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09/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Physical design of blocks according to specifications under challenging constraints targeting for the best power, area, and performance.

Be exposed and work on a variety of challenging designs (including high cell count and HS blocks). Resolving complex timing and congestion problems.

Daily work involves all aspects of physical design chip development (RTL2GDS) - synthesis, power and clock distribution, place and route, timing closure, power and noise analysis, and physical verification.

Taking part inflows development.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent experience.

1+ years of relevant experience.

Proven experience in RTL2GDS flows and methodologies.

Knowledge in physical design flows and methodologies (PNR, STA, physical verification).

Deep understanding of all aspects of Physical construction and Integration.

Knowledge in Physical Design Verification methodology LVS/DRC.

Familiarity with physical design EDA tools (such as Synopsys, Cadence, etc.).

Great teammate.
This position is open to all candidates.
 
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09/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Staff / Principal ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Staff / Principal ASIC Design Engineer, you won't just build chips-you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Bachelor's degree in Electrical Engineering or related technical field
5+ years of experience in logic design at semiconductor companies
Knowledge and experience in Verilog and/or SystemVerilog
Excellent communication skills with ability to work effectively across teams
Understanding of digital design principles and RTL coding best practices
Preferred Qualifications
Master's degree in Electrical Engineering or related field
Knowledge of DDR and PCIe protocols and implementation
Understanding of power management techniques for low-power design
Familiarity with Clock Domain Crossing, simulation, debugging, synthesis, and timing analysis
Proficiency in scripting languages such as Python or Perl
Experience with high-speed serial interface designs or connectivity protocols.
This position is open to all candidates.
 
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09/08/2026
Location: Merkaz
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our company products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.
Requirements:
5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.
This position is open to all candidates.
 
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09/08/2026
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
The System-On-Chip (SOC) group is looking for a Senior RTL Design Engineer to serve as the technical lead for clocks development on our next-generation networking chips. Clocks are the backbone of the SOC. In this role you will lead the development of the chip's clocking logic - PLL and reference clock integration, clock generation, distribution, muxing and dividers, glitchless switching, clock gating, reset synchronization, and the clock domain crossing infrastructure that every unit on the die depends on.

This is an RTL design and technical leadership role, not a circuit or transistor-level design role. Working from the clock architecture defined with the architecture and micro-architecture teams, you will lead its implementation in RTL, guide other engineers contributing to it, and drive it through to silicon in close partnership with Design Verification and Physical Design (backend). You will also interact regularly with CAD, Package Design, Software, and DFT teams.

What you'll be doing:

Acting as the technical lead for SOC clocks development - leading the implementation of the clocking logic from specification through tape-out and bring-up.

Working with the architecture and micro-architecture teams on the SOC clock and reset scheme: collecting clocking requirements from units across the chip, feeding back implementation and timing considerations, and translating the agreed scheme into a verifiable design.

Writing and reviewing synthesizable Verilog/SystemVerilog RTL for clock generation, distribution, muxing, division, glitchless switching, gating, and reset synchronization.

Leading and mentoring other RTL engineers working on clocking: reviewing designs, setting coding and quality standards, and distributing work across the team.

Working hand-in-hand with the Physical Design (backend) team on clock tree implementation, SDC/timing constraints, partitioning, floorplan feedback, trial synthesis, and timing convergence.

Partnering with Design Verification on clocking testplans, functional and gate-level debug, and coverage closure.

Supporting Software and firmware teams on clock programming sequences, DVFS, and low-power/clock-shutdown flows.

Representing clocking implementation in cross-functional design reviews with architecture, PD, DV, DFT, and CAD stakeholders.
Requirements:
What we need to see:

B.Sc./M.Sc. in Electrical Engineering or Computer Engineering.

8+ years of relevant experience in RTL/logic design, with multiple chips taken to tape-out.

Demonstrated technical leadership: leading a design area through implementation and tape-out, mentoring engineers, and coordinating across teams.

