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לפני 1 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for exceptional talent to join our team as a Hardware Engineer.
Your Day to Day:
Lead end-to-end hardware development, from architecture and design to testing and production
Design and develop complex electronic systems, including schematics, PCB layout guidance, and component selection
Drive system integration, bring-up, debugging, and validation processes
Collaborate with firmware, software, mechanical, and product teams to ensure seamless system performance
Identify technical risks and propose effective mitigation strategies
Support manufacturing, including design for manufacturability (DFM) and design for testability (DFT)
Analyze and improve system performance, reliability, and cost
Mentor junior engineers and contribute to team knowledge sharing
Requirements:
BSc or MSc in Electrical Engineering or a related field
7+ years of experience in hardware development in high-tech industries
Strong experience with analog and digital design
Proven track record of taking products from concept to production
Hands-on experience with lab equipment (oscilloscopes, spectrum analyzers, logic analyzers, etc.)
Experience with schematic capture and PCB design tools
Strong debugging and problem-solving skills
Ability to manage multiple projects in a dynamic environment
Experience with high-speed interfaces, RF systems, or sensor technologies
Hands-on experience with Altium Designer and familiarity with AMD SoC platforms - Advantage
Familiarity with embedded systems and firmware integration
Experience working with contract manufacturers and NPI processes
Knowledge of industry standards and compliance requirements
Fluent in English, both verbal and written
This position is open to all candidates.
 
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לפני 5 שעות
דרושים בSpecial Job – חברת השמה בהייטק
Job Type: More than one
- Electronics Board & System Design: Own schematic design and component selection for all proprietary boards.
Design system-level wiring architecture and detailed technical drawings.
- Embedded Firmware Development: Write and architect low-level C/C++ firmware infrastructure
to control and interface sensors, multi-axis motors, high-precision components and lasers subsystems with the software.
- Hands-on Board Bring-Up, QC & Troubleshooting: Act as the primary lab problem solver for board debugging,
rework, and failure analysis. Establish QC procedures for newly received boards to support production.
- DFM & Cost Optimization: Apply strict Design for Manufacturability (DFM) principles to optimize PCB layouts,
streamline assembly, and aggressively reduce production and bill-of-materials (BOM) costs.
- PCB Layout Management: Drive physical board layout design,
Requirements:
- Education: B.Sc. in Electrical Engineering with at least 5 years of experience
- Hardware & Layout Expertise: 3+ years of experience in board design (mixed-signal, power management, microcontrollers)
and PCB layout tools (e.g., Altium, OrCAD, KiCad).
- Embedded Firmware Skills: Strong C/C++ programming skills for microcontrollers (STM32, ARM Cortex, etc.)
and deep familiarity with hardware protocols (SPI, I2C, UART, CAN, USB).
- Hands-on Capability: Excellent lab skills (soldering, prototyping, oscilloscope diagnostics)
and a natural problem-solving mindset.
- Proven DFM Focus: Demonstrated experience implementing DFM practices specifically targeted at price reduction,
cost optimization, and yield improvement in production.
This position is open to all candidates.
 
