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Required HW Architect team leader
About the Group
We are a highly experienced architecture group specializing in switch processing, with deep expertise in both hardware and software architecture in the high-speed networking domain.
Our innovative packet processors power some of the most advanced data centers in the world and are designed into tier-1 vendor platforms. With state-of-the-art technology, a strong track record of industry recognition, and multiple award-winning achievements, we continuously push the boundaries of performance and scalability.
Our group is involved across the entire development lifecycle - from early research and architectural definition to silicon production - working on both research initiatives and production-grade products.
our Impact:
As HW Architect Team Leader, you will combine deep technical leadership with people leadership. You will shape next-generation networking silicon while building and mentoring a strong architecture team.
What Youll Be Doing:
Lead, manage, and mentor a team of HW architects, fostering technical excellence and innovation.
Drive research, evaluation, and architectural definition of next-generation SoCs - from product requirements through production.
Define next-generation Packet Processor / Datapath / Congestion Management architectures for high-performance, complex SoC Ethernet and NIC switches.
Lead system architecture and detailed micro-architecture definition across major functional blocks.
Collaborate cross-functionally with design, verification, modeling, software, and other architecture teams to ensure end-to-end system alignment.
Identify and evaluate new technologies, methodologies, and architectural approaches for future products.
Provide technical direction, make key architectural trade-offs, and ensure execution excellence.

about the role:
we are seeking a talented and motivated r&d physicist. in this role, you will be responsible for designing and carrying out experiments for siph chip performance and characterization, performing and analyzing laboratory experiments of chip level optical systems assembly, and developing and managing setups for photonics and laser devices characterization. in this roll you will be required to travel abroad for demonstrations and exhibitions as needed.
we develop cutting-edge technology in silicon photonics which is revolutionizing connectivity and communication in data centers. silicon photonics is becoming a standard technology used for high performance systems, solving challenges of performance, integration, power and cost. this technology is growing rapidly also in other markets such as healthcare, lidars and other sensors. we are looking to solve the difficult problems, in a smart and simple way, by thinking out of the box, leveraging the knowledge and know-how of the team members and work as team to create magic.
why join us:
purpose: we invest in what matters. from meaningful-future shaping projects to competitive compensation, we empower you to grow your career while making a lasting impact.
people: connection starts within. we collaborate, celebrate wins, and create an environment where everyone can do their best work.
possibilities: our belief shapes whats next. our technology powers the most reliable and energy-efficient connections around the world - and our team powers new products and markets that come next.
responsibilities:
design and carry out experiments for siph chip performance and characterization.
perform and analyze laboratory experiments of chip level optical systems assembly.
develop and manage setups for photonics and laser devices characterization.
provide Technical Support to the r&d team for experiments and data analysis.
contribute to the development of new testing methodologies and techniques.
ensure adherence to experimental protocols and safety procedures.
maintain laboratory equipment and supplies.
about us:
our mission is to transform connectivity at scale through fast, reliable, and energy-efficient system solutions. our high-speed copper and optical interconnect products deliver industry-leading power and performance at up to 1.6t to meet the ever-expanding data infrastructure demands of ai.
our product portfolio includes components and solutions for copper and optical connectivity. our innovations enable our customers to connect the systems that connect the world. in israel, we develop the most innovative silicon photonics technology and products which are deployed in ai and cloud services data centers.

As we expand our presence in Israel, we're seeking a highly skilled Physical Design Engineer specializing in SoC EMIR to join our local engineering powerhouse from the ground up.

This is a unique opportunity to take on meaningful technical ownership in a new site, executing the backend power methodologies for chips that power the world's largest AI clusters. As an EMIR Engineer, you will be a core technical contributor ensuring the power robustness and long-term reliability of our high-performance connectivity silicon.

You will be responsible for SoC EMIR Analysis to ensure our products meet aggressive voltage drop and reliability targets in advanced FinFET process nodes, directly impacting the performance and yield of chips operating in the worlds most demanding AI and cloud environments.

Key Responsibilities
Take responsibility on IR drop analysis and signal/power electromigration (EM) of very complex chip.
Collaborate closely with Physical Design team to insure a full power integrity
Be responsible on IR architecture for timing convergence.
Partner with Package Design engineers to perform Chip-Package co-analysis (CPM).
Understand root-cause analysis for voltage drop violations and EM risks.
Be responsible and go-to person for any IR related issues.

