דרושים » חשמל ואלקטרוניקה » Staff Signal Integrity Engineer

Required Power and Signal Integrity Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives.
You'll set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.
The ML, Systems, & Cloud AI (MSCA) organization designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all services (Search, YouTube, etc.) and Cloud.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities:
Design and optimize power distribution networks (PDN) across chip, package, and board levels. This includes managing power/ground planes, decoupling capacitors, and power gating strategies.
Conduct both pre-layout and post-layout power integrity simulations to analyze power and ground noise (SSN/SSO), voltage drops (IR drop), and electromagnetic interference (EMI).
Implement and verify low-power design methodologies, such as multi-voltage designs and clock gating, using power intent formats like UPF/CPF.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR), Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.

Required Signal/Power Integrity Engineer, PhD Graduate
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities:
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Collaborate extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers, to define specifications and resolve integration challenges.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish robust design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.

Required SoC Chip Architect, Cloud, Silicon
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As an SoC Chip Architect, you will lead the definition of groundbreaking, high-performance custom silicon and multi-chiplet systems for our Cloud AI infrastructure. You will bridge the gap between hyperscale data center workload requirements and silicon implementation across various domains, collaborating with cross-functional partners to design scalable, energy-efficient, and feature-rich SoCs.
You will be part of a team pushing the boundaries of custom silicon engineering, architecting next-generation data center products that deliver industry-leading performance, low latency, and massive bandwidth for Cloud and our flagship AI services.
Responsibilities
Lead top-level SoC architecture across multiple disciplines, including IP architects, digital design, verification, physical design, validation, firmware, power management, security, and system software.
Architect and analyze complex multi-chiplet systems, including chip partitioning, die-to-die (D2D) interconnects, advanced packaging constraints, and high-performance on-chip fabrics (NoC).
Define top-level SoC subsystems, memory hierarchies, clock distribution, reset schemes, and power domains to ensure optimal system performance and operational efficiency.
Formulate end-to-end operational flows, latency models, and system throughput analyses for data center workloads.
Own the SoC architecture specification and lead it throughout the complete product life-cycle: concept, modeling, implementation, tape-out, and post-silicon bring-up.

Required Senior Edge-AI SoC Formal Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Pioneer and refine formal verification methodologies by systematically embedding AI tools to optimize verification accuracy.
Plan the formal verification strategy and create the properties and constraints for complex digital design blocks.
Utilize formal property verification tools combined with formal verification closure techniques to verify properties and apply sign-off to blocks.
Architect and implement reusable formal verification components.

Requred SoC Power Architect, Cloud, Silicon
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power Architect, you will not just design chips; you will define the energy efficiency of the infrastructure that powers our services worldwide.
In this role, you will be at the intersection of architecture, logic design, physical implementation, and system software. You will own the power architecture for next-generation custom SoCs (System on Chips), making critical trade-offs between performance, thermal constraints, and power delivery to build the most efficient computing platforms on the planet.
Responsibilities
Define and own the SoC power architecture, including complex power domains, clocking structures, and power delivery network (PDN) solutions to achieve optimal performance-per-watt.
Architect sophisticated power management policies, including dynamic voltage and frequency scaling (DVFS), power gating, and state strategies. Define the hardware/software interface for the Power management unit (PMU) and provide power management specifications.
Lead collaboration across architecture, RTL, physical design, packaging and validation teams to establish power budgets and specifications. Ensure power requirements are met from concept to tape-out.
Develop high-fidelity power and performance models to evaluate architectural features early in the design cycle. Drive pre-silicon power estimation and analysis to guide design decisions.
Lead post-silicon power analysis, correlating lab measurements with pre-silicon models to close the loop and improve future methodologies.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

Required Senior SoC Formal Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to build the best cloud in the world for our services and for our Cloud customers, by solving real world business issues of performance, cost, and scale, utilizing hardware, software, and system solutions. To better serve evolving cloud needs, we are establishing a team in Israel to develop custom chips for servers.
In this role, you will perform formal verification of design properties of complex ASIC designs. You will collaborate closely with design and verification engineers to define meaningful properties that capture the design intent of a logic block and constraints on its input stimulus. You will also help define and improve design and verification methodologies that allow you to achieve formal verification closure.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Plan the formal verification strategy and create the properties and constraints for complex digital design blocks.
Utilize formal property verification tools combined with formal verification closure techniques to verify properties and apply sign-off to blocks.
Pioneer and refine formal verification methodologies by systematically embedding AI tools to optimize verification accuracy.
Architect and implement reusable formal verification components.

Required Senior CAD Infra Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Work with partner teams to provide the compute, storage, and methodology needs of the chip design, verification, and physical design teams. Collaborate with Application-Specific Integrated Circuit (ASIC) teams to implement tools and methodologies.
Design and implement CAD tools, solutions, and methodologies for ASIC development. Extend the capabilities of third-party tools through their dedicated APIs.
Propose, design, and implement software automation that directly addresses bottlenecks in today's ASIC and SoC EDA flow. Lead and actively contribute to the automation and integration of physical design (floorplanning, power planning, synthesis, place and route, clock tree synthesis, timing closure, STA, DRC, LVS, DFM, etc.) in our automated flow.
Leverage your software expertise to develop the hardware automations required for physical design automation, and their software integration in our automated flow.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.