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24/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking a motivated Senior System Validation Engineer to join our growing post-silicon validation team in Israel and support next-generation connectivity products for AI and data-center applications.
In this role, you will perform system-level post-silicon validation, characterization, and debug across silicon, hardware, firmware, and software. You will support silicon bring-up and PVT/corner testing, develop and execute functional and system validation tests, analyze results, and work with cross-functional teams to identify and resolve complex system issues.
This is a highly hands-on lab position. The primary location is Haifa, with temporary support at the Ramat Gan lab as needed.
Key Responsibilities:
Develop and execute post-silicon functional and system validation from silicon bring-up through production readiness.
Run PVT, silicon corner, stress, characterization, and qualification testing across a wide range of operating conditions.
Develop validation tests to verify functionality, performance, stability, power, and operating margins.
Debug issues across silicon, hardware, firmware, drivers, and system software.
Validate high-speed interfaces such as PCIe, CXL, Ethernet/SerDes, and DDR, as well as common system interfaces.
Develop Python scripts and automation to improve validation coverage, regression, and test efficiency.
Analyze validation data, identify issues and trends, and drive problems to root cause and closure.
Work closely with hardware, architecture, firmware, software, design, and DV teams to investigate and resolve issues.
Support the transition of new silicon from initial bring-up to a qualified, production-ready product.
Operate system platforms and laboratory equipment to support validation and debug.
Document test results, issues, root cause, and recommendations and communicate findings clearly.
Requirements:
Basic Qualifications:
B.Sc. or M.Sc. in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
6+ years of experience in post-silicon, system, hardware, or product validation.
Hands-on experience with SoC/silicon bring-up, functional validation, and system-level debug.
Experience developing and executing validation plans, test cases, and characterization experiments.
Strong Python scripting and test automation skills.
Strong hardware debugging, analytical, and problem-solving skills with the ability to work independently.
Experience debugging issues across hardware, firmware, and software.
Experience validating high-speed interfaces such as PCIe, Ethernet, SerDes, CXL, or DDR.
Hands-on experience working in a hardware or system validation laboratory.
Strong communication and cross-functional collaboration skills.

Preferred Qualifications:
Experience with PVT validation, silicon corner testing, characterization, qualification, and margin analysis.
Experience with server, storage, networking, or AI infrastructure products.
Familiarity with PCIe/CXL architecture and high-speed SerDes technologies.
Experience with oscilloscopes, BERTs, protocol analyzers, traffic generators, or similar lab equipment.
Working knowledge of Python, firmware, Linux, and system-level software debugging.
Experience developing automated validation and regression environments.
Familiarity with Git and software development practices.
Experience with pre-silicon validation, emulation, or hardware prototyping.
Experience with system performance, throughput, latency, power, and stability testing.
This position is open to all candidates.
 
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17/09/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for a hands-on FPGA Design Engineer, specialized in high-performance digital design and FPGA-based system development, as part of the QM-Platform team.

This role involves ownership of FPGA interfaces and connectivity logic, including high-speed communication blocks, platform integration, and close collaboration with embedded and hardware teams. You will work on complex FPGA/SoC platforms, enabling robust and scalable solutions for quantum control systems.

Responsibilities

Own the design and implementation of FPGA-based interfaces such as PCIe, I2C, SPI, and high-speed GT communication.
Develop and integrate FPGA logic on advanced platforms, including Xilinx UltraScale+ and Versal.
Collaborate closely with embedded, hardware, and system teams to ensure seamless HW/SW/FPGA integration.
Drive FPGA bring-up, debugging, and validation at both lab and system levels.
Participate in system architecture definition and cross-team design decisions.
Requirements:
3+ years of experience in FPGA design and digital system development.
Strong proficiency in Verilog/SystemVerilog RTL design.
Hands-on experience with Xilinx FPGA families (UltraScale+, Zynq, or Versal).
Experience implementing and debugging high-speed interfaces (PCIe, Ethernet, JESD, or similar).
Solid understanding of FPGA development flows, including synthesis, place & route, and timing closure.
Experience with lab debugging tools (e.g., ILA/ChipScope, oscilloscopes, logic analyzers).
Experience with simulation and verification methodologies (RTL and gate-level).
Strong problem-solving skills and attention to detail.
B.Sc. or higher in Electrical Engineering, Computer Engineering, or equivalent.
Strong communication skills and ability to collaborate across teams.
This position is open to all candidates.
 
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27/09/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.
Requirements:
Basic Qualifications
- Experience identifying bugs in architecture, algorithms, functionality, and performance with strong overall debugging skills.
- Experience verifying at multiple levels of logic from IP blocks to SoCs to full system testing.
- 5+ years of experience in IC package layout and physical design.
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers.
- Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent.
- Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects.
- Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks).
- Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design.
- Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams.

