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we are looking for a Service Systems Engineer.
As a Service Systems Engineer (SSE), you will be responsible for ensuring that the CT Detector Module System (DMS) is designed for efficient installation, maintenance, troubleshooting, and repair throughout its entire lifecycle. In this role, you will collaborate closely with DMS systems engineering, development, service, manufacturing, quality, and field teams to drive serviceability and operational excellence. You will translate customer and field insights into service concepts, requirements, and design enhancements, leveraging service and reliability data to improve system availability, safety, and maintainability. In addition, you will work cross-functionally with other CT teams to manage scanner-level interfaces and dependencies that impact DMS service performance.
Your role:
Develop service concepts and features based on customer, field engineer and service organization needs.
Translate service needs into requirements, service CTQs and design inputs.
Assess serviceability for installation, calibration, troubleshooting, repair, preventive maintenance, and replacement of serviceable items.
Participate in architecture and trade-off studies to ensure service needs are considered in design decisions.
Review DMS designs to confirm they meet service requirements, including relevant hardware, software, electrical, mechanical and thermal aspects.
Contribute to service-related verification activities, including defining service scenarios and evaluating service procedures and tools.
Work with customers, field engineers, and engineering teams to investigate and resolve DMS-related field issues.
Analyze field feedback, maintenance data, reliability trends and service performance
Translate findings into recommendations for hardware, software and service improvements.
Support failure analysis and risk assessment activities, including DFMEA.
Prepare and maintain service documentation, including service procedures, troubleshooting guidance and technical information for field tams.
Share service knowledge with relevant teams and support field engineers as needed.
Coordinate with scanner-level teams on interfaces and integration topics that affect DMS service.

we are looking for a Staff Systems Engineer.
As a Staff Systems Engineer, you will be a critical contributor on our Electrophysiology Systems Engineering team focused on delivering the future in Advanced Imaging. This role will involve a range of responsibilities including but not limited to collaborating and leading teams in the strategy, development and analysis of system architecture, system performance and system integration for our next generation products including various imaging modalities such as echocardiography, CT, MRI, and 3D cardiac mapping. In this role you will be a key member of product development team to bring systems from concept to launch.
Duties and Responsibilities:
Define and influence, and drive execution of technical strategy for system-level programs while partnering with cross-functional stakeholders on business strategy and product roadmaps.
Utilize multidisciplinary engineering knowledge and experience to design, develop, and troubleshoot new products specific to cardiac mapping and advanced imaging.
Provide system engineering leadership and take ownership for overall project success for new products and features from concept phase through launch.
Work with Product Marketing, Clinical Engineering, and Key Opinion Leaders to develop design input requirements from user and business needs.
Communicate with Sr. Management including technical presentations, status updates, and program reviews.
Lead project-level system architecture, system behavior definition, and tradeoff analysis activities utilizing Model-Based Systems Engineering (MBSE) methodologies, including use case modeling, requirements traceability, system architecture modeling, and interface definition.
Lead cross-functional working groups to solve complex problems, mitigate risks, and develop strategies to overcome challenges.
Plan, manage, and report on overall systems integration activities including root cause analysis and solution generation.
Identify, communicate, and proactively manage technical, integration, and program risks throughout the product development lifecycle.
Provide input into the technology and product roadmaps.
Be a strong team player and lead cross-functional teams to resolve issues and meet budget and schedule requirements.
Create a positive, collaborative culture amongst the technical teams while working to solve challenging engineering problems.
Mentor engineers across multiple disciplines and serve as a technical leader driving engineering excellence, sound systems thinking, and effective technical decision-making.
Ensure compliance with procedural and documentation requirements of , FDA, ISO and other regulatory bodies.

As a Software Development Engineer in Test on our team, you will own the quality of Nitro card embedded software and firmware. You will design, develop, and maintain test automation for embedded systems and components, covering hardware interface verification, real-time firmware behavior validation, firmware update integrity, and fleet-scale deployment confidence. You will collaborate closely with firmware development teams to troubleshoot complex system-level problems at the hardware-software boundary and ensure timely delivery of high-quality Nitro card software to AWS Cloud solutions.

