דרושים » חשמל ואלקטרוניקה » Design Engineer, Custom Circuits, Static Random Access Memory

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Location: Haifa and Tel Aviv-Yafo
Job Type: Full Time
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Evaluate, analyze, implement, and integrate SRAMs, other memories (such as multiport register files), and custom circuits. Drive proper IP integration and margins with the physical design team.
Partner with foundries and IP providers, as well as internal technology, physical design, and architecture teams, to optimize products for PPA, schedule, and reliability in advanced CMOS nodes.
Drive and support test chip design, execution, and validation of critical circuit IPs.
Design and build custom circuits at the transistor and gate levels to support physical design and power-performance-area optimization.
Drive development of a leading edge technology platform for custom, high performance ASICs and SoCs, from design through manufacturing, packaging, and test.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience in Circuit Design, Physical Design (RTL-to-GDS), or Technology Development, including advanced nodes (e.g., 7nm or below).
Experience with custom circuit/IP and physical design, including Place and Route (PNR) and Static Timing Analysis (STA).
Experience in scripting and automation using Tcl and Python (or Perl).
Experience with SPICE and transistor level design in advanced nodes.
Experience in CMOS device physics, finfet/GAA/nanosheet architectures, and layout parasitics.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience working with major foundry technology files (PDKs), standard cell libraries, metal stacks, and other features.
Understanding of characterization and verification of standard cells/SRAMs/register files, including knowledge of power, noise, variation, and IR analysis.
Understanding of collaterals for front end and back end design teams.
Excellent track record of delivering optimized custom circuits/memories/IPs and PNR blocks for product tapeout.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
In this role, you will conduct Place and Route experiments and sensitivity analyses to influence standard cell library architecture, metal stack definitions, and design rules. You will collaborate with Foundry, IP, and Architecture teams to identify Power, Performance, and Area (PPA) bottlenecks and drive System Technology Co-Optimization (STCO) initiatives.
Your work will involve performing high-fidelity physical implementation sweeps, analyzing the impact of scaling boosters, and developing automated methodologies to quantify PPA gains. By navigating the trade-offs between process complexity and design performance, you will ensure our companys hardware achieves efficiency and power density.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute high-fidelity Place and Route experiments to evaluate the PPA impact of advanced process features, library architectures, and design rule variations on datacenter-class IP.
Drive Design Technology Co-Optimization by collaborating with foundries and internal technology teams to define optimal metal stacks, track heights, and scaling boosters (e.g., backside power delivery, buried power rails).
Quantify process entitlement through systematic benchmarking of logic and memory macros, identifying bottlenecks in power density and timing closure for next-generation nodes.
Develop automated physical design methodologies and flows to accelerate technology pathfinding and enable rapid what-if analysis of emerging transistor architectures.
Influence System Technology Co-Optimization by partnering with Hardware Architects and Circuit Designers to translate process-level innovations into system-level performance gains.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
2 years of experience in Physical Design (RTL-to-GDS) or Technology Development, focusing on advanced nodes (e.g., 7nm, 5nm, or below).
Experience with industry-standard Place and Route (P&R) tools and Static Timing Analysis (STA) tools.
Experience in CMOS device physics, FinFET/nanosheet architectures, and the impact of layout parasitics on PPA.
Experience in scripting and automation using Tcl and Python (or Perl) to manage design sweeps and data extraction.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience in Design Technology Co-Optimization (DTCO), including standard cell library characterization, metal stack optimization, and evaluation of scaling boosters (e.g., backside power delivery).
Experience working with major foundry technology files (PDKs) and interpreting Design Rule Manuals (DRM) to guide physical implementation.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Develop and optimize the overall layout of the chip, including partitioning, macro and IP placement, and pin placement.
Design and implement efficient power delivery networks power grids to ensure stable power to all parts of the chip.
Develop and validate high-performance, low-power clock networks (e.g., Clock Tree Synthesis (CTS)) to ensure proper synchronization across the entire chip.
Develop, enhance, and maintain custom scripts (e.g., Tcl, Perl, Python) for automation and improved efficiency.
Conduct extensive Design Rule Checks (DRC) to ensure the layout adheres to manufacturing rules, performing Layout Versus Schematic (LVS) checks to verify that the physical layout matches the logical design.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with physical design flows and methodologies (e.g., RTL2GDS).
Experience with semiconductor process technologies (e.g., deep submicron, advanced nodes like 5nm and below), and device physics (e.g., MOSFET/FINFET).
Experience with Design For Testability (DFT) and low-power design methodologies.
Experience with UPF (Unified Power Format) and its application in physical design.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture, or a related field.
Experience with scripting languages such as Perl, Python, or Tcl.
Excellent analysis skills, with the ability to understand, debug, and resolve issues in the design flow.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design Team Manager within the Server Chip Design team, you will oversee the IP and SoC VLSI design cycle from architecture to production. In this role, you will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads.
You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and SoC.
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
Knowledge of one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
This position is open to all candidates.
 
