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לפני 9 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.


Key Responsibilities
Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments.
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence.
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments.
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners.
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient.
Requirements:
Basic Qualifications
B.Sc. in Electrical Engineering or Computer Engineering.
6+ years of hands-on experience in Static Timing Analysis (STA) at semiconductor companies, specifically working on advanced process technologies. (Note: Adjust years of experience based on the exact level you are targeting).
Deep expertise in multi-scenario STA, as well as timing and SDC constraint development and verification at the block and subsystem levels.
Solid understanding of advanced margining methodologies, including OCV, AOCV, and POCV, from synthesis through to final sign-off.
Solid knowledge of physical design flows (Synthesis, P&R, Physical Verification) and how they intersect with timing closure.


Preferred Experience
Experience developing and validating constraints using industry-standard tools like Timing Constraints Manager (Synopsys) or TimeVision (Ausdia).
Proven track record of executing STA on complex Macro-level designs and supporting Full-Chip timing integration.
Strong background in scripting (Tcl, Python, Perl) and automation to enhance timing closure efficiency.
This position is open to all candidates.
 
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לפני 9 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.
Requirements:
Basic Qualifications
B.Sc. or M.Sc. in Electrical Engineering.
5+ years of hands-on experience in Chip Top Physical Design/Backend at leading semiconductor companies, working on advanced process technologies (5nm, 3nm, and below).
Proven experience executing complex block or chip-level projects with a proactive, "can-do" approach and excellent communication skills.
Deep hands-on expertise in RTL2GDS flows, including P&R, STA, Physical Verification (DRC/LVS), Formal Verification, low-power implementation (UPF/CPF), and EMIR.
Mastery of industry-standard EDA tools (Synopsys Fusion Compiler/ICC2 or Cadence Innovus).
Practical experience handling both complex macro/subsystem-level designs and Full-Chip integration.


Preferred Qualifications
Deep understanding of Power & Noise analysis (EM/IR).
Experience with DFT (Design for Test) integration into the physical design flow.
Background in high-speed interfaces or data center protocols.
This position is open to all candidates.
 
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לפני 10 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Principal DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Principal DFT Engineer, you will provide technical leadership across the full DFT lifecycle-from architecture and specification through implementation, verification, and silicon bring-up. You will define and drive DFT strategy, establish robust methodologies, and lead execution to ensure high test quality and manufacturability. This role requires deep expertise, cross-functional influence, and the ability to drive DFT excellence across projects and teams.
This is a critical leadership position with high impact on first-pass silicon success and production quality for next-generation AI connectivity solutions.
Key Responsibilities

DFT Architecture & Technical Leadership
Define and own DFT architecture for complex SoCs, including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG strategies.
Lead DFT planning, specification, and quality tracking across the project lifecycle.
Provide technical leadership and drive DFT sign-off readiness to ensure successful tapeout.

Execution Across the Full Lifecycle
Lead DFT implementation, integration, and verification at block, full-chip and chiplet levels.
Own end-to-end DFT activities from specification through silicon bring-up and production support.
Ensure high test coverage, robust pattern generation, and alignment with manufacturing requirements.

Methodology & Cross-Functional Impact
Develop and drive scalable DFT methodologies, flows, and automation frameworks.
Collaborate closely with RTL, Physical Design, STA, and Test Engineering teams to ensure design-for-test readiness.
Optimize DFT integration across front-end and backend flows to improve quality, PPA, and turnaround time.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or related technical field (Masters preferred).
12+ years of experience in DFT design, implementation, and verification for complex ASIC/SoC designs.
Proven experience in leading DFT activities across full chip development cycles.
Deep expertise in DFT techniques including Scan, MBIST, LBIST, JTAG/iJTAG, and ATPG.
Strong understanding of DFT and Physical Design flows, including timing implications and integration challenges.
Experience with industry-standard DFT tools (Siemens Tessent, Synopsys TestMAX or equivalent).
Solid experience with DFT verification methodologies and coverage analysis.
Strong scripting skills (Tcl, Python, or Perl) for automation and flow development.

Preferred Qualifications
Experience with advanced process nodes (7nm and below).
Background in high-speed connectivity designs (PCIe, Ethernet, CXL, or similar).
Experience with hierarchical DFT methodologies and large multi-die or chiplet-based systems.
Knowledge of silicon bring-up, production test flows, and yield optimization.
Familiarity with STA, low-power design, and CDC as it relates to DFT integration.
Strong leadership and communication skills, with ability to influence cross-functional teams globally.
This position is open to all candidates.
 
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לפני 10 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Junior Physical Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the backend execution and methodologies for chips that power the world's largest AI clusters.