Write and review micro-architecture specifications
Implement RTL (Verilog/SystemVerilog) to meet timing, performance, and power requirements
Contribute to full chip integration, timing methodology, and analysis
Collaborate with verification engineers to resolve bugs and achieve coverage closure
Work with the physical design team to close timing and PnR issues
Support design methodology evolution and best practices
Perform debug, root-cause analysis, and post-silicon validation in the lab

Required Digital IC Design- Intern
job requisition id
2604489
We are seeking a motivated and detail-oriented student to join our Design-for-Test (DFT) team as an ATPG (Automatic Test Pattern Generation) Engineer.
This role offers hands-on experience in the development and implementation of test methodologies for complex SoC designs, focusing on scan insertion, pattern generation, and fault coverage analysis.
Interact with IP teams/vendors to resolve all technical verification issues.
Work closely with design/DV/validation/SW teams
What You Can Expect:
Assist in scan insertion and ATPG flow setup for digital designs.
Generate and validate test patterns for stuck-at and transition faults.
Analyze fault coverage and identify areas for improvement.
Support silicon bring-up and debug of test-related issues.
Collaborate with design and verification teams to ensure testability requirements are met.
Document methodologies, results, and best practices.

We are looking for a talented EE/CS student to join the switching department. As a member of the team, you will be responsible for implementing the future devices of routing, using the most challenging, cutting-edge technology. In this role, you will be working with industry-standard tools on the biggest, most complex ASICs the semiconductor industry has to offer.
job requisition id
2604462.

we are looking for a talented Hardware Engineer to join our development team. If you enjoy designing complex electronic boards, solving real-world system challenges, and working on cutting-edge defense technologies, we would love to hear from you.
Responsibilities:
Design and develop electronic boards and system hardware architecture.
Lead the full product lifecycle: concept, schematic, layout guidance, bring-up, and production.
Collaborate with cross-functional teams (software, mechanical, system, and integration).
Work with subcontractors and support performance analysis.
Participate in design reviews, system validation, and field testing.
Support the transition from development to manufacturing.

Our Analog Layout design team is looking for a Senior Analog Layout Design Engineer - someone who is excited to join a growing group of diverse individuals responsible for handling challenge high-speed mixed-signal circuit designs. We have continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI - the next era of computing. We are a learning machine that constantly evolves by adapting to new opportunities that are hard to solve, that only we can pursue, and that matter to the world. This is our lifes work, to amplify human creativity and intelligence.

What you'll be doing:

Perform physical layout for mixed-signal functions like PLL's, high speed I/O circuits, SerDes, general I/O's, ESD structures designs in state-of-the-art sub-micron CMOS FinFET technologies using Cadence tools.

You will work with ASIC and mixed-signal engineers to customize designs for integration in VLSI products.

Job duties will include floor planning, custom layout and verifying against design rules and schematics, EM/IR analysis.

Required ASIC Design Verification Engineer, Digital Signal Processing
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, you will define and execute the verification strategy for high-speed Physical Layer (PHY) digital blocks. This role focuses on the functional and mathematical verification of complex DSP algorithms, digital-analog boundaries, and signal processing logic. This position requires a strong technical foundation in communication theory, fixed-point arithmetic, and mixed-signal co-simulation.
Responsibilities
Verify RTL implementations against high-level architectural reference models (MATLAB, C++, or SystemC) using bit-exact and fixed-point verification methodologies.
Verify the stability, tracking capability, and convergence of adaptive equalization loops (FFE, DFE) and timing recovery systems under varying channel impairments.
Model and verify the functional interface between Digital DSP blocks and the Analog Front End (AFE) using Real Number Modeling (RNM) or SystemVerilog-AMS.
Design, implement, and maintain scalable UVM-based simulation environments, SystemVerilog Assertions (SVA), and functional coverage metrics for digital signal processing blocks.

Spearhead innovative silicon architecture for AI infrastructure, guiding board design from concept through to mass production.

Act as the technical decision-maker for the project and collaborate with cross-functional teams in mechanics, thermal, PCB layout, and software/RTL.

Define product specifications, develop electrical schematics, and guide component selection.

Conduct hands-on testing in a lab environment and drive the PCB bring-up, characterization, and debugging stages.