Key job responsibilities
- Own the firmware test automation framework - architect, develop, and extend a Python-based validation solution that scales across multiple Nitro card generations and hardware platforms, automating test coverage across the full firmware stack from boot sequences through board management layers and card-level system integration.
- Design and implement traceable, specification-driven test cases that validate firmware functional correctness, fault tolerance, and performance across hardware components, communication interfaces, and cross-subsystem interactions.
- Optimize CI/CD pipelines by integrating pre-merge and post-merge firmware validation, defining trigger policies per hardware generation, enforcing coding-standard compliance, and reducing commit-to-validated cycle time.
- Troubleshoot complex embedded system failures by analyzing firmware logs, system traces, and hardware diagnostics, then translate field incidents into targeted regression suites that prevent recurrence.
- Collaborate with firmware and hardware teams during new-generation silicon bring-up, define test plans, drive quality gates for production release, and mentor teammates on testing best practices and system architecture.

A day in the life
You start your morning reviewing overnight CI results and triaging any firmware validation failures flagged across active Nitro card generations. Mid-morning, you pair with a firmware engineer to debug a boot-sequence regression discovered during pre-merge testing, using hardware-in-the-loop test benches and system traces. After lunch, you join a design review for a next-generation Nitro card, providing input on testability and proposing validation strategies for new subsystem interfaces. Later, you refine your test framework to improve coverage for a recently released feature, then wrap up by sharing your findings in a team knowledge-sharing session.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

Required Senior DFT Lead
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing autonomous solutions that define the next-generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Drive and execute DFT activities in the design, implementation, and verification solutions for application-specific integrated circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, memory built-in self test (MBIST), and automatic test pattern generation (ATPG).
Collaborate with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Oversee DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.

Required SoC Test Automation and Infrastructure Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our data centers are the most advanced in the world. In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high-volume manufacturing at wafer fabrications and Outsourced Semiconductor Assembly and Test (OSATs). You will have an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next-generation of chips.
You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices, drive yield improvement, cost optimization and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs
You will have a strong understanding of IC flows, wafer processing, testing, qualification, diagnostics and failure analysis. You will work with various groups to deploy screening methodologies and flows for data processing, analytics and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
Responsibilities:
Provide tools, set the environment and create automation to silicon engineering (SiEng) teams, collaborate with Test, Product, quality and reliability (Q&R) and system-level test (SLT) teams.
Create smooth and effective ways to manage silicon engineering (SiEng) datastream to and from suppliers and internally, between different platforms, while optimizing formats and datalogs, convert per need.
Verify test solutions on pre-silicon models (simulation or emulation) and support Automated Test Equipment (ATE) test development setup and environment.
Develop test method for ATE platforms.
Provide pre and post silicon dashboards and indicators that will reflect the status, demonstrate progress and point on the gaps.

Required Staff Design Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will be part of a team developing application-specific integrated circuits (ASICs) used to accelerate networking in data centers. You will have multiple responsibilities in areas such as project definition, design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators.You will also be responsible for performance analysis for a networking stack using your knowledge.
Responsibilities
Lead an ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement data center networks.
Define hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.

Required Silicon Test and DFT Engineer, Cloud
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, and qualification strategies and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Verify test solutions on pre-silicon models (simulation or emulation) and develop Automated Test Equipment (ATE) test modules and binning flows.
Develop and validate test programs on Automated Test Equipment (ATE) platforms for new product integration (NPI) in preparation for high-volume manufacturing (HVM), working with ATE vendors and internal cross-functional teams.
Manage product sustainment support, including analyzing volume data, improving test time and yield, assessing test escapees and return merchandise authorizations (RMAs), localizing failures, implementing containment measures, and partnering with design, manufacturing, and quality and reliability teams to identify root causes and implement corrective actions.
Build tools, flows and methodologies to continuously improve and automate the testing life-cycle.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.