As a Junior Physical Design Engineer, you will be a key architect of our silicon's physical reality. You won't just execute a flow-you will help establish our local execution culture and technical standards, owning the transformation of complex logic into high-performance silicon. You will drive the physical implementation journey from synthesis through signoff, ensuring our connectivity solutions meet the extreme performance, power, and area targets required for next-generation AI infrastructure. If you thrive on solving complex challenges in deep-submicron processes and want to shape the backend methodology for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Physical Implementation & Execution
Be part of the founding Backend team in Israel, playing a critical role in establishing local execution culture and technical standards
Take full responsibility for physical implementation journey including Synthesis, Floorplanning, Place & Route, and Clock-Tree Synthesis (CTS)
Own macro-level implementation with deep hands-on experience in floorplanning and complex routing.

Signoff & Design Integrity
Drive final stages of design integrity, owning Timing signoff (STA), Physical Verification (DRC/LVS), and Reliability analysis (EMIR)
Ensure first-pass silicon success through rigorous signoff flows and analysis
Apply Logic Equivalence Checking (LEC) and other verification techniques to guarantee design correctness.

Methodology Development & Cross-Functional Collaboration
Participate in defining and refining Backend methodologies with autonomy to improve workflows and tool automation.
Work closely with Architecture, Design, and DFT teams to navigate challenges of advanced process nodes and high-speed connectivity.
Leverage scripting and automation to make engineering environment faster and more robust.
Requirements:
Basic Qualifications
Bachelors degree in Electrical Engineering or a related technical field.
Foundational understanding of the RTL-to-GDS flow, with academic or internship exposure to areas such as floorplanning, placement, and routing
Familiarity with advanced process technologies (e.g., 7nm and below) through coursework or hands-on projects.
Basic experience with signoff methodologies and tools, including STA, Logic Equivalence Checking (LEC), DRC, and EMIR analysis.
Working knowledge of TCL or Python scripting for simple automation and support of EDA tool flows.

Preferred Qualifications
Experience with full-chip level implementation and integration.
Knowledge of Power and Noise analysis (SI/PI) to optimize high-performance silicon.
Familiarity with Design-for-Test (DFT) requirements and their impact on physical layout.
Experience with industry-standard EDA tools (Synopsys Fusion Compiler/ICC2, Cadence Innovus).
Background in high-speed interface designs or connectivity protocols.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Engineer, SoC Static Timing Analysis
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. In this role, you will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering exceptional performance, efficiency, and integration.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of Physical Design experience including 2 years of experience with Static Timing Analysis (STA), including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and setting frequency goals with technology scaling.
Experience in constraints development for subsystems or full System-on-Chip (SoC) architectures.
Preferred qualifications:
Proficiency with scripting languages commonly used in hardware automation (e.g., Tcl, Python, or Perl).
Deep familiarity with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), formal verification, and clock domain crossing (CDC).
Solid fundamental knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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לפני 9 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Requirements:
Basic Qualifications
Bachelor's or Master's degree in Electrical Engineering or a related technical field.
7+ years of hands-on experience in EMIR/Power Integrity analysis for high-performance SoCs or high-speed connectivity products.
Strong proficiency in industry-standard EMIR tools (Ansys RedHawk/RedHawk-SC, or Cadence Voltus).
Deep understanding of EM/IR challenges in advanced FinFET nodes (7nm, 5nm, 3nm).
Deep understanding of Place & Route flows, power grid synthesis, extraction (RC), and standard cell architecture.
Deep understanding of EM and trade-offs between signal EM and power grid (PG) EM.

Preferred Experience
Familiarity with thermal analysis tools and their interaction with electrical performance.
Experience working with sign-off criteria and margins for high-volume production chips.
Good understanding of timing and P&R.
Basic understanding of packaging, top metal layers, MIM capacitor usage, and power distribution.
Ability to write TCL scripts for STA and Fusion Compiler (FC).
This position is open to all candidates.
 
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לפני 9 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary Staff DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Staff DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support.
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards.
​DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies.

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production.
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance.
Drive test coverage and quality metrics to meet stringent manufacturing requirements.

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR.
Participate in developing and maintaining cutting-edge DFT implementation flows.
Automate and improve methodologies using advanced scripting and tools.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
8+ years of hands-on experience in DFT roles at semiconductor companies.
Deep expertise in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Proficiency with industry-standard EDA tools from Synopsys (TestMAX) or Mentor (Tessent).
Strong understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.


Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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לפני 9 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Be responsible and go-to person for any IR related issues.
Requirements:
Basic Qualifications
Bachelor's or Master's degree in Electrical Engineering or a related technical field.
10+ years of hands-on experience in EMIR/Power Integrity analysis for high-performance SoCs or high-speed connectivity products.
Strong proficiency in industry-standard EMIR tools (Ansys RedHawk/RedHawk-SC, or Cadence Voltus).
Deep understanding of EM/IR challenges in advanced FinFET nodes (7nm, 5nm, 3nm).
Deep understanding of Place & Route flows, power grid synthesis, extraction (RC), and standard cell architecture.
Ability to define and own EMIR methodologies.
Capability to identify issues early in the project lifecycle (preferably with experience in sub-N5 TSMC technologies).
Deep understanding of EM and trade-offs between signal EM and power grid (PG) EM.
Thermal analysis, self-heat and Statistical EM proficiency.

