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Nuvoton Israel is a leading supplier of custom SoC and security hardware solutions for the computing and server markets. As a well-established and independent design center, we collaborate closely with top-tier customers such as HP, Dell, Qualcomm, Microsoft, and Google to develop advanced solutions that secure, control, and manage our customers platforms. We are seeking a talented and experienced Chip Architect to join our team. The ideal candidate is a self-motivated, fast learner with a strong background in hardware and system architecture. This role requires a technology leader capable of driving multidisciplinary programs and working closely with customers and internal teams across the entire product lifecycle. Responsibilities:
* Translate customer and marketing requirements into detailed SoC architectural specifications
* Provide functional specifications for chip hardware design and embedded software development
* Lead architectural decisions and serve as a technical authority across cross-functional teams
* Collaborate with customers and marketing to refine product requirements and align on technical solutions
* Support design, implementation, and verification processes throughout development
* Participate in system debugging, root-cause analysis, and issue resolution
* Support post-silicon bring-up, system integration, and software enablement

Required Staff Architect, Digital Signal Processing, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Staff Engineer on the Digital Signal Processing team, you will be a technical leader responsible for architecting and developing the core algorithms that power our next-generation data center interconnects. You will leverage your expertise in communication theory, forward error correction (FEC), and modulation to design novel, low-complexity solutions that push the boundaries of speed and reliability.
In this role, you will not only define the technical direction for critical projects but also mentor other engineers and collaborate across hardware and software teams to bring your goal to life in silicon.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Lead the architecture, design, and implementation of digital signal processing (DSP) algorithms for high-speed optical communication systems. Drive the long-term technical roadmap for our signal processing and communication architectures by staying current with academic and industry trends.
Develop and analyze novel forward error correction (FEC) and modulation schemes to optimize for performance, power, and complexity tradeoffs.
Create comprehensive system-level models using tools like Matlab, Python, or C++ to simulate and validate algorithm performance.
Collaborate closely with logic design, verification, and software teams to ensure the successful implementation, integration, and bring-up of algorithms in custom silicon.
Provide technical leadership and mentorship to a team of DSP and communication systems engineers, fostering innovation and engineering excellence.

Required Machine Learning Hardware Architect, Hardware, Software Co-Design, Cloud
Note: By applying to this position you will have an opportunity to share your preferred working location from the following: Tel Aviv, Israel; Haifa, Israel.
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As a Machine Learning Hardware Architect within the Co-design team, you will serve as a technical lead bridging model architecture innovation and next-generation hardware design. Operating at the highest levels of AI research and engineering, you will define the goal and architectural roadmap for our future machine learning serving and training capabilities. You will guide the integration of ML research such as massive-scale foundation models with advanced silicon architectures to create industry-leading, high-performance, and power-efficient accelerators.
Responsibilities
Define and drive the technical roadmap and architecture for the hardware/software stack to ensure exceptional performance for ML models. Act as the technical liaison across research, software, and hardware teams, steering model architecture innovation to maximize scaling, quality, and hardware efficiency.
Architect next-generation configurable simulation frameworks and performance models, setting the organizational standard for evaluating complex microarchitectural decisions. Drive high-stakes choices regarding Power, Performance, Area (PPA) and buildability for future chip and system architectures, expertly balancing long-term technological trends with strict product delivery timelines.
Guide system-level performance analysis across highly distributed ML systems, innovating new methodologies to optimize and balance compute, memory bandwidth, and inter-chip network requirements. Their leadership will directly shape the future of high-performance AI infrastructure and hardware-software co-design.
Manage cross-functional partnerships across hardware, compiler development and ML teams.

we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.
As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners.You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our companys products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

we are looking for a HW Architect team leader.
As HW Architect Team Leader, you will combine deep technical leadership with people leadership. You will shape next-generation networking silicon while building and mentoring a strong architecture team.
What Youll Be Doing:
Lead, manage, and mentor a team of HW architects, fostering technical excellence and innovation.
Drive research, evaluation, and architectural definition of next-generation SoCs - from product requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet and NIC switches.
Lead system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate cross-functionally with design, verification, modeling, software, and other architecture teams to ensure end-to-end system alignment.
Identify and evaluate new technologies, methodologies, and architectural approaches for future products.
Provide technical direction, make key architectural trade-offs, and ensure execution excellence

we are looking for a Senior HW architect.
What will you be doing?
Lead research, evaluation, and architectural definition of next-generation chips - from requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet Switches.
Design the system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate closely with design, verification, and modeling teams to ensure architectural intent is fully realized.
Work cross-functionally with other architecture teams to shape cohesive system solutions.
Explore and evaluate new technologies and innovative approaches for future products.

we are looking for a Senior Core Power Management Architect.
Job Description:
Will drive the implementation of autonomous core power management for best performance and power efficacy.
The Power expert will take charge in understanding business-units (customers) needs, and translate them to CPU core solution.
This expert will utilize his power management experience to deliver world-class power efficient HW-SW solutions for Huawei products.
Responsibilities:
Responsible for bringing Huawei CPU to a leading position in Performance-Power efficiency.

we are looking for a Senior CPU Core Architect.
The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

Required Micro-Architect
Description
A global leader in control systems for quantum computing, a field on the verge of exponential growth.
Our innovative hardware and software mark a groundbreaking approach in quantum computer control, scaling from individual qubits to expansive arrays of thousands.
At the core of the company lies a passionate and ambitious team committed to reshaping the construction and operation of quantum computers.
Our work is fueled by a deep understanding of customer needs, driving us to deliver unparalleled solutions in this revolutionary field.
Join our cutting-edge hardware development team as Micro-Architect and play a key role in defining and implementing the micro-architecture of advanced digital logic components.
What You'll Do:
Define and develop micro-architecture for complex logic blocks - from concept through high-quality RTL implementation
Collaborate closely with architecture, verification, design and software design teams
Write clear and detailed design specifications and drive architectural trade-off analysis
Optimize for performance and area
Contribute to innovation, methodology improvements, and technical leadership within the team.

We are seeking a technical leader to define, craft, implement, and guide firmware architecture for reliability, availability, serviceability, and power management across next-generation Networking products and platforms. You will take a strong hands-on role, working with hardware, firmware, software, validation, customer engineering, and external partners to build robust, diagnosable, power-efficient systems for large-scale deployments.

What you'll be doing:

Define platform-level firmware architecture for RAS and power management across SoCs, accelerators, DPUs, servers, embedded systems, and data center platforms.

Own error detection, classification, containment, recovery, escalation, and reporting architecture.

Define firmware architecture for power sequencing, power states, reset flows, thermal and power fault handling, idle management, and recovery from power-related failures.

Create firmware specifications for hardware error handling, health monitoring, crash capture, telemetry, diagnostics, debug data, and field serviceability.

Define interfaces and contracts between firmware, hardware, operating systems, BMCs, management controllers, platform software, and cloud/service infrastructure.

Drive architecture reviews, tradeoff discussions, failure-mode analysis, validation strategy, and long-term RAS and power management roadmap planning.

Establish standards for error logs, event schemas, telemetry flows, recovery policies, service diagnostics, and production debug infrastructure.

Guide engineering teams through implementation, validation, silicon bring-up, platform integration, and production deployment of RAS and power management features.

Analyze customer and field failures, identify architectural gaps, and feed lessons learned into future platform designs.