Preferred Qualifications
- Experience with formal verification techniques including abstraction and end-to-end checking.
- Experience with ARM and various DSP ISAs.
- Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards.
- Experience with industry standard tools and scripting languages (Python or Perl) for automation.
- MS with 3+ years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions.
- Exposure to chiplet-based or heterogeneous integration packaging architectures.
- Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers.
This position is open to all candidates.
 
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08/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are seeking an experienced Team Leader to lead our Failure Analysis engineering group within the Product Engineering team. You will be responsible for controlling and improving the quality of our hardware products through technical leadership, data-driven insights, and global production support. This role requires deep expertise in electronics systems, failure methodologies, production process control, and proven leadership capabilities across multiple geographies.
Key Responsibilities:
Lead, mentor, and develop a team of failure analysis engineers while providing technical guidance on complex hardware issues.
Drive continuous improvement of quality KPIs through root cause analysis (RCA), statistical analysis, and yield optimization across all products.
Establish and implement standardized failure analysis methodologies, debug protocols, and quality control processes across global production sites.
Serve as the technical focal point for product design and functionality, supporting the team across RF, embedded, FPGA, high-speed communication, and mixed-signal systems.
Collaborate across Design, Manufacturing, Supply Chain, and Sales teams to resolve critical issues and prevent yield impact.
Manage vendor/supplier escalations and conduct design DFT/DFM (Design for Test/Manufacturability) analyses.
Lead investigation of production crises and manage critical path issues under time pressure.
Requirements:
6+ years in hardware design and failure analysis; minimum 2 years in a leadership role- Must.
Deep understanding of electronics production processes, DFT principles, and manufacturing constraints- Must.
Strong hands-on lab expertise: proficiency with oscilloscopes, logic analyzers, VNA, and automated test equipment-Must.
Demonstrated experience with production testing workflows, yield analysis, and statistical process control.
Proven ability to conduct systematic root cause analysis and communicate findings to senior management.
Excellent cross-functional collaboration and technical communication skills.
Bachelor's degree in Electronics Engineering or equivalent.
Preferred Qualifications:
Experience with DFT and DFM analysis.
Proficiency in Python or data analysis tools (MATLAB, Jupyter, etc.
Knowledge of Six Sigma or formal quality methodologie.
This position is open to all candidates.
 
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08/09/2026
Location: Tel Aviv-Yafo
Job Type: Full Time and Hybrid work
We are seeking an experienced HW Team Leader to drive the engineering efforts behind our electronic systems. This role will focus on enhancing the testability, production efficiency, and quality of our products by defining Design for Testability (DFT) strategies, developing production test solutions, and leading failures investigation and correction.
What You'll Do:
Lead and mentor a team of highly skilled hardware engineers.
Drive execution in a fast-paced, multi-project environment.
Own and evolve our Design for Testability (DFT) strategy and guidelines.
Lead end-to-end development of production test solutions and test facilities.
Drive root-cause investigations, failure analysis, and product improvement initiatives.
Collaborate closely with R&D, manufacturing, and quality teams to ensure product reliability and production readiness.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Electronics Engineering, or a related field. - Must
5+ years of leadership experience in Hardware Engineering, System Design, or Product Engineering.-Must
Strong experience with board design and complex multidisciplinary systems.- Must
Deep understanding of DFT methodologies and production test strategies.
Hands-on experience with debugging, failure analysis, and lab equipment.
Strong leadership, communication, and problem-solving skills.
Ways to stand out:
Experience with automated test equipment (ATE).
Scripting and automation experience (Python, LabVIEW, etc.).
Knowledge in FPGA Design and Verilog coding.
This position is open to all candidates.
 
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28/09/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
The Networking Application Engineering team is looking for a motivated, experienced Senior Hardware Engineer who thrives at the intersection of hardware performance, ecosystem validation, and ODM/OEM partnerships. In this high-impact role, you will own critical qualification tooling, drive the design-in process with leading hardware partners, and collaborate across םור R&D organization to accelerate hardware resolutions at scale. Your work will directly influence the quality and velocity of next-generation networking hardware reaching the world's most advanced data centers and supercomputers.