Required Staff Design Engineer, Edge AI, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work to shape the future of an Edge-AI product, bringing high-performance intelligence to the edge. You will have an opportunity to drive distributed inference technology that powers real-time systems where latency and reliability are mission-critical.
You will be part of a team that pushes boundaries, developing robust, autonomous solutions that define the next generation of intelligent infrastructure and hardware for the edge. You will contribute to the innovation behind products that transform industries, leveraging your expertise in system-level integration and localized processing to deploy complex AI models across sophisticated hardware platforms, ensuring intelligence is embedded exactly where the action happens.
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make our product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
Lead a complex ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement groundbreaking data center.
Define high-performance hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.

Required Research Intern: Next-generation Computer Architecture for Racks and SuperPods
Responsibilities:
The research focuses on designing next-generation rack and SuperPod architectures that combine elasticity through resource pooling with optimal performance enabled by holistic co-design across applications, parallel programming models, interconnect fabrics, and compute, memory, and switch chip architectures. On the communication side, the work architects scalable, high-bandwidth, and low-latency scale-up fabrics across multiple chips at rack and SuperPod scale. On the memory side, it explores richer protocol semantics beyond traditional load/store operations to reduce unnecessary data movement and rethinks memory hierarchies to expose large-scale capacity with near-local latency. On the compute side, it analyzes the requirements of General Compute and Generative AI workloads and their parallel programming models to fully leverage large-scale system resources.
Investigate and prototype new architectural features, including but not limited to:
o Tiered Memory: Explore advanced memory organizations, including hardware-managed caching, to enable software-transparent, fine-grained promotion and demotion of cache lines across the memory hierarchy.
o Prefetching/Speculation: Evaluate and design existing and next-generation hardware prefetching and speculation mechanisms to effectively hide local and remote memory latencies at rack and SuperPod scale.
o Near-Memory/Network Processing: Develop support for key primitives executed at the memory and network layers to minimize unnecessary data movement across sparse, dense, and pointer-based data structures.
o Workload-Centric Co-Design: Study optimal parallelization strategies at rack and SuperPod scale for both General Compute and Generative AI workloads, and design dedicated hardware support for widely used parallel programming primitives such as RPCs and collective communication.
Write reports and papers on the research results and present them.

SolarEdge (NASDAQ: SEDG) is a global leader in high-performance smart energy technology, with over 3000 employees, offices in 34 countries, and millions of products installed in over 133 countries. Our diverse product offering comprises intelligent solar inverters, battery storage, backup systems, EV charging, and complete home energy management ecosystems. By leveraging world-class engineering capabilities and with a relentless focus on innovation, we strive to create a world where clean, green energy from the sun is the primary source of power for our homes, businesses, and just about everywhere we thrive. We are looking for an experienced PCB Layout Designer to join our Layout Design team within the SolarEdge Hardware division. The Layout Design team is responsible for the layout of all core Hardware products, including High-Voltage power boards, optimizers, communication circuits, and complex battery management systems (BMS). This is a highly challenging role where you will work in a dynamic, fast-paced environment, handling multiple priority projects under tight schedules while working closely with Hardware, Q&R, and Mechanical engineers. What you will do:
* Design and develop multi-layer PCB layouts from concept to production, including placement, routing, and final manufacturing outputs.
* Translate schematics into optimized layouts considering Signal Integrity (SI), Power Integrity (PI), EMI/EMC mitigation, thermal, and manufacturability constraints.
* Work in a Cadence Allegro and OrCAD Capture environment, including the use of parallel layout tools like Symphony to accelerate delivery.
* Collaborate closely with Mechanical engineers (handling 3D IDF/IDX transfers), R&D teams, and Reliability (Q&R) teams to meet strict mechanical constraints.
* Strictly adhere to our internal "Design Considerations" guidelines and the team's layout "Cookbook" methodologies to ensure standardized execution.

Country:
Israel

City:
Herzliya

This role is for a Design Verification Engineer who will enable us to produce fully functional first silicon IP designs. The responsibilities include all phases of pre-silicon verification including but not limited to: establishing DV methodology, test-plan development, verification environment development including stimulus and checkers, test-writing, debug, coverage, sign-off for RTL freeze and tape-out.

The position is relevant to all our sites: Herzliya, Haifa and Jerusalem.

In this role, you will be responsible for ensuring bug-free first silicon for part of the IP and are expected to: Develop detailed test and coverage plans based on the micro-architecture Develop verification methodology suitable for the IP, ensuring a scalable and portable environment. Develop verification environment, including all the respective components such as stimulus, checkers, assertions, trackers, coverage and more.

Required SoC Edge-AI Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning, test execution, to collecting and closing coverage.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and Universal Verification Methodology (UVM), or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.