Preferred Experience
Familiarity with thermal analysis tools and their interaction with electrical performance.
Experience working with sign-off criteria and margins for high-volume production chips.
Good understanding of timing and P&R.
Good understanding of packaging, top metal layers, MIM capacitor usage, and power distribution.
Understanding of ESD (including full CDM closure) and latch-up.
Strong Reliability knowledge.
Ability to write TCL scripts for STA and Fusion Compiler (FC).
This position is open to all candidates.
 
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 11 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a visionary DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy
Be part of the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Design and implement DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG for high-end devices

Test Pattern Development & Optimization
Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements

Cross-Functional Collaboration & Methodology Innovation
Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
4+ years of hands-on experience in DFT roles at semiconductor companies.
Experience in DFT flows and architectures including JTAG/iJTAG, MBIST, Scan, and ATPG.
Good understanding of logic design, verification, debug, and Static Timing Analysis (STA).
Scripting proficiency in Tcl, Perl, Python, or Shell for automation and innovation.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Experience with industry-standard EDA tools from Synopsys (TestMAX) or Siemens (Tessent).
Experience in chip bring-up and mass production activities.
Background in advanced process technologies (7nm and below).
Knowledge of high-speed interface protocols (PCIe, Ethernet, CXL, UALink) and their specific test requirements.
Excellent communication skills with ability to work effectively in global team environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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לפני 10 שעות
חברה חסויה
Location: Tel Aviv-Yafo
Job Type: Full Time
We are hiring a Manager Design Engineer to help architect and deliver the connectivity silicon powering the world's largest AI clusters. You'll own design execution on complex blocks across our purpose-built products, working at the cutting edge of PCIe, CXL, Ethernet, and emerging rack-scale interconnect technologies.

This is a high-impact technical role at a hyper-growth company. You'll partner closely with architecture, verification, DFT, and physical design teams to take features from spec to silicon, while contributing to the design methodology that scales with our roadmap. If you want to ship silicon that defines AI infrastructure, this is the team.

Key Responsibilities

RTL Design & Implementation
Own RTL design for assigned blocks from microarchitecture through synthesis sign-off.
Develop high-quality, synthesizable Verilog/SystemVerilog with strong attention to PPA.
Drive design reviews, lint, CDC, and timing closure activities to silicon-ready quality.

Cross-Functional Execution
Partner with architecture to translate specifications into implementation-ready microarchitecture.
Collaborate with verification on testplans, coverage closure, and bug triage.
Work with DFT and physical design teams on scan, BIST, floorplanning, and timing closure.

Technical Leadership & Quality
Mentor junior engineers and contribute to design methodology, scripts, and best practices.
Debug complex pre-silicon and post-silicon issues across RTL, gate-level, and emulation environments.
Drive structured, data-driven design decisions in support of aggressive tapeout schedules.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
5+ years of digital design experience, including at least one full chip from spec to tapeout.
Strong proficiency in Verilog/SystemVerilog, RTL coding, and synthesis flows.
Hands-on experience with timing closure, CDC, lint, and low-power design techniques.
Solid understanding of high-speed serial interfaces (PCIe, Ethernet, or similar) and SoC integration.

Preferred Qualifications
MS or PhD in Electrical Engineering or Computer Engineering.
Experience with PCIe Gen5/Gen6, CXL, UALink, UCIe, or Ethernet MAC/PCS designs.
Familiarity with formal verification, emulation, or assertion-based methodologies.
Background in advanced process nodes (7nm, 5nm, or below).
Strong debug skills across pre-silicon and post-silicon environments.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8831923
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
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שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 9 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.

As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.

Key Responsibilities

Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support.
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions.
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams.

Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient.
Apply design techniques to meet PPA (Power, Performance, Area) targets.
Contribute to design quality through verification and validation activities.

Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives.
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter.
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Basic Qualifications
Bachelor's degree in Electrical Engineering or related technical field.
5+ years of experience in logic design at semiconductor companies.
Knowledge and experience in Verilog and/or SystemVerilog.
Excellent communication skills with ability to work effectively across teams.
Understanding of digital design principles and RTL coding best practices.

Preferred Qualifications
Master's degree in Electrical Engineering or related field.
Knowledge of DDR and PCIe protocols and implementation.
Understanding of power management techniques for low-power design.
Familiarity with Clock Domain Crossing, simulation, debugging, synthesis, and timing analysis.
Proficiency in scripting languages such as Python or Perl.
Experience with high-speed serial interface designs or connectivity protocols.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8832067
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