What You'll Be Doing:

Own and lead the Hardware Performance and Qualification tooling suite, driving continuous improvement in test coverage, automation, and accuracy in collaboration with leading ODMs and OEMs.

Drive the design-in process with top-tier ODM and OEM partners, ensuring seamless hardware integration and delivering best-in-class platform experiences.

Partner cross-functionally with multiple R&D departments to identify, escalate, and resolve hardware issues rapidly - reducing time-to-resolution and maintaining platform quality.

Define and execute qualification plans for new hardware platforms, validating performance, stability, and compliance across diverse system configurations.

Build and nurture trusted technical relationships with ODM/OEM engineering teams, acting as the go-to expert for hardware performance and qualification.

Provide actionable feedback to engineering and product teams based on qualification findings and partner interactions.
Requirements:
What We Need to See:

BSc/MSc in Electrical Engineering, Computer Engineering, or a related field or equivalent experience.

5+ years of experience in hardware development, including high-speed multilayer PCBs.

Proven problem-solving skills with a track record of driving issues to closure.

High proficiency in English communication and presentation.

Excellent interpersonal skills - comfortable engaging directly with ODM/OEM technical counterparts.


Ways to Stand Out from the Crowd:

Knowledge of server topology, PCIe protocols, BMC interfaces, and security aspects.

Experience with the physical layer of network and PCIe ports, including SerDes tuning.

Proven track record working directly with ODMs and OEMs through design-in and qualification cycles.

Knowledge of high-speed signal integrity theory and practice, with experience using lab equipment.

Experience in script or firmware development to enhance test automation.
This position is open to all candidates.
 
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04/10/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
At our company, what you do matters. Every day, we protect over 100,000 organizations worldwide from increasingly sophisticated cyber and AI-driven threats, securing their AI transformation.
Our prevention-first approach safeguards hybrid networks, cloud environments, digital workspaces, and AI systems, stopping attacks before they happen.
This is where innovation meets real-world impact. Youll help customers across industries operate with confidence in a rapidly changing digital world, working alongside smart, curious people who take ownership, challenge assumptions, and solve complex problems.
Were proud to be recognized by TIME, Newsweek, and Forbes for excellence and workplace culture.
What really sets our company apart is the opportunity to grow, contribute, and help companies navigate their AI transformation securely.
If youre excited to work at the forefront of AI-driven security on a global scale, this is the place to do it.
Key Responsibilities
We are seeking a talented and driven Hardware Project Manager to join our innovative team. In this key role, you will lead the development of groundbreaking hardware projects, guiding them from concept to mass production while navigating the dynamic landscape of technology and cybersecurity.
At our company, we value creativity and collaboration, and we are committed to fostering an environment where your ideas can thrive. As part of a global leader in cybersecurity, you will play a vital role in shaping the future of our products and services.
Join us in our mission to secure the future!
Lead developing new hardware projects, ensuring timely progression from concept to mass production.
Manage strategic relationships with customers, ensuring their needs are met throughout the project lifecycle.
Define project requirements and specifications (Design/SRS) for new initiatives.
Coordinate prototype hardware builds (EVT, DVT, PVT) in collaboration with our contract manufacturer.
Manage software release processes, drawing on proven experience in software project management.
Develop and maintain project schedules, identifying critical paths and addressing bottlenecks to ensure smooth execution.
Collaborate on engineering deliverables, including specifications, test plans, reliability testing, and engineering validation.
Conduct audits and manage quality control for production carried out by ODMs.
Communicate the impact of scope changes to all stakeholders, including customers, regarding cost, timing, and quality implications.
Provide regular updates on program statuses, highlighting potential risks and setbacks, and developing mitigation strategies.
Offer basic debugging support for hardware issues.
Collaborate with customers and partners to address field issues and technical inquiries.
Requirements:
Bachelor of Science in Electrical Engineering
Knowledge of hardware design techniques and hardware schematic principles
Experience in board design (At least 2 years) and evaluation of HW vendors
At least 2 years experience in managing Hardware projects
Experience in SW engineering and project management
Excellent communication, organizational, and leadership skills
Self-motivated and proactive with demonstrated creative and critical thinking skills
Detailed knowledge and understanding of product development processes
Strong engineering/technical background/Hands-on approach
Experienced in various project planning tools such as Jira and MS Project
Self-motivated, able to accept new challenges and motivate others
Advantages:
PMP Certification
Background in network protocols
Background in embedded systems
Knowledge of C/C++ language programming for embedded systems
Knowledge of cloud services, cyber security and computer networking
Management of overseas sub-contractors experience
Knowledge in production and manufacturing.
This position is open to all candidates.
 
