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1 ימים
Location: Yokne`am
Job Type: Full Time
we are seeking an experienced, analytical, and highly motivated engineer to lead chip and pcb npi activities for networking products. this role involves driving complex cross-functional efforts from early development stages through qualification and readiness for high-volume manufacturing. the ideal candidate will combine strong technical understanding with program management skills to coordinate multiple engineering disciplines and external manufacturing partners. success in this role requires a proactive mindset, the ability to manage risks and solve technical challenges, and a strong focus on execution. as part of our networking organization, you will help ensure robust supply chain readiness and enable the successful launch of next-generation networking solutions.
what you'll be doing:
lead chip/substrate/osat/pcb qualification for networking products (2nd source).
collaborate with engineering teams to identify suitable substrate suppliers based on technical capability and capacity and define the qualification plan.
coordinate and lead changes through the ecr/ccb process.
work with engineering teams to create the product bom and plan initial qualification activities on the assy floor.
track activities, manage timelines, and ensure successful qualification completion; support transition from qualification to mass production.
develop and execute risk plans for material requirements prior to qualification completion.
identify critical paths and bottlenecks; implement risk management methodologies.
develop and implement project management processes to improve tracking, clarity, execution, and day-to-day operational efficiency.
create and maintain systems for data management and task tracking using power BI and other advanced systems, including ai-driven tools.
Requirements:
what we need to see:
b.sc. in industrial engineering, material or chemical engineering or a related field, or equivalent experience.
strong engineering background with business and operations proficiency.
5+ years of proven experience in leading sophisticated, highly technology-intensive projects (semiconductor- advantage).
strong critical thinking, attention to detail, and strong decision-making skills.
independent and proactive approach - being able to own a task but also to deep dive into the relevant details surrounding it.
performs well in an intensive environment - working hour flexibility (working with global parties).
ability to manage schedule and meet deadlines.
multitasking, good interpersonal skills and a great teammate.
proficient in english - reading, writing, and speaking.
microsoft office tools - excellent skills in word, excel, and powerpoint tools.
This position is open to all candidates.
 
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דרושים בLR - JOB
סוג משרה: משרה מלאה
פיתוח, שיפור ובקרה מתמדת של תהליכי הייצור.
   אבטחת יציבות התהליך ועמידה בסטנדרטים הגבוהים ביותר של איכות המוצר.
   מתן מענה מקצועי, יסודי ומהיר לבעיות תהליכיות מורכבות המתעוררות בייצור.
   הובלה טכנולוגית והטמעת ידע ופתרונות חדשניים בתחומי כימיה תעשייתית ותהליכי פני שטח.
דרישות:
תואר אקדמי בכימיה, הנדסת חומרים או הנדסה כימית
ניסיון מוכח בתעשייה יצרנית בתפקיד טכנולוגי או הנדסי 
הבנה מעמיקה בכימיה תעשייתית ואלקטרוכימיה.
ידע במטלורגיה של מתכות.
מומחיות בתהליכי פני שטח וציפויים.
היכרות והתנסות עם שיטות חקר חומרים כגון SEM ובדיקות מטלורגיות.
יכולת ניתוח והסקת מסקנות מעמיקות מדוחות מעבדה לצורך שיפור תהליכים. המשרה מיועדת לנשים ולגברים כאחד.
 
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2 ימים
דרושים בר. ה. אלקטרוניקה בע"מ
מיקום המשרה: מספר מקומות
סוג משרה: משרה מלאה
לחברת rh, הממוקמת בנוף הגליל, דרוש/ה טכנולוג/ית לליווי תהליכי ייצור אלקטרונים במחלקת SMT.
התפקיד כולל אחריות על כל ההיבטים ההנדסיים והטכנולוגים של ייצור מעגלים אלקטרוניים במהלך כל מחזור החיים, כולל העברה לייצור המוני, תכנון והתאמה לייצוריות.
הובלת הקשר והממשקים מול מחלקות ההנדסה, ייצור, קבלני משנה, שרשרת אספקה רכש וכד.
בדיקה ואיתור פרמטרים קריטיים בתהליך.
קביעת חומרים וטכנולוגיות של תהליכי הייצור.
חשיפה לטכנולוגיות מתקדמות.
דרישות:
הנדסאי/ת / מהנדס/ת חשמל / מכונות / אלקטרוניקה / חומרים / כימיה- חובה.
ניסיון בעבודה עם תהליכי SMT- PCBA- חובה
3-5 שנות ניסיון בתפקיד דומה- חובה.
ניסיון בהובלת תהליכים, פתרון בעיות טכנולוגיות/טכניות וממשקיות.
ניסיון והבנה הנדסית בבניית קבצי ייצור.
ניסיון בעבודה עם קבלני משנה עבור PCB, קווי הרכבה, תהליכי בדיקה וביקורת.
ניסיון במערכות ERP.
אנגלית טכנית ברמה גבוהה. המשרה מיועדת לנשים ולגברים כאחד.
 
