LVS) checks to verify that the physical layout matches the logical design.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with physical design flows and methodologies (RTL2GDS).
Experience with semiconductor process technologies (deep submicron, advanced nodes like 5nm and below), and device physics (MOSFET/FINFET).
Experience with Design For Testability (DFT) and low-power design methodologies.
Experience with UPF (Unified Power Format) and its application in physical design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture, or a related field.
Experience with scripting languages such as Perl, Python, or Tcl.
Excellent analysis skills, with the ability to understand, debug, and resolve issues in the design flow.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8472864
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will be part of a team developing Application-specific integrated circuits (ASICs) used to accelerate networking in data centers. You will have multiple responsibilities in areas such as project definition, design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators.You will also be responsible for performance analysis for an end-to-end networking stack using your knowledge.
The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users are our companyrs, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead an ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement data center networks.
Define hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
Experience developing Register-Transfer Level (RTL) for ASIC subsystems.
Experience with cross-functional engagement in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with software teams optimizing the hardware/software interface.
Experience working with design networking like: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in Transmission Control Protocol (TCP), IP, Ethernet, Peripheral Component Interconnect Express (PCIE) and Dynamic Random Access Memory (DRAM) including Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
Experience architecting networking switches, end points, and hardware offloads.
Understanding of packet classification, processing, queuing, scheduling, switching, routing, traffic conditioning, and telemetry.
Proficiency in procedural programming language (e.g., C++, Python, Go).
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8473051
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing etc. You will develop/define design options for performance, power and area.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users are our companyrs, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience in logic design and debug with Design Verification (DV).
Experience with microarchitecture and specifications.
Preferred qualifications:
Experience with logic synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (Lint, CDC, VCLP etc.).
Experience in a scripting language like Python or Perl.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of one of these areas, PCIe, UCIe, DDR, AXI, ARM processors family.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8473037
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and OSATs. This is an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You'll help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will have an understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will help design, deploy and maintain hardware required to screen high performance compute silicon at various stages of the manufacturing pipeline.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage ATE platform setup (including loadboard/probecard design) and change kit, SLT bench platform, and handler.
Identify and screen potential vendors (including technological and budgetary assessment) and track and verify progress at all stages of the design.
Define probecard and loadboard requirements based on testing strategy, accounting for test time, tester memory, and budget.
Review SI/PI simulations and final design signoff.
Validate probecard and loadboard hardware and open testing pipeline.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience in multi-disciplinary semiconductor hardware engineering and systems.
Experience in loadboard or probecard design, including SI/PI simulations, layout reviews, and schematic reviews.
Experience in Automated Test Equipment (ATE) test methodologies and their impact on hardware requirements/design.
Preferred qualifications:
Experience with semiconductor handlers, including Chroma or Hontech.
Experience in BurnIn hardware.
Experience managing the complete test hardware life-cycle, from initial design and NPI enablement through to final production deployment.
Experience in multi-disciplinary thermo-electro-mechanical systems.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8473098
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
A problem isnt truly solved until its solved for all. Thats why Googlers build products that help create opportunities for everyone, whether down the street or across the globe. As a Technical Program Manager at Google, youll use your technical expertise to lead complex, multi-disciplinary projects from start to finish. Youll work with stakeholders to plan requirements, identify risks, manage project schedules, and communicate clearly with cross-functional partners across the company. You're equally comfortable explaining your team's analyses and recommendations to executives as you are discussing the technical tradeoffs in product development with engineers.
As a Technical Program Manager for Silicon engineering, you will use your technical and management experience to justify, plan, coordinate, and deliver custom silicon products. You will plan programs and manage their execution from early concepts through development to tapeout and production. You will collaborate closely with architecture, design, verification, physical implementation and manufacturing teams throughout the SoC execution life-cycle. This includes making technical decisions for the chip designs and methodology, driving project schedules, identifying risks and communicating them to all stakeholders, and managing partner teams.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Justify, plan, and coordinate the delivery of custom silicon products, ensuring they meet technical specifications and business objectives.
Drive alignment and collaboration across the internal silicon ecosystem from design and verification to supply chain and quality to ensure seamless execution and operational readiness.
Lead the development of credible schedules and milestones, proactively identifying technical or timeline risks and negotiating trade offs between what is needed and what is possible.
Guide the selection, qualification, and management of external partners serving as the primary technical and program interface.
Negotiate agreements and Statement of Works (SOWs) while managing vendor performance, quality, and costs to protect the supply chain against disruptions and capacity constraints.
Requirements:
Minimum qualifications:
Bachelor's degree in Computer Science, Electrical Engineering or equivalent practical experience.
8 years of experience in program management.
Experience in one or more areas like architecture, design, verification, implementation, or validation with seven or more cycles of chip development.
Experience in transformational program management on technical cross-functional projects.
Preferred qualifications:
Master's degree or PhD in Engineering, or a related technical field.
Experience with NPI processes, yield management, and product qualification.
Experience with semiconductor processing.
Experience in managing and collaborating with external semiconductor manufacturing partners, including wafer foundries, Outsourced Semiconductor Assembly and Test (OSATs), and test houses.
Ability to lead, influence, and motivate cross-functional/cross-geo teams in a environment without direct authority.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8475357
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
11/01/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for an experienced ASIC Physical Design Engineer to join our dynamic team, Join the ride as we spearhead the next revolution in electronics!
What Youll Do:
Own and continuously improve our smooth product backend integration methodology, flows, and best practices using Cadence and Synopsys tools.
Develop, maintain, and scale automation and infrastructure (TCL / Python) to improve quality, predictability, and turnaround time.
Collaborate closely with multiple teams to ensure smooth handoffs and high-quality product.
Support field teams on complex technical issues when needed.
Responsibilities:
Implementation of ASIC units using advanced flows
Developing BackEnd methodology using Cadence and Synopsys tools
Build and develop scripts for physical design implementation
Support Field team with customer issues.
Requirements:
3-5 years of hands-on experience with ASIC physical design (RTL-to-GDS).
Proven experience taking multiple full-chip SoCs from RTL through tapeout.
Deep knowledge of Cadence and/or Synopsys backend flows (experience with both is a strong plus).
Strong understanding of PnR, timing closure, SI, power, DRC/LVS, and signoff.
Excellent debugging and problem-solving skills.
Strong scripting skills in TCL and Python.
Nice-to-have / Advantage:
Experience with multiple power domains and low-power design techniques.
Background that spans both frontend (RTL) and backend.
Experience influencing or defining methodology across teams or projects.
Personal skills:
Innovation, quick learning abilities
Team player
Commitment ,full ownership of tasks
Excellent communication and presentation skills
Customer orientation
A strong sense of ownership.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8496285
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
12/01/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for a Senior ASIC Physical Design Engineer to join our dynamic team, Join the ride as we spearhead the next revolution in electronics!
What Youll Do:
Own and continuously improve our smooth product backend integration methodology, flows, and best practices using Cadence and Synopsys tools.
Develop, maintain, and scale automation and infrastructure (TCL / Python) to improve quality, predictability, and turnaround time.
Collaborate closely with multiple teams to ensure smooth handoffs and high-quality product.
Support field teams on complex technical issues when needed.
Responsibilities:
Implementation of ASIC units using advanced flows
Developing BackEnd methodology using Cadence and Synopsys tools
Build and develop scripts for physical design implementation
Support Field team with customer issues.
Requirements:
8+ years of hands-on experience with ASIC physical design (RTL-to-GDS).
Proven experience taking multiple full-chip SoCs from RTL through tapeout.
Deep knowledge of Cadence and/or Synopsys backend flows (experience with both is a strong plus).
Strong understanding of PnR, timing closure, SI, power, DRC/LVS, and signoff.
Excellent debugging and problem-solving skills.
Strong scripting skills in TCL and Python.
Nice-to-have / Advantage:
Experience with multiple power domains and low-power design techniques.
Background that spans both frontend (RTL) and backend.
Experience influencing or defining methodology across teams or projects.
Personal skills

Innovation, quick learning abilities
Team player
Commitment, full ownership of tasks
Excellent communication and presentation skills
Customer orientation
A strong sense of ownership.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8498219
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8475348
סגור
שירות זה פתוח ללקוחות VIP בלבד
סגור
דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Our computational challenges are so big, complex and unique we can't just purchase off-the-shelf hardware, we've got to make it ourselves. Your team designs and builds the hardware, software and networking technologies that power all of our company's services. As a Hardware Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of our company users.
As a CMOS Technologist and Foundry Engineer, you'll be part of the growing chip design team. In this role, you'll be responsible for driving CMOS (Complementary Metal Oxide Semiconductor) foundry partners, Intellectual Property (IP), and chip design and implementation teams to perform CMOS transistor scaling and Power/Performance Analysis (PPA), and producing technology roadmap benchmarks. You will also be involved in interfacing and driving our design IP partners.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Engage with CMOS foundry partners, manage foundry design kits and design library collaterals, and work with our design teams to perform PPA simulations on benchmark circuits.
Work with fab partners on device and circuit level test structures, test chips, and characterization and correlation of silicon data. You will use the results of this work to influence design optimizations.
Work with IP partners, design, and physical design teams to design advanced CMOS.
Work with chip implementation and physical design teams on micro-architecture tradeoffs, support design tool flow bring-up, and address all physical implementation details leading to product tapeout.
Work with our commercial and product teams on Foundry and IP vendor management, track technology roadmaps, and determine appropriate technology and IP integration strategies.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related field or equivalent practical experience.
8 years of experience in foundry design kits bring-up, SPICE simulations, signal/power analysis with advanced CMOS FinFET nodes.
Experience in semiconductor/device engineering, process development, or electrical characterization of device/circuits.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering or Physics with an emphasis on semiconductor materials or device physics.
Experience in SoC chip physical implementation.
Understanding of analog and digital circuits such as PLLs, High Speed IO, cache and standard cell libraries in advanced CMOS FinFET nodes.
This position is open to all candidates.
 
Show more...
הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8473119
סגור
שירות זה פתוח ללקוחות VIP בלבד