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We are looking for exceptional software engineers to help develop the next generation chips based on a revolutionary architecture.
In this job you will design and develop software for functional and performance validation.

Key job responsibilities:
In this role you will develop system level software, targeting chip architecture, functional correctness and performance, running on various platforms and validating chip functionality.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.

join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF system -on-chip ( SOC ) products.
youll collaborate with internal teams and external osats to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
what will your job look like:
define and specify advanced package architectures for digital socs and RF ics in automotive applications.
perform substrate design for flip-chip bga (fc-bga) packages, including stack-up, routing, and ball-out optimizations.
evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
collaborate with osats to define and validate assembly materials and process flows.
work closely with internal teams such as backend, sipi, product engineering, and quality & reliability to ensure seamless integration.
monitor yield, quality, and manufacturability across package development and production stages.
support dfm reviews and ensure compliance with automotive standards and customer requirements.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving team behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

We are seeking a Digital Electrical Design Engineer with extensive experience in board-level digital design, high-speed interfaces, and embedded systems. In this role, youll be a technical lighthouse within our Hardware R&D team-guiding complex, high-speed digital designs from concept through production. Youll collaborate closely with firmware engineers, system architects, and other cross-functional teams spread across multiple global sites. While prior quantum or cryogenic experience isnt required, an interest in learning about these cutting-edge fields is a plus.
Key Responsibilities:
Digital Board-Level Design: Architect, design, and implement advanced digital solutions involving FPGAs, microcontrollers, and high-speed communication interfaces (multi-GHz range).
High-Speed Signal Integrity: Develop and validate clocking solutions up to the tens of GHz range and handle GT lines to ensure robust, reliable performance.
End-to-End Development: Own the entire hardware lifecycle-from concept and schematic design in Altium to layout review, testing, and production release.
Design for Manufacturing & Test (DFM/DFT): Integrate manufacturing and testing considerations into your designs, collaborating with supply chain and production teams to ensure scalability and cost-effectiveness.
Technical Collaboration: Work closely with firmware engineers, system architects, and cross-site R&D teams to ensure seamless hardware-firmware integration.
Remote Coordination: Engage in significant remote collaboration with minimal travel, leveraging Agile and Kanban methodologies for project execution.
Subject Matter Expert: Serve as a go-to resource for digital design best practices, helping to maintain high engineering standards across the organization.

We are looking for a Senior ASIC Physical Design Engineer to join our dynamic team, Join the ride as we spearhead the next revolution in electronics!
What Youll Do
Own and continuously improve our smooth product backend integration methodology, flows, and best practices using Cadence and Synopsys tools.
Develop, maintain, and scale automation and infrastructure (TCL / Python) to improve quality, predictability, and turnaround time.
Collaborate closely with multiple teams to ensure smooth handoffs and high-quality product.
Support field teams on complex technical issues when needed.
Responsibilities
Implementation of ASIC units using advanced flows
Developing BackEnd methodology using Cadence and Synopsys tools
Build and develop scripts for physical design implementation
Support Field team with customer issues.

We are looking for a Senior ASIC Physical Design Engineer to join our dynamic team, Join the ride as we spearhead the next revolution in electronics!
What Youll Do
Own and continuously improve our smooth product backend integration methodology, flows, and best practices using Cadence and Synopsys tools.
Develop, maintain, and scale automation and infrastructure (TCL / Python) to improve quality, predictability, and turnaround time.
Collaborate closely with multiple teams to ensure smooth handoffs and high-quality product.
Support field teams on complex technical issues when needed.
Responsibilities
Implementation of ASIC units using advanced flows
Developing BackEnd methodology using Cadence and Synopsys tools
Build and develop scripts for physical design implementation
Support Field team with customer issues.

The CPU Architect will take charge in defining a processor core that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.

As part of the Architecture team, you will:
Directs, leads, and manages the technical activities of a hardware development function for electronic design, mechanical design and/or hardware reliability.
Directs, leads, and manages the technical activities of a software development function for software systems, applications and/or software quality assurance.
Directs, leads, and manages the technical activities of an integrated hardware/software systems design function.
Define device specifications and architectural features for next-generation networking silicon.
Design and implement logic and software solutions that meet performance, power, and scalability requirements.
Develop software components in C++ as part of the silicon architecture and enablement flow.
Collaborate closely with design, verification, and software teams to translate specifications into working silicon.
Contribute to the development of a unified and programmable silicon architecture enabling AI-driven networks.
Take part in shaping our products that power the Internet of the future.

