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לפני 8 שעות
Location: Haifa
Job Type: Full Time
We are seeking a highly experienced and passionate Senior Board Design Engineer to spearhead the development of next-generation hardware platforms built around Annapurna's state-of-the-art devices. The ideal candidate thrives on tackling complex technical challenges and brings extensive expertise in high-speed digital, power, and embedded system board design.

In this role, you will lead the design and development of complex electronic boards - from system architecture and component selection, through schematic capture, PCB layout oversight, board bring-up, validation, and debugging.
You will collaborate closely with cross-functional teams - including software, ASIC, mechanical, and system engineering - to ensure seamless integration and successful product delivery. As the technical focal point for your projects, you will provide technical leadership, make key design decisions, and drive engineering excellence.


Key job responsibilities
Lead the architecture, design, and development of complex high-speed and mixed-signal boards.
Define board-level architectures and select appropriate components based on system requirements.
Create detailed schematics and guide PCB layout activities, ensuring signal integrity, power integrity, manufacturability, and reliability requirements are met.
Perform board bring-up, debugging, validation, and root-cause analysis using advanced laboratory equipment.
Drive technical decision-making and act as the primary hardware design authority for assigned projects.
Review designs and provide technical mentorship to other engineers.
Ensure designs meet performance, quality, schedule, and cost objectives.
Requirements:
Basic Qualifications
- B.Sc. in Electrical Engineering from a recognized university.
- At least 10 years of proven hands-on experience in high-speed digital, power, and embedded system board design.
- Extensive experience in schematic capture and PCB layout reviews.
- Strong hands-on experience with laboratory equipment, including oscilloscopes, spectrum analyzers, and network analyzers.
- Deep system-level understanding with strong analytical and troubleshooting skills.
- Ability to work effectively in a multidisciplinary environment and collaborate across engineering disciplines.
- Self-driven and capable of making independent technical decisions within areas of expertise.
- Proactive and adaptable, with the ability to thrive in a fast-paced environment while maintaining high-quality deliverables.

Preferred Qualifications
- Experience with DDR4 and DDR5 memory subsystem design and validation.
- Experience with PCI Express Gen5 and newer standards.
- Familiarity with signal integrity and power integrity analysis methodologies.
- HDL (Verilog/VHDL/SystemVerilog) development or debugging experience.
- Experience with high-speed interfaces, FPGA-based systems, and complex embedded platforms.
This position is open to all candidates.
 
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Location: Haifa
Job Type: Full Time
* Design and develop complex PCB boards
* Define hardware architecture and select components
* Perform schematic design and support PCB layout
* Develop High-Speed interfaces and communication protocols
* Analyze signal integrity and address EMI/EMC challenges
* Support DFM/DFT and manufacturing activities
* Prepare technical documentation and collaborate with multidisciplinary teams
Requirements:
B.Sc. in Electrical/Electronics Engineering
At least 5 years of experience in PCB / Board Design
Strong hands-on experience in schematic capture and layout design
Experience with design tools such as Altium Designer, OrCAD, or Allegro
Deep understanding of analog and digital circuit design
Experience with High-Speed Design - significant advantage
High level of English - written, verbal, and reading comprehension
This position is open to all candidates.
 
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05/07/2026
חברה חסויה
Location: Haifa
Job Type: Full Time
We are looking for an experienced Board Design Engineer to support the design and development of complex mixed-signal and high-speed digital boards for advanced medical systems. You will join our multidisciplinary team in CT organization.
Your role :
Design and develop multi-layer high-speed PCBs and define layout constraints
Perform component selection and schematic design
Design power management circuits (including DC-DC converters and power distribution)
Design and support analog circuits and boards
Support EMC/EMI tests
Lead board bring-up, validation, and lab debugging. Troubleshoot system-level HW/FW issues
Support high-speed interfaces such as DDR4/DDR5, PCIe, and Ethernet
Support Install Base (IB) activities , field investigations, and NPI activities
Support Lifecycle Management (LCM) tasks, including EOL handling
Work with PCBA vendors on production, manufacturing issues, and yield improvements
Search for component alternatives, test and approve replacements
Work with PLM (Product lifecycle Management) system and support ECO creation and release
Requirements:
Bachelor's degree in Electrical Engineering
7+ years of experience in board design working on multidisciplinary products
Experience in board design tools, preferably Siemens EDM / Xpedition
Deep understanding of Signal Integrity (SI) and Power Integrity (PI)
Experience in digital circuits design, power design, and analog circuit design
Strong lab debugging & root-cause analysis skills using tools such as oscilloscopes and signal analyzers for problem solving.
Experience with DDR design constraints and validation
Familiarity with PLM tools, especially Windchill
Advantages
Experience with FPGA-based systems
Experience in medical devices or other regulated industries
Background in thermal design and power optimization
This position is open to all candidates.
 