Expert hands-on RTL design skills in Verilog/SystemVerilog, with strong understanding of how RTL choices affect synthesis results, timing, area, and power.

Deep understanding of clocking and reset design: clock gating, clock muxing and dividers, glitchless clock switching, reset synchronization, and clock domain crossing.

Proficiency with design quality tooling - lint, CDC/RDC, formal verification, synthesis, and static timing analysis (STA) - including the ability to interpret results and drive fixes back into the RTL.

Experience taking a design from architecture and micro-architecture specification through verification, physical implementation, and silicon bring-up.

Great teammate with strong communication skills across micro-architecture, DV, backend, DFT, and software teams.


Ways to stand out from the crowd:

Prior hands-on experience with SOC-level clocking or reset logic on a taped-out chip.

Experience with PLL/clock generator integration and clock tree constraint development with backend teams.

Experience with high-speed networking, interconnect, or fabric designs.

Background with low-power design techniques (clock gating, DVFS, power domains, UPF).

Experience building automation for RTL integration, chip assembly, or design quality flows.
This position is open to all candidates.
 
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10/08/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a talented Junior ASIC Design Engineer to help build our local engineering powerhouse from the ground up. This is an exciting opportunity to take on meaningful product ownership in a new site, designing the digital blocks that sit at the heart of our most ambitious connectivity projects.
As a Junior ASIC Design Engineer, you won't just build chips - you will be part of a team defining the next generation of AI infrastructure main components. The complex digital blocks under your micro-architecture and implementation responsibilities will power the world's largest AI clusters. You will own the journey from high-level definition through RTL implementation and backend support, transforming complex logic challenges into elegant, high-performance hardware. If you thrive on solving challenging problems in deep-submicron processes and want to contribute to the digital design foundation for AI infrastructure connectivity, this is your opportunity.
Key Responsibilities
Design Ownership & Implementation
Own the journey from high-level definition through micro-architecture, coding, and debug to backend implementation support
Tackle complex logic challenges and transform them into elegant, high-performance hardware solutions
Serve as the point of contact for your logic blocks, interacting with Architecture, Verification, and Backend teams
Quality Assurance & Design Optimization
Utilize industry-leading EDA tools (Lint, CDC, Synthesis, Timing, Power) and in-house quality assurance tools to ensure designs are robust, scalable, and power-efficient
Apply design techniques to meet PPA (Power, Performance, Area) targets
Contribute to design quality through verification and validation activities
Methodology Innovation & Collaboration
Participate in design methodology improvements and tool automation initiatives
Leverage AI assistance tools and contribute to in-house automation development to make engineering workflows faster and smarter
Collaborate effectively across teams to ensure seamless integration.
Requirements:
Education: Bachelors degree in Electrical Engineering, Computer Engineering, or a related technical field.
Experience: 0-2 years of experience in logic design (relevant internships, university labs, or hands-on academic projects are highly valued).
Technical Skills:
Foundational knowledge of Verilog and/or SystemVerilog.
Strong understanding of digital design principles and fundamental RTL coding concepts.
Soft Skills: Excellent communication skills with a strong motivation to learn, adapt, and collaborate effectively within cross-functional teams.
Preferred Qualifications
Master's degree in Electrical Engineering or related field.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Designer Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with Functional Design, Design for Testing (DFT), Architecture, and Packaging Engineers. Additionally, you will solve technical problems with micro-architecture and logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Define and drive the implementation of physical design methodologies.
Take ownership of one or more physical design partitions or top level.
Drive to the closure of timing and power consumption of the design.
Contribute to design methodology, libraries, and code review.
Define the physical design related rule sets for the functional design engineers.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering or equivalent practical experience.
4 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Masters degree in Electrical Engineering, or a related field.
Experience coding with System Verilog and scripting with Transaction Control Language (TCL).
Experience with Very Large Scale Integration (VLSI) design in SoC.
Experience with multiple-cycles of SoC in ASIC design.
Experience with layout verification and design rules.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Design Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience architecting networking ASICs from specification to production or equivalent experience.
Experience developing RTL for ASIC subsystems.
Experience in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with design networking: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience architecting networking switches, end points, and hardware offloads.
Experience working with software teams optimizing the hardware/software interface.
Experience in a procedural programming language (e.g., C++, Python, Go).
Knowledge of TCP, IP, Ethernet, PCIE and DRAM.
Familiarity with Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Junior SoC IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our Platforms Infrastructure Engineering team designs and builds the
hardware and software technologies that power all of our services. Our computational challenges are complex and unique, enabled by custom hardware designed and made in-house. As a hardware engineer, you will design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You will see those systems from concepts all the way through to high-volume manufacturing. Your work has the potential to shape the machinery that goes into our data centers, affecting millions of users.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog), function/performance simulation debug and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power closure and ASIC silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
1 year of experience with digital logic design principles, RTL design concepts, and languages such as Verilog or SystemVerilog.
Experience with design sign off and quality tools (Lint, CDC , etc.).
Preferred qualifications:
Master's degree or PhD in Computer Science, or a related technical field.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate (DDR), Advanced eXtensible Interface (AXI), Advanced RISC Machine (ARM) processors family.
Knowledge of high performance and low power design techniques.
Knowledge of assertion-based formal verification.
Knowledge of SOC architecture.
Excellent problem-solving and debugging skills.
This position is open to all candidates.
 