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1 ימים
חברה חסויה
Location: Yokne`am
Job Type: Full Time
our company has been transforming computer graphics, pc gaming, and accelerated computing for more than 25 years. its a unique legacy of innovation thats fueled by great technology-and amazing people. today, were tapping into the unlimited potential of ai to define the next era of computing. an era in which our gpu acts as the brains of computers, robots, and self-driving cars that can understand the world. doing whats never been done before takes vision, innovation, and the worlds best talent. as an employee, youll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. come join the team and see how you can make a lasting impact on the world.
are you ready to take your engineering career to the next level? our company , a world-class technology company, is seeking a passionate package engineer to join our team in israel. in this role, you will have the opportunity to collaborate with several design and program teams in the development of sophisticated ic substrates for our groundbreaking products. at our company, we are committed to delivering exceptional solutions in a wide range of sectors, and we are looking for engineers who share our passion and dedication to making a difference in the world through their inventions. as a package engineer, you will work closely with si, layout, and asic design teams to develop complex, top-of-the-line asic packages. you will be responsible for planning schedules, resolving costs, packaging, manufacturing, and electrical design issues.
what you will be doing:
leading development of cutting-edge microelectronics packaging of our networking business units future products, evaluating our products for reliability and performance.
review manufacturability readiness at each milestone. 
work with world leading vendors to develop highly challenging packaging solutions.
leading the development of groundbreaking microelectronics packaging for our networking business unit's future products
collaborating with world-leading vendors to develop highly ambitious packaging solutions
thriving in a dynamic and challenging environment
join and lead task forces to investigate and support production excursions, failure analysis and reliability issues and establish quality standards.
monitor substrate and assembly production kpis and collaborate with cross functional teams to define and monitor yield improvement plans for continuous improvement and establish quality standards.
lead process changes reviews, prepare and present data in change control board meetings, lead technical reviews of product changes throughout the supply chain.
Requirements:
what we need to see:
bsc or equivalent mechanical/material engineering degree, or any related equivalent experience.
2+ years of relevant work experience in the semiconductor packaging or equivalent experience, development and manufacturing.
basic design skills, such as using 2d artioscad, and 3d nx/solidworks/creo applications.
experience in dfm, understand tooling design, manufacturing processes, material properties and metrology tools.
high awareness for quality, robustness, and manufacturability.
high self-learning and self-motivation skills, fostering a culture of continuous learning, ongoing process improvement and proactive approach.
leadership skills, capability to lead cross company projects that involve cross functional teams in different locations.
curious and creative problem solver, well organized and multi-tasker.
ways to stand out of the crowd:
hands-on fea mechanical simulation experience - advantage
team / group / project management - advantage
experience with manufacturing environment and manufacturing statistics tools
background in engineering semiconductor manufacturing processes
This position is open to all candidates.
 
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19/03/2026
Location: Yokne`am
Job Type: Full Time
Our New Product Introduction (NPI) team is growing, and We are now looking for a Chip Engineering Operations Program Manager! The Engineering Operations group has an immediate opening for a top Program Manager. This group is responsible for the silicon schedule from bring-up to production release. We are looking for individuals who thrive in a dynamic environment, and are not afraid to roll-up his their sleeves and get their hands dirty. We desire a self-starter, with great communication skills; as well as a leader, with a deep sense of commitment. You will be responsible for developing wafer forecasts, schedule generation and management, supporting cross-functional teams, and mitigating any programmatic risks. You will also review and improve processes, and handle prototype demand.

What you'll be doing:

You own silicon bring-up schedule from power on to production release.

Negotiate silicon and board demand with teams and drive a bottom-up forecast.

Oversee and manage chip and board allocations across the company.

Lead prototype chip delivery to internal customers.

Track and coordinate engineering deliverables, key milestones and qualification/validation tasks in the new product introduction phase.

Identify and mitigate risks to schedules and programs.

Communicate status to cross-functional teams as well as upper management.

Continuously evaluate internal tools and processes and drive fixes to improve productivity.

Create new and fix existing processes between different teams.

Drive implementation of SW tools for data analytics and process evaluation.
Requirements:
What we need to see:

Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related technical field.

At least 5 years of relevant experience.

Proven experience in engineering roles, with a significant portion focused on semiconductors industry.

Strong background in planning methodologies.

Excellent communication, interpersonal, and leadership skills to effectively collaborate with internal teams.

Ability to travel internationally to supplier sites as needed.

Ways to stand out from the crowd:

Deep understanding of ASIC Technology and Productization requirements.

Strong verbal and written communication skills, and the ability to coordinate with multiple technical and business teams.

Self-directed and driven, highly motivated, creative, and have a consistent record of handling multiple tasks at any given time.

Have the ability to work independently and follow complex procedures.
This position is open to all candidates.
 
