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27/01/2026
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סוג משרה: משרה מלאה
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24/02/2026
Location: Haifa
Job Type: Full Time
As a System Lead Engineer in the Nitro team, you will be responsible for defining Annapurna Labs Network Interface Card (NIC) hardware. Following the development and validation of our NIC, and bringing the NIC to mass production.

Youll provide leadership in new technologies of the HW interfaces, bringing them to large-scale deployment, in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and youll work with technical experts, senior leaders, and multiple areas of technology.

Key job responsibilities
As Lead engineer youll get involved with the first architecture discussions and through design development, readiness to production until product exposure to customer. Youll handle hardware and software system related aspects, such as: architecture definition, mechanical design, thermal and power design, signal integrity of high speed interfaces (PCIe, High Speed Ethernet and DDR), boot flows, recovery flows, remote debug hooks, firmware live-update flows, system health monitoring sensor, report flow, etc... This is a fast-paced, intellectually challenging position, and youll work with thought leaders in multiple technology areas. Youll have high standards for yourself and everyone you work with, and youll be constantly looking for ways to improve your products performance, quality and cost. Were changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.
Requirements:
Basic Qualifications
- Bachelor's degree in electrical engineering, computer engineering, or equivalent.
- 7+ years of hardware products development experience.
- At least 8 years' experience leading hardware products from design to mass production: life cycle, components selection, schematics, layout, thermal, mechanical design, review, hardware-software interfaces, and production testing and practical hardware lab.
- High-speed interfaces knowledge and debug capabilities- PCIe, Ethernet, DDR etc.
- Design/lab experience with at least at one of the following interfaces: DDR4/5, PCIe Gen3/4/5, 100/25/10GbE; Practical experience with high-speed lab equipment.

Preferred Qualifications:
- Experience in computer architecture.
- Knowledge of scripting languages (bash, python, etc.)
- HW / SW / FW Integration experience
- Experience with operating systems, boot loaders, networking, and remote debugging
- Experience with mass production products.
- Experience in driving cross team and cross disciplinary activities.
- 3+ years experience working with systems and experience with their SW, FW and HW components
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design Team Manager within the Server Chip Design team, you will oversee the IP and SoC VLSI design cycle from architecture to production. In this role, you will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads.
You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and SoC.
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
Knowledge of one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, RTL coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis dft etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power including low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Material Science, Physics, Microelectronics, a related technical field, or equivalent practical experience.
8 years of experience in semiconductor foundry technologies, advanced process nodes and product engineering or yield analysis.
Experience in leading post-silicon yield improvement, including root cause analysis, defect correlation, and process debugging.
Experience with characterization of silicon interaction with package thermal and mechanical stress.
Preferred qualifications:
15 years of experience in test engineering, product engineering, foundry technology, advanced packaging development, or product yield engineering.
Experience in debugging IP integration issues (e.g., HBM, SerDes, PCIe) and advanced packaging failures (2.5D/3D, flip-chip).
Ability to drive technical feedback loops between foundry partners, internal architecture and design teams, and Post-Silicon (Post-Si) teams to resolve manufacturing limiters.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will need expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
15 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.

Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8544135
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544213
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design & Power Methodology Team Manager within the Server Chip Design team, you will be responsible of managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL Design cycle IP and SoC.
8 years of experience in team management.
Experience with design methodologies, structural checks, and power estimation/optimization.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of IP and SOC architecture.
Knowledge of physical design techniques: SDC, Synthesis, EMIR, etc.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מה השם שלך?
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of the Data Center silicon. Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications. You will be a key contributor in the growth team, developing advanced custom IP and solutions. We seek experienced applicants with expertise in one or more of the following areas: wireline communications, analog circuit design, DSP design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed IO industry standards. You will collaborate with a set of cross-functional organizations. You will serve many of our companys advanced data center products.The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our companyservices around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architecture and design of high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterizing performance, and testing for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure integration into System-on-Chips (SoCs).
Adhere to standards like Institute of Electrical and Electronics Engineers(IEEE) or Optical Internetworking Forum (OIF) for protocols and optimizing power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience in analog mixed signal and high-speed Input/Output development.
Experience defining and taking to High Volume Manufacturing(HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science.
Experience in mixed-signal and high-speed Input/Output (IO) solutions.
Experience working on high-performance, data-center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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8544208
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
our company's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets our company's standards of quality and reliability.
As a Senior SoC System Test Engineer, you will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization, and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will work with various groups to deploy screening methodologies and flows for data processing, analytics, and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, qualification strategies, and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Validate test solutions on system-level platforms and prepare for mass production.
Work with hardware and software teams to evaluate functional device yield and performance across various operating conditions.
Develop effective production screens to reduce Defective Parts per Million (DPPM).
Assess test escapees and localize failures, implement containment measures in the manufacturing test flow, and partner with manufacturing, test, quality and reliability teams to identify root cause and implement corrective actions.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
5 years of experience in system level test engineering.
Experience with Python or C/C++.
Experience in silicon System level components/LinuxOS.

Preferred qualifications:
Masters degree in Electrical Engineering, Computer Engineering, Computer Science, or related fields.
10 years of experience in test engineering and product engineering.
Experience with CPU/GPU and SoC architecture, design, validation and debug.
Experience in SLT hardware design and proliferation (e.g., system boards, peripheral devices, sockets, handler kits, and thermal control solutions).
Ability to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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