What youll be doing:
Working closely with product design engineers, you'll perform PCB layout of high speed/high-density value-conscious PCBs for all business units at NVIDIA (GPU Desktop, Notebook, Automotive, Professional, Data Center, Deep Learning, and AI), all using Cadence PCB design tools.
Focus will be on the complete development of CAD layout from symbol creation, floor planning, and detailed component placement, constraints management, with a concept of topology and signal/trace integrity.
You will be responsible for the design releases required generation of artwork files, ODB++, and electronic PCB documentation.
Your designs will need to follow SI constraints, EMI/RFI control and FCC, UL and European regulations, IPC specifications and NRC regulations.

Were looking for a Head of Design to lead our growing Product Design team and help define the future of our product experience. As a senior leader, reporting to the CPO, you will shape the vision, strategy, and operational approach for product design across our product, infusing world-class UX craft and cross-functional collaboration. Youll guide a high-performing team of designers and design managers, ensuring our solutions are delightful, intuitive, and empowering to our users.
Beyond leading Product Design, you will also own our brand expression and visual identity, and lead the Marketing Design function that brings our brand to life across marketing assets and campaigns-working in close partnership with the Creative team, who owns campaign concepts and creative strategy.
We are redefining how small-business owners run their companies through AI. Not by sprinkling isolated smart features across the product, but by building a true AI Business Partner. Think of it as an AI Super-Agent: a conversational ally (voice and text) paired with dynamic, generative UI that delivers instant visibility, actionable insights, continuous learning, and hands-on control. Creating this next-generation SaaS paradigm demands bold, system-level design thinking- exactly where our Head of Product Design will lead the charge.
This is a unique opportunity to impact a beloved product with a strong brand and a deeply engaged user base, while scaling design excellence in a fast-paced, AI-enhanced environment.
Here are a few of the things you'll do:
Own and drive the end-to-end product design vision across all user-facing experiences.
Inspire, coach, and manage a multidisciplinary design team, including design leads and ICs, fostering a culture of creativity, critique, and growth.
Collaborate with Product, Engineering, and Data leadership to shape product strategy, ensuring design thinking is central from discovery to delivery.
Build and scale design systems and tooling to ensure consistency, quality, and efficiency across teams.
Collaborate with our Marketing team, specifically with the Creative team, making sure our brand is reflected in the product and in our marketing assets in an effective and consistent way.
Champion the voice of the user-combining qualitative research, UX best practices, and business context to inform decisions.
Recruit, hire, and onboard top-tier design talent to support our continued growth.
Elevate design as a strategic function, helping articulate how product experiences tie into our business outcomes.

We are looking for Board Design Team Lead to join our Hardware team.
Roles and Responsibilities:
Lead and manage the Board Design team, including setting priorities, overseeing project execution, and ensuring high-quality deliverables across multiple hardware projects
Definition, design, and production of Chain Reaction reference designs and internal prototyping and evaluation HW
Product specifications
Electrical schematics
Component selection
Layout guidance
Hands-on development and testing in a lab environment
Accompanying production and qualification processes

Senior Board Design engineer We are seeking a Senior Board Design engineer with strong board-design expertise, a multidisciplinary background, and a proactive, hands-on approach to join our hardware team. In this role, you will be part of our R&D efforts, leading the development and enhancement of complex hardware systems-from concept and architecture through design, validation, and transition to serial production. If you are creative, open-minded, a strong team player, and eager to contribute to innovative technologies shaping the future battlefield, we would be excited to meet you.

which department will you join?
epg is a fast-paced, dynamic, and startup-like group responsible for researching, incubating and developing next-generation technologies and ideas, with a strong orientation towards computer vision, Machine Learning, data, and ai.
the group hosts a diverse team of scientists, engineers and developers to research, realize, and bring to market innovative new products, leveraging cutting-edge technologies, skills and capabilities.
were looking for a backend expert to join the growing physical design team, responsible for state of the art SOC design from definition to tape-out.
what will your job look like:
hands-on physical design block owner from rtl to gds.
floorplan exploration with guidance and collaboration with Front-End and architecture teams.
sta: work with fe and floor planner to manage block and top level constraints and 1st level of timing analysis.
synthesis exploration and final synthesis netlist: scan insertion @ synthesis, clean checks from lint, upf & spyglass.
place & route: from synthesis netlist to final layout and signoff verification with target to achieve best power performance and area.