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design & Power Methodology Team Manager within the Server Chip Design team, you will be responsible of managing and leading design and power methodologies from IP to SoC, pre and post silicon. You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
You will work closely with CAD vendors and internal teams to develop lead design and power methodology and execution.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead flow and methodology development and assimilation across multiple groups. Work closely with CAD tool providers as well as internal CAD teams.
Plan, execute, track progress, assure quality, and report status.
Work closely with internal customers and support multiple activities and deliverables.
Drive design methodologies such as design construction, CDC, RDC, SDC. Drive power at: IP and SoC RTL/Gate Level Optimization, estimation, correlation.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL Design cycle IP and SoC.
8 years of experience in team management.
Experience with design methodologies, structural checks, and power estimation/optimization.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of IP and SOC architecture.
Knowledge of physical design techniques: SDC, Synthesis, EMIR, etc.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your ASIC design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, Register-Transfer Level (RTL) coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for test (dft) etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
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סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use your Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops the ASIC SoC from Plan of Record (POR) to Production. You will be creating SoC Level micro architecture definitions, RTL coding and will do all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies. You will collaborate with members of architecture, software, verification, power, timing, synthesis dft etc. You will face technical tests and develop/define design options for performance, power and area.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Participate in architecture feedback.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with logic synthesis techniques to optimize RTL code, performance and power including low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, etc.).
Experience with SOC architecture.
Experience in logic design.
Preferred qualifications:
Master's degree or PhD in Computer Science or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced Extensible Interface (AXI), or Advanced RISC Machines (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מה השם שלך?
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שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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דיווח על תוכן לא הולם או מפלה
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תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Material Science, Physics, Microelectronics, a related technical field, or equivalent practical experience.
8 years of experience in semiconductor foundry technologies, advanced process nodes and product engineering or yield analysis.
Experience in leading post-silicon yield improvement, including root cause analysis, defect correlation, and process debugging.
Experience with characterization of silicon interaction with package thermal and mechanical stress.
Preferred qualifications:
15 years of experience in test engineering, product engineering, foundry technology, advanced packaging development, or product yield engineering.
Experience in debugging IP integration issues (e.g., HBM, SerDes, PCIe) and advanced packaging failures (2.5D/3D, flip-chip).
Ability to drive technical feedback loops between foundry partners, internal architecture and design teams, and Post-Silicon (Post-Si) teams to resolve manufacturing limiters.
This position is open to all candidates.
 
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8544578
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive the sign-off timing convergence for high-performance designs.
Set up the timing constraints, define the overall static timing analysis (STA) methodology, set up the STA infrastructure and sign-off convergence flows, and work closely with block owners throughout the project for sign-off timing convergence.
Work with logic designers to drive architectural feasibility studies, develop timing, and explore RTL/design trade-offs for physical design closure.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, a related technical field, or equivalent practical experience.
8 years of experience with static timing analysis, including sign-off corner definitions, process margining, interface timing constraints, timing convergence, and frequency goals setup with technology scaling.
Experience in constraints development for sub systems or SOC.
Preferred qualifications:
Experience with full-chip static timing analysis and timing closure.
Experience with scripting languages (e.g., Python, Perl, or TCL).
Experience with ASIC physical design flows and methodologies, including synthesis, place and route (P&R), static timing analysis (STA), formal verification, and clock domain crossing (CDC).
Knowledge of semiconductor device physics and transistor characteristics.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544192
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
our company's custom-designed machines make up one of the largest and most powerful computing infrastructures in the world. The Hardware Testing Engineering team ensures that this cutting-edge equipment is reliable. In the R&D lab, you design test equipment for prototypes of our machinery and develop the protocols used to scale these tests for the entire global team. Working closely with design engineers, you give input on designs to improve our hardware until you're sure it meets our company's standards of quality and reliability.
As a Senior SoC System Test Engineer, you will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization, and work closely with cross-functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will work with various groups to deploy screening methodologies and flows for data processing, analytics, and diagnostics. You will drive the release of cost effective production test solutions into mass production to hit yield and quality goals.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Collaborate with Architecture, Design and Verification teams to develop new product bring-up, validation, characterization, qualification strategies, and manufacturing test solutions for new High Performance Computing (HPC) products in advanced process technologies.
Validate test solutions on system-level platforms and prepare for mass production.
Work with hardware and software teams to evaluate functional device yield and performance across various operating conditions.
Develop effective production screens to reduce Defective Parts per Million (DPPM).
Assess test escapees and localize failures, implement containment measures in the manufacturing test flow, and partner with manufacturing, test, quality and reliability teams to identify root cause and implement corrective actions.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
5 years of experience in system level test engineering.
Experience with Python or C/C++.
Experience in silicon System level components/LinuxOS.

Preferred qualifications:
Masters degree in Electrical Engineering, Computer Engineering, Computer Science, or related fields.
10 years of experience in test engineering and product engineering.
Experience with CPU/GPU and SoC architecture, design, validation and debug.
Experience in SLT hardware design and proliferation (e.g., system boards, peripheral devices, sockets, handler kits, and thermal control solutions).
Ability to venture into, and improve, all aspects of post-silicon testing from definition to realization.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544026
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