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Package Design/Layout Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of our AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Dive into the architecture and microarchitecture of complex hardware units and features, such as packet processing pipelines and advanced networking capabilities. Develop comprehensive post-silicon validation test plans based on a thorough understanding of the design and specifications.
Write, execute, and debug validation tests using Python and/or C/C++, running on Pre-Si emulation platforms and primarily on the silicon.
Lead the bring-up, troubleshooting, and debug efforts on silicon, identifying root causes of hardware and software issues. Collaborate closely with architects, designers, and other teams to drive bug fixes and ensure feature functionality.
Contribute to the development of test infrastructure and methodologies to improve validation efficiency and coverage. Mentor and guide junior engineers as the team grows.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with functional tests for silicon validation (i.e., writing in C or C++ or Python or similar).
5 years of experience in pre-silicon or post-silicon validation.
5 years of experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Ability to learn new systems quickly and work independently in a fast-paced environment.
Excellent communication and collaboration skills.
A passion for deep technical challenges, excellent problem-solving skills, and a strong sense of ownership.
Interest in hardware and a desire to transition into silicon validation.
This position is open to all candidates.
 
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25/08/2026
Location: Rosh Haayin
Job Type: Full Time
We are looking for Senior Hardware Engineer who can be part of the System& Platform R&D group, who is ready to take on technical leadership and help drive the development of complex, high‑performance hardware for communication and networking systems.
If youre passionate about high‑speed digital design, enjoy mentoring engineers, and thrive in a hands‑on technical environment.
What Youll Do?
Hardware Design & Ownership
Design high-speed digital boards (SerDes, DDR, Ethernet).
Own schematic development and closely oversee PCB layout.
Ensure robust SI/PI performance through analysis and review.
Lead board bring‑up, validation, troubleshooting, and optimization in the lab.
Cross‑Functional Collaboration
Work closely with SW, FPGA, mechanical, and RF teams for system integration.
Present technical insights, design updates, and project risks to management.
Requirements:
Bachelors or Masters degree in Electrical Engineering or related field.
7+ years of hands‑on hardware design experience.
Strong background in high‑speed digital design, SI/PI, and board‑level architecture.
Proficiency in Cadence Capture & Allegro.
Solid lab experience - debugging, measurements, and bring‑up.
Experience with Ethernet‑based communication hardware.
Familiarity with EMC/EMI practices and regulatory requirements.
Experience in clocking and synchronization circuit solutions (PLL, clock trees, jitter analysis, timing architectures ,SyncE ).
Excellent communication, leadership, and problem‑solving skills.
Excellent command of English - written and verbal - with the ability to communicate effectively across global teams.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8796578
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required CPU Design for Test Engineer, Cloud
In this role, you will be part of a varied team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design-for-Test (DFT) Engineer, you will play a crucial role in DFT design, and support devices of extreme complexity to production. You will be responsible for developing flows, automation, and methodology, executing DFT activities. You will be responsible for test vectors end-to-end, from generating DFT content on complex design, debugging to coverage goals, simulating it at gate level, sign-off DFT to tapeout, and debugging Si results.The AI and Infrastructure team is redefining whats possible. We empower our customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency,
We're behind our groundbreaking innovations, empowering the development of AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Execute activities in the design, implementation, and verification of Design for Testing solutions for Application-Specific Integrated Circuit (ASICs).
Develop DFT strategy for array DFT, hierarchical DFT, Scan, and Automatic Test Pattern Generation (ATPG).
Perform ATPG, scan coverage debug and drive design fixes for coverage and quality improvements.
Perform DFT verification at RTL and gate level.
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT design requirements are met and mutual dependencies are managed.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
4 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with industry-standard Automatic Test Pattern Generation (ATPG) methods, fault modeling, and scan coverage debug.
Experience validating Memory Built-In Self-Test (MBIST) structures and Joint Test Action Group (JTAG)/ Test Access Port (TAP) controllers.
Experience running structural verification, debugging testbenches, or simulation tracking utilizing simulators.
Preferred qualifications:
Master's degree in Electrical Engineering.
Experience with the Tessent shell environment, specifically extracting Instrument Connectivity Language (ICL) networks.
Familiarity with Silicon bring-up and validation on Automatic Test Equipment (ATE) testers, including debugging hardware execution patterns.
Proficiency using Python or Tcl to manage complex Electronic Design Automation (EDA) design and sign-off flows.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8782511
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required ASIC Design Verification Technical Lead, High-Speed DSP
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
As an ASIC Design Verification Technical Lead, you will define how we verifiy the physical-layer Digital Signal Processing (DSP) pipelines powering our next-generation AI hardware accelerators. You will drive the shift toward Emulation and Post-Silicon Correlation, ensuring that our architectural reference models and pre-silicon simulations perfectly match the physical behavior of the high-speed silicon in our planetary-scale AI data centers.
Responsibilities
Design, build, and scale constrained-random verification environments using SystemVerilog and UVM for high-speed physical-layer DSP blocks.
Build co-simulation frameworks and predictors to compare RTL implementation output against high-level algorithmic models.
Define and execute functional coverage plans, utilizing covergroups and SystemVerilog Assertions to verify architectural corner cases, fixed-point quantization effects, and numerical overflows.
Author dynamic stimulus sequences and virtual sequencers to stress-test adaptive feedback loops under realistic channel impairments, including noise, ISI, and high-frequency jitter profiles.
Lead the debugging of RTL and environment failures, collaborating closely with algorithm and DSP designers to isolate and resolve discrepancies between the RTL implementation and the specification.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related technical field.
12 years of experience in design verification.
Experience in high-speed PHY layers, high-speed interface subsystems, or mixed-signal verification.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering, or a related technical field.
Experience defining verification architectures, methodologies, and roadmaps for AI accelerators, High-Performance Computing or high-bandwidth networking silicon.
Experience bridging the gap between Pre-Silicon verification (simulation and emulation) and Post-Silicon validation and correlation.
Experience driving advanced verification methodologies.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8786842
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required CPU Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning and test execution to collecting and closing coverage.
We're the driving team behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for Cloud, Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and Universal Verification Methodology (UVM), or formally verify designs with SystemVerilog Assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
4 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, or a related field.
3 years of experience creating and using verification components and environments in standard verification methodology.
Experience with Application-Specific Integrated Circuit (ASIC) standard interfaces and memory system architecture.
Experience with verification techniques, and the full verification life cycle.
Experience with performance verification of ASICs and ASIC components.
Knowledge of CPU/Processor architectures (e.g., pipeline, cache, memory subsystem, instruction sets, exceptions) like ARM, X86 or RISC-V, for verifying processor cores or IP blocks.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8782537
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
03/09/2026
Location: Herzliya