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לפני 6 שעות
Location: Haifa
Job Type: Full Time
As a Signal & Power Integrity Engineer on the Nitro team, you'll work on next-generation cloud infrastructure hardware while developing your skills in Signal Integrity and Power Integrity. This is an opportunity to learn SI/PI analysis and simulation while applying your hardware design knowledge to solve complex challenges in high-speed digital systems. You'll be mentored by experienced engineers and contribute to products that directly impact our customers.

Key job responsibilities
- Design and debug high-speed digital circuits for K2 cards and server platforms.
- Learn and apply SI/PI simulation methodologies for PCB and system-level designs.
- Collaborate with Package design, SerDes and DRAM IP provider, firmware, EC2, and manufacturing teams.
- Perform signal integrity analysis for high-speed interfaces and SerDes channels at the advanced of the technology.
- Analyze and optimize power delivery networks from card to system level.
- Support hardware bring-up, debug, and validation with hands-on lab work.
- Participate in design reviews and provide technical feedback with internal and external design teams.
- Work with cross-functional teams to resolve signal quality and power integrity issues.
- Contribute to design guidelines and best practices based on measurements and analysis.
Requirements:
Basic Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, or related field.
- 5+ years of experience in hardware design or development.
- Strong understanding of digital circuit design fundamentals and PCB design.
- Experience with high-speed interfaces (PCIe, DDR, SerDes, Ethernet, or similar) and hands-on lab equipment.

Preferred Qualifications
- Familiarity with SI/PI simulation tools (HFSS, PowerSI, ADS, or similar).
- Understanding of transmission line theory, impedance concepts, and S-parameters.
- Experience with scripting (Python, MATLAB, or similar) for data analysis.
- Knowledge of PCB stackup design, material properties, and power delivery networks.
- Experience with hardware validation and production testing.
- Experience working on complex multi-layer PCB designs.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SoC Hardware Quality and Reliability Engineer
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
Responsibilities
Own technical specifications, architectural definitions, and physical power-on of custom qualification vehicles (HTOL load boards, ESD fixtures, latch-up rigs). Drive external layout vendors to achieve seamless electrical correlation with ATE environments.
Govern execution quality of applied stresses, define electrical, thermal, and telemetry parameters on test vehicles to ensure uniform, valid stress profiles without unintended overstress or setup artifacts.
Lead the end-to-end engineering delivery lifecycle for qualification hardware, map and drive critical cross-functional dependencies across internal validation and product engineering teams to ensure on-time readiness.
Serve as the primary technical interface for external PCB layout houses, fabrication shops, and component suppliers; manage design reviews, track lead times, and enforce delivery schedules.
Lead laboratory troubleshooting for qualification hardware anomalies; isolate setup/socket faults from true silicon failures and drive supplier corrective actions (CAPA) when board excursions occur.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, related fields, or equivalent practical experience.
8 years of experience in hardware engineering, with a focus on authoring technical specifications, reviewing electrical layouts, and driving verification of semiconductor tests or validation platforms.
Experience driving deliverables and managing quality standards with external layout vendors, board design houses, or hardware component suppliers across multiple global geographies.
Experience working within specialized semiconductor reliability or test laboratories including configuring component Burn-In ovens, high-power stress load boards, ESD simulators, and Latch-Up test setups.
Experience managing engineering hardware delivery schedules, tracking cross-functional milestones, and meeting New Product Introduction (NPI) timelines.
Preferred qualifications:
Master's degree in Electrical Engineering, Materials Science, or related fields.
Experience managing the design execution cycle of complex multi-layer test vehicles through third-party design houses or layout vendors from concept sign-off to laboratory delivery.
Experience defining and verifying electrical correlation baselines between environmental stress setups and High-Volume Manufacturing (HVM) ATE environments.
