דרושים » תוכנה » senior sta engineer

we are hiring a senior physical Verification engineer to lead signoff-quality verification for advanced silicon programs. you will drive physical verification strategy and closure for complex designs, working across implementation, methodology, and signoff teams to achieve tapeout readiness. the role requires strong technical ownership, structured debug, and the ability to scale best practices across multiple programs. this is a great match for an engineer who wants to combine technical depth with broad project impact.
what you'll be doing:
own physical verification closure for major blocks or full-chip designs through tapeout.
lead debugging of complex drc, lvs, and reliability-related issues and drive high-quality resolution.
define verification check plans, signoff criteria, and closure priorities with cross-functional teams.
partner with physical design, custom design, and cad teams to improve quality and turnaround.
drive automation, methodology improvements, and best practices for scalable pv execution.
review results, coach team members, and help reduce repeated classes of violations.
we are committed to fostering a diverse work environment and proud to be an equal opportunity employer. as we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law. we will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment. please contact us to request accommodation.

Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.

we are seeking a physical Verification engineer to help ensure our asic and SOC designs are clean, correct, and ready for tapeout. this role focuses on physical verification quality across layout data, connectivity, and manufacturing rule compliance. you will work closely with physical design, custom layout, and methodology teams to run verification flows, debug issues, and improve signoff robustness. this is an excellent opportunity for an engineer who enjoys detailed analysis and high-impact signoff work.
what you'll be doing:
run and analyze physical verification checks such as drc, lvs, and other tapeout-quality signoff checks.
debug physical verification violations and partner with design teams to drive clean closure.
review layout, netlist, and runset interactions to identify root causes and recommend fixes.
support full-chip and block-level verification readiness across implementation milestones.
improve physical verification flow quality, turnaround time, and automation.
collaborate with methodology, cad, and foundry-facing teams on rule interpretation and signoff quality.

As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform advanced AI Static Timing Analysis (STA) for complex chiplet and full chip level.

AI use for timing optimization and data analysis in STA and PnR.

Running and build STA tools for anlyaze and debug timing.

Use traditional STA tools like Prime Time, review and debug timing paths, understand constraints, sdc generation, timing ecos generation.

Identify convergence risks and work closely with physical design, RTL and DFT teams, ensuring convergence throughout various project stages.

Responsible for a full timing closer and quality approval from pre-layout STA model through signoff.

As a Digital Backend Design Engineer, you will be responsible for the physical implementation of digital designs from RTL to GDSII, leveraging cutting-edge EDA tools and methodologies. You will collaborate closely with RTL design, DFT, and packaging teams to achieve optimal performance, power, and area (PPA), while meeting stringent timing and yield targets.

Required Skills and Experience
Masters or PhD degree in Electrical/Electronic Engineering or a related field.

4+ years experience in digital IC backend implementation.

Proficiency with backend EDA tools, particularly Cadence Innovus and Genus.

Strong understanding of place & route (P&R), static timing analysis (STA), DRC/LVS verification, IR drop, and electromigration (EM) analysis.

Experience with advanced technology nodes (22nm or below preferred).

Skilled in Tcl scripting for automation of backend flows.

Experience in hierarchical or full-chip implementation is preferred.

Language: English at a proficient level. French is a plus.

we are looking for best-in-class physical design engineers to join our outstanding networking silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.
what you'll be doing:
physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
be exposed and work on a variety of challenging designs (including high cell count and hs blocks). resolving complex timing and congestion problems.
daily work involves all aspects of physical design chip development (rtl2gds) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
taking part inflows development.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:
Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.
Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.
Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.
Taking part inflows development.

Required Senior SOC and IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Be responsible and go-to person for any IR related issues.