דרושים » תוכנה » מיישמ/ת תשתיות מערכות מחשוב הנדסיות ומערכות תב''מ לחיפה

We are looking for a System Engineer with Software Engineering background to be part of defining, shaping and integrating solutions to next generation of our cloud platforms.

We are looking for an exceptional engineer to own the development, testing, and monitoring of the manufacturing health of Amazon Graviton server products. You will be part of a team integrating new silicon, hardware, firmware, and software into a revolutionary system architecture.

Key job responsibilities
Lead triage, debugging, and root cause analysis of systems in our data centers.
Enhance troubleshooting capabilities and drive closure of in-fleet problems.
Analyze customer workflows and requirements to provide targeted resolutions.
Collaborate with Annapurna Labs monitoring team and root cause teams to improve product quality and reliability in fleet operations.
Represent the customer voice by providing fleet operation insights and requirements to Annapurna Labs' ASIC design, software development, QA, and architecture teams.
Develop and maintain training materials, quality documentation, and collateral to improve in-fleet operations.
Design and implement tools and scripts to support projects and customize solutions based on requirements.
Travel as needed, approximately 2-4 times per year.

We are looking for a SoC / IP Architect to shape the next revolution in electronics!
Responsibilities
Define and design architecture: Create the overall SoC/IP architecture based on product and customer requirements and define detailed technical specifications.
Collaborate with cross-functional teams: Work with a variety of teams, including logic design, verification, firmware architecture and development teams, and physical design, to ensure successful execution.
Lead technical discussions and architectural reviews, guiding design and verification teams to deliver scalable, high-quality implementations.
System-level integration: Ensure seamless hardware-software co-design by working on aspects like control paths, interrupt schemes, and debug infrastructure.
Drive architectural decisions that optimize scalability, and future readiness for next-generation applications.

As a Chip Design Engineer on the Nitro team, you will take full end-to-end ownership of one or more critical IP blocks within the product, guiding them from micro-architecture definition through RTL design, debug, synthesis, timing closure, and final sign-off before tape-out. Your work will ship in silicon that powers AWS at global scale.
You'll partner closely with the Verification and Emulation teams to shape test plans, review coverage, and close gaps early in the design cycle. Beyond your own IP, you'll collaborate across disciplines with Product Definition, Software, Physical Design, and Verification teams to deliver a fully integrated, production-ready chip.

We are looking for an Experienced HW SERDES Engineer to join Annapurnas SPIV (System Platform Interface validation) team.
As a member of the SPIV team, you will own End-to-end subset of system PCIe SERDES interfaces across range of products through product life cycle:
1. Validation and qualification.
2. Integration.
3. Deployment and post-deployment support.
4. Failure analysis.
5. Pre silicon activities for new technologies.
As owner, you will set the strategy for PCIe SERDES qualification over multiple platforms, ensure the design worked well and drive complex system debugs involving HW and FW components.

You will define NPI practices and engage in pre-silicon efforts to explore new technologies and mitigate integration risks. You will enhance SERDES qualification results with large scale customer performance analysis to discover SERDES life-cycle issues and mitigate them.

This is a fast-paced, intellectually challenging position, and you will work with thought leaders in multiple areas of technology. We are changing industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities
- Approve future products PCIe SERDES technologies.
- Define new products SERDES qualification and validation strategy and lead the execution.
- Engage integrations of Annapurna Labs products with other vendors PCIe HW components.
- Support ongoing integrations of PCIe SERDES in new products.
- Lead triage, PCIe SERDES debug and root cause analysis of systems in AWS data centers.
- Drive and maintain training, quality documentation and collateral to improve in-fleet operation.

we are looking for a Senior Core Power Management Architect.
Job Description:
Will drive the implementation of autonomous core power management for best performance and power efficacy.
The Power expert will take charge in understanding business-units (customers) needs, and translate them to CPU core solution.
This expert will utilize his power management experience to deliver world-class power efficient HW-SW solutions for Huawei products.

we're seeking a highly skilled Static Timing Analysis (STA) Engineer to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the sign-off methodology for chips that power the world's most advanced AI clusters. As an STA Engineer, you will be deeply involved in the STA activities from chip partition and time budgeting through to final sign-off. You will bridge the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities


Execute the STA flow and sign-off methodologies, ensuring our products meet rigorous timing criteria for the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams, participating in timing reviews and working with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints, ensuring they are accurate and robust across multi-scenario environments
Analyze and resolve challenges related to cross-chip clock distribution networks and apply sophisticated margining techniques to ensure robust silicon across all process corners
Participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and custom scripts to make our sign-off process faster and more efficient

we're seeking a visionary Senior DFT Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, ensuring the reliability and testability of chips that power the world's largest AI clusters.

As a Senior DFT Engineer, you will be at the intersection of architecture, design, and production. You won't just run tools-you will be a foundational member of the team responsible for the entire lifecycle of our silicon's reliability. From defining initial DFT architecture to supporting post-silicon bring-up, your work ensures that the backbone of AI infrastructure connectivity is flawless and scalable. If you thrive on solving complex challenges in deep-submicron processes and want to establish world-class DFT methodologies, this is your opportunity.

Key Responsibilities

DFT Architecture & Strategy

Own the DFT journey from high-level architecture definition and RTL design to backend implementation and post-production support
Develop comprehensive Design-for-Testability (DFT) strategies for next-generation connectivity platforms, ensuring chips meet the highest quality standards
Define DFT architectures including JTAG/iJTAG, MBIST, Scan, and ATPG methodologies
Test Pattern Development & Optimization

Generate and optimize high-quality test and debug patterns for production
Perform Static Timing Analysis (STA) for DFT modes and conduct gate-level simulations to ensure robust performance
Drive test coverage and quality metrics to meet stringent manufacturing requirements
Cross-Functional Collaboration & Methodology Innovation

Act as a multidisciplinary bridge, collaborating closely with Architecture, Verification, and Backend teams to ensure seamless integration and optimal QoR
Participate in developing and maintaining cutting-edge DFT implementation flows
Automate and improve methodologies using advanced scripting and tools

we're seeking a visionary Staff Physical STA Expert to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, defining the sign-off methodology for chips that power the world's most advanced AI clusters.

As a Staff Physical STA Expert , you will hold the keys to silicon success. You will be leading the STA activities end-to-end from Chip partition, Time budgeting through signoff of all the chips we develop. You will build and lead the STA team to run several chips signoffs in parallel. In addition, You will define the sign-off methodology for chips that power the worlds most advanced AI clusters. You will act as the central nervous system of the design process, bridging the gap between Architecture, Design, DFT, and Physical Design to ensure our high-performance silicon meets the aggressive timing targets required for next-generation connectivity.

Key Responsibilities

Take full ownership of the STA flow and sign-off methodologies. You will establish the rigorous criteria that ensure our products succeed in the most demanding data center environments
Collaborate closely with Architecture, Design, DFT, and Backend teams. You will lead timing reviews and work closely with block owners to navigate the path to sign-off convergence
Develop, optimize, and manage complex SDC constraints from the ground up, ensuring they are robust across multi-scenario environments
Tackle the challenges of cross-chip clock distribution networks and sophisticated margining techniques, ensuring robust silicon across all process corners
Have a passion for better workflows? Youll participate in design methodology improvements and tool automation, utilizing both industry-standard EDA tools and in-house automation to make our sign-off process faster and smarter

we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities


Execute SoC Top-level physical design and actively drive full-chip convergence
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR)
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration