דרושים » ייצור ותעשייה » System Product Quality & Reliability (Q&R) Engineer

We are developing leading edge products, manufactured on leading edge technologies.
We offer a dynamic, open, teamwork environment operating at high pace mode.

Key job responsibilities
Assume full ownership of mechanical and thermal design of Annapurna ICs.
Engage with product architect and design teams on future products package and assembly needs
Perform package level thermal simulations.
Perform package level mechanical simulations.
Lead and design thermal and mechanical measurements of ICs.
Explore and provide recommendations on both available and future packaging and assembly technologies for Annapurnas products.
Engage with substrate and assembly vendors on future technologies roadmap.
In collaboration with HW Dev team optimize mechanical vs. thermal tradeoffs.
Ensure testability of the ICs in collaboration with Test Engineer team.

We are looking for a Senior Product IC Q&R Engineer to join the team and lead the Q&R activities for our Nitro and Graviton product lines which enable the success of AWS.
As a senior product IC Quality and Reliability Engineer, you will play a crucial role in ensuring Annapurna Labs' semiconductor products meet customer demands. Your responsibilities will include establishing Design-for-Quality and Reliability (DFQR) during product design, developing reliability validation (RV) plans and DOEs, conducting product qualification and RV, support debug of qualification failures, and executing reliability modeling, analysis, and reporting.
In this role you will have end-to-end exposure to Annapurna's products, from semiconductor production flows and semiconductor testing methodolorgies to the operation of these products in the field.

Key job responsibilities
You will work with the design team to implement DFQR (design for quality and reliability) and DFRT (design for reliability testing) requirements for Annapurna Labs products.
You will evaluate Q&R risks, prepare reliability validation plans to mitigate them and work with multiple stakeholders to execute the reliability validation for Annapurna Labs products.
You will support Annapurna Labs production by qualifying new technologies, vendors and materials which enables Annapurna Labs leadership in AWS datacenters.

We are looking for a Nitro System Manufacturing Integration Lead Engineer to be part of defining, shaping, and implementing manufacturing flows, test definitions, and card-to-server integration processes for Nitro-based platforms. This includes to be part of the manufacturing flow architecture, production test strategy, process stabilization, and yield optimization bridging system design intent with high-volume manufacturing execution.

Key job responsibilities
As a System Manufacturing Integration Lead Engineer, in the Nitro team, you will own the end-to-end manufacturing flows for accelerator card-to-server integration across manufacturing partner facilities driving the process from initial definition through stabilization into a scalable, high-yield mass production operation.

Key responsibilities include:
- Architect manufacturing flows - be part of the complete card-to-server integration sequence, including every process step, quality gate, and decision point from sub-assembly through system integration and tests.
- Define test strategy - be part of determining what to test, when, and at which station, covering card-level functional tests, post-integration validation, firmware provisioning, and first power-up diagnostics.
- Establish classification criteria - be part of determining pass/fail thresholds and test exit gates to maximize yield and minimize material waste.
- Drive process stabilization - work directly and on-site with manufacturing partners to implement, debug, and iterate on manufacturing flows from early builds through a locked, repeatable production process.
- Design alternative flows - develop parallel manufacturing paths to address real-world constraints such as component availability gaps, deferred card integration, and hub-based assembly models.
- Own process documentation & KPIs - maintain manufacturing flow baselines, drive process change control, and track yield, first-pass rate, cycle time, and defect Pareto.
- Lead cross-functional coordination - serve as the single point of ownership across hardware engineering, firmware, test/vetting, thermal, mechanical, and operations teams for Nitro-based accelerator servers built at scale.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are looking for a Senior Electrical Engineer to join our Sustaining Engineering team and play a key role in supporting the ongoing evolution of our innovative cancer treatment systems.

In this role, you will lead electrical engineering activities across design transfer and sustaining engineering, ensuring our products successfully transition from development into manufacturing while maintaining the highest standards of quality, reliability, manufacturability, and regulatory compliance.
Working closely with R&D, Manufacturing, Quality, and external suppliers, you will combine hands-on engineering with technical leadership to drive robust product solutions throughout the product lifecycle.