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לפני 1 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for some exceptional talent to join our Design and Engineering team as a System Platform Team Lead
Your Day to Day.:
Lead a multidisciplinary team of embedded SW, FPGA/logic, verification and software engineers
Own the system-level architecture and execution of various SoC-based camera processing and control platforms including Xilinx MPSoC
Oversee development across ARM A53/R5, Linux, bare metal, FPGA logic, HLS, micro-controllers, host software, interfaces and system integration
Lead implementation and validation of image-processing algorithms developed by the algorithm team
Drive technical planning, design reviews, integration, debugging, risk management and execution
Stay hands-on through selected complex or quality-critical tasks to maintain deep system understanding
Coordinate closely with algorithms, electronics, sensor and system teams
Requirements:
B.Sc. in Electrical Engineering or another relevant technical field
Senior-level experience in complex multidisciplinary systems, preferably in imaging or camera products
Experience leading engineering teams and driving execution
Strong system architecture background spanning embedded SW, FPGA/RTL, host-side software, HW/SW integration and interfaces
Experience with Xilinx Zynq / MPSoC or similar heterogeneous SoC platforms
Good understanding of Linux, bare-metal development, Verilog, Vivado/Vitis and FPGA development flows
Experience with Python and C++
Strong integration and debugging skills across hardware, FPGA and software
Experience with image/data processing pipelines and platforms such as PCs, Raspberry Pi or NVIDIA Jetson is an advantage
Excellent communication and cross-functional collaboration skills
Fluent in English, both verbal and written
This position is open to all candidates.
 
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01/10/2026
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are seeking a Senior Guidance Engineer to play a critical role in the development of next-generation drone platforms.

This position focuses heavily on guidance and mission-level decision-making for high-performance aerial systems operating in dynamic, real-world environments.

You will design and deploy guidance and motion planning algorithms that enable precise, high-speed maneuvers and complex mission execution. This role blends analytical rigor with creativity, tackling problems that often have no textbook solutions. Youll collaborate closely with hardware, embedded software, and perception teams to bring advanced autonomy from concept to flight.

Key Responsibilities

Design, develop, and optimize guidance and motion planning algorithms for autonomous drones
Define mission-level behaviors and guidance logic, balancing performance, safety, and robustness
Implement real-time control interfaces to execute trajectories reliably in uncertain conditions
Work closely with embedded software, mechatronics, and perception teams to ensure seamless integration
Identify and address edge cases and failure modes, building resilience and graceful degradation
Stay current with advancements in drone autonomy, guidance, motion planning, and control
Requirements:
BSc or MSc in Mechanical, Aerospace, or related engineering fields.
3+ years of experience in GNC, guidance, autonomy, or related aerospace/robotics fields
Strong experience with AI tools, guidance algorithms, trajectory generation, and motion planning
Solid understanding of system-level constraints affecting real-world aerial platforms
Hands-on experience with real-world drone development, debugging, and iteration
Strong collaboration skills across software, hardware, and deployment teams
A creative, problem-solving mindset with a passion for advanced aerial missions
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8839438
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