Job Type: Full Time
BIRD Aerosystems is a global leader in the development of advanced airborne defense, intelligence, and surveillance solutions for military, governmental, and commercial aviation. Our innovative technologies are deployed worldwide, supporting mission-critical operations and protecting aircraft through advanced multidisciplinary systems. As we continue to grow, we are looking for a talented Hardware Design Engineer (Board Design) to join our Hardware Development team and contribute to the design and development of advanced electronic boards for complex aerospace and defense systems. What You’ll Do · Design, develop, and modify electronic boards throughout the entire product lifecycle. · Perform board bring-up activities following development and initial manufacturing. · Troubleshoot hardware issues, analyze failures, and implement design improvements. · Edit schematics and support PCB layout activities. · Improve product manufacturability and maintain production documentation. · Support PCB manufacturers and electronic assembly subcontractors while ensuring compliance with IPC standards. · Investigate manufacturing failures and provide engineering solutions. · Work closely with multidisciplinary teams including Mechanical, Software, Firmware, and System Engineering. · Participate in design reviews (PDR/CDR). · Prepare engineering documentation, test procedures, and product verification documents. Support the transition from development to production.
Requirements:
· B.Sc. in Electrical Engineering / Electronics Engineering – Mandatory · Up to 5 years of professional experience in Hardware Design Engineering (excluding mandatory military service). · Proven experience in analog board design and high-power power supply design Mandatory · Hands-on experience performing board bring-up for digital boards and power supply boards – Mandatory · Experience with schematic editing and PCB layout support – Mandatory · Experience preparing and participating in design reviews (PDR/CDR) – Mandatory · Experience writing ATP and POD documentation – Mandatory · Experience supporting PCB manufacturing and electronic board assembly. · Strong proficiency with OrCAD and Allegro · Excellent Microsoft Office skills. · Fluent Hebrew and English. Nice to Have · Experience in the aerospace and defense industry. · Experience working with complex multidisciplinary systems. · Familiarity with IPC standards and production processes. Strong understanding of development in compliance with MIL-STD and DO-160 testing standards Why Join BIRD Aerosystems? · Work on advanced aerospace and defense technologies with global impact. · Take part in designing complex electronic systems deployed worldwide. · Collaborate with experienced engineers across multiple disciplines. · Join a professional, innovative, and growing organization. · Develop your expertise in a challenging and technology-driven environment. If you are passionate about hardware development, electronics, and advanced aerospace technologies, we would love to hear from you.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8743095
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Hod Hasharon and Haifa
Job Type: Full Time
Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Micro architect will take charge in defining a processor Micro architecture features that will improve the performance and reduce the power consumption of the CPU core. This architect will use a performance simulator to explore his ideas and will analyze implementability of these features: Power, Timing, Area. This architect will utilize his processor and VLSI design experience to develop many advanced features for Huawei processors.
Requirements:
Requirements
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Good understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store units, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory controller.
Good understanding of high speed digital VLSI design flow and methodology
Understanding of trade-offs between power, performance and area appropriately to meet the requirements of the product.
At least 6 years of experience in one of the leading CPU companies
Familiarity with the ARM\IA architecture and the micro-architecture for current ARM\IA CPU cores.
Software development (C, assembly).
Hands on experience as a Front end ASIC designer

DESIRED
Co-operate and communicate well with the architecture team and other members of the development.
Excellent verbal and written communication skills.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8792837
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