This is an excellent opportunity for an experienced engineer who enjoys solving complex technical challenges, mentoring others, and collaborating across multidisciplinary teams to bring life-changing medical technologies to patients worldwide.

What you will do:
Lead electrical engineering activities for Design Transfer and Sustaining Engineering projects.
Provide technical leadership and mentorship to electrical engineers within the DT & Sustaining Engineering team.
Serve as the company's subject matter expert for electrical design, supporting Design Transfer and Production activities.
Lead the transfer of electrical designs from R&D into manufacturing, ensuring manufacturability, quality, and reliability.
Partner with R&D teams to provide Design for Manufacturing (DFM) recommendations early in the development process.
Maintain and improve PCB and electrical board designs to support product robustness, manufacturability, and cost-effectiveness.
Define electrical project requirements, timelines, and budgets.
Generate and maintain complete production documentation, including PCB documentation, PCBA files, BOMs, assembly drawings, and work instructions.
Work closely with suppliers and manufacturing subcontractors throughout the product lifecycle.
Perform hands-on electrical design, testing, validation, and troubleshooting.
Develop and execute electrical test procedures and generate technical documentation and test reports.
Lead electrical design reviews and provide technical guidance to cross-functional teams.

We are seeking an experienced and self-driven Systems Engineering Functional Manager to lead our systems engineering team for our CT/AMI detection platform (DMS). This team is responsible for the full lifecycle of system-level development from systems design, requirements management, architecture design, execution of technical reviews, setting the integration plan to verification, validation, and regulatory compliance.

Your role:
Lead and mentor a multidisciplinary systems engineering team, fostering growth, collaboration, and technical excellence.
Provide strategic and hands-on technical guidance in the development of CT/AMI detection platforms.
Oversee engineering planning and execution to support complex project ensuring timelines and quality standards are met.
Resource assignment and prioritization including headcount and budget management.
Working across functions and team boundaries to define, design, and implement the next generation of products.
Decision making in cross-disciplinary and architectural aspects.
Drive continuous improvement in engineering and systems engineering processes and tools.
Support audits and regulatory inspections as a subject matter expert.
Represent DMS System Design in global engineering forums and initiatives.

As an Ethernet Validation Engineer, you'll own the validation strategy for high-speed Ethernet (400G/800G+) on our next-generation ASICs, ensuring they perform flawlessly before reaching millions of customers.

In this role you will set the validation strategy for HS-Ethernet, ensure the design worked well, and drive complex system debugs involving HW, FW and SW components. You will provide leadership, by driving the teams around you to raise the bar and deliver higher quality products on behalf of Amazon customers. You will set high standards for yourself and everyone you work with, and will be constantly looking for ways to improve the performance, quality, cost and reliability of AWS products and services. We are transforming an industry, and we are looking for individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Own new products validation strategies for high-speed Ethernet interfaces and leading their execution.
- Support ongoing validation and integration of new products.
- Provide Annapurna Labs ASIC design, SW development, QA and architecture teams information and requirements from validation perspectives.

As we expand our presence in Israel, we're seeking a visionary System Validation Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.


Job Description
The mission of this role is to perform system validation for our highly advanced devices, that includes defining strategy, develop tools, innovate, be creative to make sure devices are performing as they should in all aspects, logical, performance, durability, stress and more.

You will be part of the site located at Israel (Haifa - Matam), surrounded with highly experienced and professional engineers who will escort, mentor and support you on your journey in our company.

We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.

In this role, you will lead all mechanical aspects of the product in R&D projects, taking it from concept to full scale development while working with multidisciplinary teams that include system engineering, physics, electronics, software, project managers, and others. You will serve as a technical focal point for mechanical design decisions, balancing performance, manufacturability, reliability, and cost.

Your role:

Lead the mechanical design including 3D models, drawings, prototype manufacturing, and production transfer.

Provide solutions that optimize performance, service, manufacturability, and cost.

Perform required analysis, testing, troubleshooting, and documentation.

Work with local and global teams inside and outside Philips to answer design, service, and production challenges.

Own mechanical risk identification, mitigation plans, and design reviews.

Operate in a multidisciplinary environment under conflicting constraints of performance, reliability, cost, and development schedule.