Deep familiarity with JEDEC silicon qualification hardware standards and how they dictate physical board testing constraints.
Strong background analyzing the quality of stress factors, including power distribution networks (PDN), signal integrity degradation across extended thermal loops, and transient load behavior during reliability cycles.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Analog Design Engineer, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Analog Design Engineer, you will design and integrate analog sub-systems. You will be responsible for ensuring the Analog Front-End (AFE) communicates flawlessly with the Digital Signal Processor (DSP), the package and silicon are a single electrical entity. Your work will bridge the analog and digital worlds to enable industry-leading performance.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Own the architecture and implementation of a major sub-component, such as the entire receiver AFE or the clocking/Phase-Locked Loop (PLL) distribution network.
Design the critical "suspension system" (e.g., Equalization/CTLE, ADC) that allows the digital core to function perfectly despite a noisy, high-loss channel.
Lead the definition and design of test chips to verify out novel topologies and circuit techniques in next-generation Gate-All-Around (GAA) nodes.
Collaborate with DSP, firmware, and system architects to define hardware/software partitioning and interface specifications.
Provide technical guidance and mentorship to engineers on the team.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
8 years of experience in Analog/Mixed-Signal design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience leading a block or sub-system tape-out for high-speed I/Os.
Experience demonstrating innovation in high-speed link design through patents or product releases.
Experience with package and PCB co-design and their impact on signal integrity.
Experience in system-level modeling and simulation using tools like Matlab or Python.
Knowledge of noise analysis, jitter decomposition, and adaptive loops.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Architect, Digital Signal Processing, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Engineer on the Digital Signal Processing team, you will be a technical leader responsible for architecting and developing the core algorithms that power our next-generation data center interconnects. You will leverage your expertise in communication theory, forward error correction (FEC), and modulation to design novel, low-complexity solutions that push the boundaries of speed and reliability.
In this role, you will not only define the technical direction for critical projects but also mentor other engineers and collaborate across hardware and software teams to bring your goal to life in silicon.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the architecture, design, and implementation of digital signal processing (DSP) algorithms for high-speed optical communication systems. Drive the long-term technical roadmap for our signal processing and communication architectures by staying current with academic and industry trends.
Develop and analyze novel forward error correction (FEC) and modulation schemes to optimize for performance, power, and complexity tradeoffs.
Create comprehensive system-level models using tools like Matlab, Python, or C++ to simulate and validate algorithm performance.
Collaborate closely with logic design, verification, and software teams to ensure the successful implementation, integration, and bring-up of algorithms in custom silicon.
Provide technical leadership and mentorship to a team of DSP and communication systems engineers, fostering innovation and engineering excellence.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field or equivalent practical experience.
10 years of experience in digital signal processing, communication theory, and algorithm development.
Experience in the design and implementation of algorithms for communication systems, including FEC or modulation techniques.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience.
Experience in the theory and practical implementation of modern FEC codes (e.g., LDPC, staircase, polar codes) and advanced modulation formats.
Experience in designing and modeling high-speed optical communication transceivers or similar high-bandwidth systems.
Experience leading the development of algorithms from initial concept through to successful silicon production.
Strong publication record in conferences or journals in the field of communications or signal processing.
Excellent programming skills in Matlab for algorithm development, simulation, and analysis.
This position is open to all candidates.
 