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1 ימים
Location: Yokne`am
Job Type: Full Time
join our company outstanding team and contribute to our legacy of innovation in the senior product quality and reliability role! at our company , we are dedicated to pushing the boundaries of pioneering technology. the senior product quality and reliability engineer will provide leadership and management for the networking system product quality within the organization. establish, maintain, and optimize an effective quality management methods and target to achieve high quality performance.
as part of our team, you will work on networking system products and ensure their readiness for high-volume manufacturing. leading and mentoring root cause analysis for issues related to design, manufacturing or customers. enhance and improve products performance by proactive risk assessment and other prevention methods. this is an outstanding opportunity to be part of a company that is crafting the future of ai and computing.
what youll be doing:
own product quality and reliability performance of networking system products. providing leadership expertise in product performance and quality.
maintain and monitor product health thru structured routines and metrics, enable effective alert mechanism for early identification 
lead structured problem solving and risk assessment for quality issues originating from production and customer. ensure product readiness for hvm manufacturing and scale
responsible for customer quality issues and working within organization to resolve
lead critical processes for product performance e.g - crb, pcn ; non conforming material review - mrb
drive continues improvement initiatives in design, verification and validation processes, manufacturing quality throughout the entire product life cycle and improvement plan.
Requirements:
what we need to see:
b.sc in electrical engineering / chemical / mechanical science, other technical degrees will be considered or equivalent experience.
8+ years experience leading quality of multidisciplinary products (electrical, mechanical, process)
proficient with product lifecycle management and qms processes
strong written and verbal communication, ability to interact at all management levels
strong organizational and project management skills, proven matrix management experience in high paced  dynamic environment
experience facilitating complex problem solving
ways to stand out from the crowd:
familiar with nvlink and ethernet products and protocols
experience in system integration and/or hw board design manufacturing 
strong problem-solving skills and analytical ability, processes oriented
experience from electronic manufacturing industry along with top data center customers
This position is open to all candidates.
 
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1 ימים
Location: Yokne`am
Job Type: Full Time
we are looking for a creative, independent product engineer to join our company networking business unit. for over two decades, our networking has continuously reinvented itself, delivering industry leading high speed interconnect products. our solutions set the standard for performance, scalability, and innovation enabling true end to end high speed ethernet and infiniband solutions.
as we continue to grow, we are seeking exceptional engineers to help drive the next wave of technological advancement. in this role, you will take a leading position in the interconnect cluster performance domain. you will work closely with global technical teams to gain deep architectural insight, investigate customer complaints, and drive product excellence. if you are passionate about building high-quality products that make a real-world impact, we want to hear from you.
what youll be doing:
maintain high-quality product deliveries through in depth Big Data analysis and failure analysis
improve product performance by collaborating with process, mechanical, hardware, and thermal teams
lead high impact task forces and cross functional working groups
help design and enhance product TEST plans to ensure high customer satisfaction
manage failure analysis for both field and lab issues
collaborate closely with customer support, marketing, engineering, quality, and reliability teams
Requirements:
what we need to see:
b.sc. in electrical engineering, materials engineering, or equivalent
5+ years of relevant industry experience
strong background in statistics and Big Data analysis (jmp, Python, power BI, sql)
solid understanding of electronic circuits
strong software and scripting skills
excellent presentation and communication skills
proven problem solving and prioritization abilities
ability to communicate effectively across diverse teams and functions
ways to stand out from the crowd:
experience with optical networking technologies
physical layer (phy / layer 1) networking verification experience
hands-on experience designing and executing reliability experiments
This position is open to all candidates.
 
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1 ימים
Location: Yokne`am
Job Type: Full Time
we are now looking for an engineering lab technician in the optical assembly team to support developing new nvidia's products. this newest member will collaborate with an innovative multidisciplinary world-class team of engineers to help build and develop our industry leading transceivers. in this role you will run multiple sophisticated assembly platforms, so there will be plenty of opportunity for learning new skills related to the field of advanced packaging. the primary responsibility is to support our engineering teams during development to ensure outstanding quality gpu server products may be released to the market and delight our customers so that ai scientists and datacenter operators can achieve their professional aspirations using nvidia technology. the new lab team member will work independently to complete daily tasks according to priorities, demonstrate a passion towards system level product quality, and should be comfortable in the lab environment.
what youll be doing:
participating in development of new packaging technologies while working tightly with process development team.
prepare and conduct experiments to TEST new assembly technologies and materials.
operation and maintenance of variety of platforms involved in process of packaging - wire bonding/pick&place/active alignment.
maintain laboratory hardware and handle materials.
Requirements:
what we need to see:
electrical/mechanical practical engineer diploma.
5+ years of experience in manufacturing environment - microelectronics or packaging.
operator level on machines involved in packaging process -pick & place/flip chip/bga /wire bonding.
good attention to detail, as well as clear written and verbal communications.
team player
This position is open to all candidates.
 
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