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לפני 5 שעות
Location: Haifa
Job Type: Full Time
As a SI/PI Engineer on the Nitro team, you'll apply your Signal Integrity and Power Integrity expertise to next-generation cloud infrastructure hardware. You'll perform SI/PI analysis, simulation and validation on cutting-edge high-speed digital systems, contributing to products that directly impact our customers.

Key job responsibilities
- Simulate, correlate, and validate SI/PI aspects of PCB and system-level designs.
- Collaborate with Package design, SerDes and DRAM IP providers, firmware, and manufacturing teams.
- Analyze and optimize power delivery networks from card to system level.
- Support hardware bring-up, debug, and validation with hands-on lab work.
- Review and provide technical feedback with internal and external design teams.
- Contribute to design guidelines and best practices based on measurements and analysis.
Requirements:
Basic Qualifications
- Bachelor's degree in electrical engineering, computer engineering, or equivalent
- 8+ years of experience in Signal Integrity and hardware design or validation.
- Experience with one or more high-speed interfaces such as PCIe, Ethernet, DDR, SerDes, or similar.
- Experience with lab equipment and measurement experience with Oscilloscope or TDR/VNA.

Preferred Qualifications
- Experience with SI/PI 3D simulation tools.
- Understanding transmission line theory, impedance concepts, and S-parameters.
- Knowledge of PCB stackup design, material properties, and power delivery networks.
- Experience with hardware validation and production testing.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior DFT Lead
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As the Design for Test (DFT) Engineer Lead, you will play a crucial role in DFT Architecture and DFT design, and support devices to production. You will be responsible for providing technical leadership in DFT, developing flows, automation, and methodology, planning DFT activities, tracking the DFT quality throughout the project life-cycle, and providing sign-off DFT to tapeout.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing autonomous solutions that define the next-generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity.
Responsibilities
Drive and execute DFT activities in the design, implementation, and verification solutions for Application-Specific Integrated Circuits (ASIC).
Develop DFT strategy and architecture, including hierarchical DFT, Memory Built-In Self Test (MBIST), and Automatic Test Pattern Generation (ATPG).
Collaborate with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT requirements are met and mutual dependencies are managed.
Oversee DFT team planning, deliverables, and provide technical mentoring and guidance.
Lead DFT execution of a silicon project, planning, execution, tracking, quality, and signoff.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
8 years of experience in Design For Test from DFT architecture to post-silicon production support.
4 years of experience with people management.
Experience with DFT design and verification for multiple projects, DFT specification, definition, architecture, and insertion.
Experience with DFT techniques and common industry tools, DFT and Physical Design flows, and DFT verification flow.
Experience in leading DFT activities throughout the ASIC development flow.
Preferred qualifications:
Master's degree in Electrical Engineering or a related field.
Experience in post-silicon Debug, test or product engineering.
Experience in Joint Test Action Group (JTAG) and Internal JTAG (iJTAG) protocols and architectures.
Experience in SoC cycles, silicon bring-up, and silicon debug activities.
Knowledge of fault modeling techniques.
This position is open to all candidates.
 
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1 ימים
חברה חסויה
Location: Haifa
Job Type: Full Time
We are seeking for Platform Integration Engineer to own the development, testing, and monitoring of the manufacturing health of our Graviton products integrated into MLA Trainium product. You will be part of a team integrating new silicon, hardware, firmware, and software into a revolutionary system architecture.

Key job responsibilities
- Lead product integration from definition phase through mass production, including: Hardware-Firmware integration and validation, development and implementation of manufacturing test flows, system validation and qualification and production readiness verification.
- Define and implement screening test content for both production line and data-center environments.
- Drive continuous improvement of operational health monitoring and debugging capabilities.
- Collaborate with cross-functional teams to resolve integration and production issues.
- Implement test flows for improving product operational health at manufacturing sites.
- Integrate knowledge and data from customers and data sources for fast resolution of operational issues.
- Maintain quality documentation and collateral in order to improve manufacturing operations.
- Travel to manufacturing sites as needed (approximately 3-4 times per year, 1 week duration per trip) to support integration, validation, and operational improvements.
Requirements:
Basic Qualifications
- B.Sc. in Electric Engineering/Computer Science or equivalent.
- 5+ years experience in software development and system integration, with demonstrated expertise in hardware-firmware integration.
- 5+ years experience in technical project leadership, including risk management, cross-team collaboration, and full product development lifecycle.
- Experience with Operating Systems, boot flows, networking protocols, and remote debugging capabilities.
- Proven track record in developing and implementing manufacturing test flows and system validation processes.

Preferred Qualifications
- Experience in Linux OS and network troubleshooting, or experience in software development and experience in Ubuntu/Solaris
- Knowledge of scripting languages (bash, python, etc.)
- Server design or integration experience in leading industrial company.
- Deep knowledge of server architecture and system design principles.
- Experience with board design/electrical validation and ability to read/review schematics and layout.
- 5+ years experience in Compute/Embedded system (ARM, x86, AMD) with HW/SW/SoC development and/or integration.
- Experience with manufacturing test development and production line integration.
This position is open to all candidates.
 
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חברה חסויה
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Design Lead, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, youll work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
Youll be part of a team that pushes boundaries, developing, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You'll contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Responsibilities
Lead physical design of complex SoC to tape-out while working with multiple team members.
Evaluate and develop physical design methodologies and decide on the SoC flow.
Work with architects and logic designers to drive architectural feasibility studies, develop timing, power and area design goals, and explore RTL/design tradeoffs for physical design closure.
Participate in design reviews and track issue resolution, and engage in technical and schedule tradeoff discussions. Create execution plans for projects and manage team efforts from concept to working silicon in volume.
Understand architecture and design specifications with the larger team, and define physical design strategies and tactics to meet quality and schedule goals.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Science, or equivalent practical experience.
Experience in silicon implementation and chip integration.
Experience in ASIC development teams.
Experience in managing physical design teams working on digital designs that produce and deliver silicon.
Preferred qualifications:
Experience in extraction of design parameters and analyzing data trends.
Experience and breadth in engineering across physical design, top-level implementation, GDS tape-out.
Experience in top-level floor planning, block integration, static timing analysis, and sign-off.
Understanding of circuit design, device physics, and deep sub-micron technology.
Knowledge of delivery of high complexity silicon in technology process nodes.
Ability to lead cross-functional teams.
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
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