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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior Silicon Physical Design Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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8843099
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required RTL Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will use Application-Specific Integrated Circuit (ASIC) design experience to be part of a team that develops complex ASIC System-on-Chip (SoC) intellectual property from proof-of-concept to production. This includes creating IP Level microarchitecture definitions, Register-Transfer Level (RTL) coding and all RTL quality checks. You will also have the opportunity to contribute to design flow and methodologies, including design generation automation. You will collaborate with members of architecture, software, verification, power, timing, synthesis design for testing, etc. You will develop/define design options for performance, power and area.
Responsibilities
Define the IP microarchitecture level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform RTL development (coding and debug in Verilog, SystemVerilog).
Conduct function/performance simulation debug and Lint/CDC/FV/UPF checks.
Engage in synthesis, timing/power closure, and ASIC silicon bring-up.
Contribute to verification test plan and coverage analysis of block and SoC-level.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
4 years of experience with digital logic design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience in logic design and debug with Design Verification (DV).
Experience with microarchitecture and specifications.
Preferred qualifications:
Experience with logic synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with design sign off and quality tools (e.g., Lint, CDC, VCLP, etc.).
Experience in a scripting language like Python or Perl.
Knowledge of SoC architecture and assertion-based formal verification.
Knowledge of one of these areas, PCIe, UCIe, DDR, AXI, ARM processors family.
Knowledge of high performance and low power design techniques.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8847193
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Physical Designer Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with Functional Design, Design for Testing (DFT), Architecture, and Packaging Engineers. Additionally, you will solve technical problems with micro-architecture and logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
Responsibilities
Define and drive the implementation of physical design methodologies.
Take ownership of one or more physical design partitions or top level.
Drive to the closure of timing and power consumption of the design.
Contribute to design methodology, libraries, and code review.
Define the physical design related rule sets for the functional design engineers.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering or equivalent practical experience.
4 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Masters degree in Electrical Engineering, or a related field.
Experience coding with System Verilog and scripting with Transaction Control Language (TCL).
Experience with Very Large Scale Integration (VLSI) design in SoC.
Experience with multiple-cycles of SoC in ASIC design.
Experience with layout verification and design rules.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8847166
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Senior SOC and IP Design Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Define the SoC/block level design document such as interface protocol, block diagram, transaction flow, pipeline, etc.
Perform Register-Transfer Level (RTL) development (e.g., coding and debug in Verilog, System Verilog), function/performance simulation debug and Lint/Cyber Defense Center/Formal Verification/Unified Power Format checks.
Participate in synthesis, timing/power closure, and Application-Specific Integrated Circuit (ASIC) silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience with digital reasoning design principles, Register-Transfer Level (RTL) design concepts, and languages such as Verilog or System Verilog.
Experience with reasoning synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power and design techniques.
Experience in reasoning design and debug with Design Verification (DV).
Preferred qualifications:
Experience with a scripting language like Python or Perl.
Experience with design sign-off and quality tools (e.g., Lint, clock domain crossing (CDC), etc.).
Knowledge of System on a chip (SOC) architecture and assertion-based formal verification.
Knowledge of design techniques.
Knowledge in one of these areas: Peripheral Component Interconnect Express (PCIe), Universal Chiplet Interconnect Express (UCIe), Double Data Rate SDRAM (DDR), Advanced Extensible Interface (AXI), ARM processors.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8843747
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Micro-Architect, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Lead Design Activities at IPs, SubSystems(S.S) and SoC.
Define the block-level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up, as well as test plan development and coverage analysis for block and SOC-level verification.
Communicate and collaborate with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related technical field, or equivalent practical experience.
8 years of experience architecting networking ASICs from specification to production or equivalent experience.
4 years of experience in technical leadership.
Experience developing RTL for ASIC subsystems.
Experience in micro-architecture, design, verification, logic synthesis, and timing closure.
Experience in micro-architecture, RTL Design, verification, design quality checks, physical design aspects of RTL coding, and power.

Preferred qualifications:
Experience architecting networking switches, end points, and hardware offloads.
Experience working with design networking: RDMA or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience working with software teams optimizing the hardware/software interface.
Proficiency in a procedural programming language (e.g., C++, Python, Go).
Knowledge of TCP, IP, Ethernet, PCIE and DRAM.
Familiarity with Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8843779
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Staff Design Engineer, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will be part of a team developing application-specific integrated circuits (ASICs) used to accelerate networking in data centers. You will have multiple responsibilities in areas such as project definition, design, and implementation. You will participate in the design, architecture, documentation, and implementation of the next generation of data center accelerators.You will also be responsible for performance analysis for a networking stack using your knowledge.
Responsibilities
Lead an ASIC subsystem.
Understand how it interacts with software and other ASIC subsystems to implement data center networks.
Define hardware/software interfaces. Write micro architecture and design specifications.
Define efficient micro-architecture and block partitioning/interfaces and flows.
Collaborate closely with software, verification, and physical design stakeholders to ensure the designs are complete, correct, and performant.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
10 years of experience architecting networking ASICs from specification to production.
Experience developing Register-Transfer Level (RTL) for ASIC subsystems.
Experience with cross-functional engagement in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with software teams optimizing the hardware/software interface.
Experience architecting networking switches, end points, and hardware offloads.
Experience working with design networking like: remote direct memory access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience in transmission control protocol (TCP), IP, ethernet, peripheral component interconnect express (PCIE) and dynamic random access memory (DRAM) including network on chip (NoC) principles and protocols (e.g., AXI, ACE, and CHI).
Proficiency in procedural programming language (e.g., C++, Python, Go).
Understanding of packet classification, processing, queuing, scheduling, switching, traffic conditioning, and telemetry.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8847176
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Herzliya
Job Type: Full Time
As part of our Silicon Technologies group, youll help design our next-generation, power-efficient, system-on-chip (SoC). Our wireless SoC organization is responsible for all aspects of wireless silicon development. With a particular emphasis on highly energy-efficient design and new technologies that transform the user experience at the product level. Joining this group means youll be responsible for crafting and building the technology that fuels our devices. Together, you and your team will enable our customers to do all the things they love with their devices.

If you enjoy a fast-paced and challenging environment, and collaborating with people across different functional areas as well as thriving during crisis times, we encourage you to apply.

Responsibility of block and/or sub-system micro-architecture and design implementation.
Work with architects and system teams to define the right solution for the product requirements.
Implement block and/or sub-system design, analyze performance and power and support verification teams.
Responsibility of FE flows such as synthesis, CDC, RDC and Lint to ensure high quality production worthy design.
Requirements:
Minimum Qualifications
B.Sc. required with equivalent years of experience.
5+ years of hands-on experience in ASIC design flow.

Preferred Qualifications
Solid background in design micro-architecture.
Experience in ASIC design front end flows, such as Lint, CDC, RDC.
Experience in bus-fabrics and low power design is a plus.
Self-starter, highly motivated, highly organized, and schedule-driven.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8877004
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
27/09/2026
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
We are seeking a Package Layout Design Engineer to join our hardware team and contribute to the physical design of advanced IC packages for next-generation machine learning and data center ASICs.
In this role, you will execute package layout tasks from floor planning through tape out and manufacturing release, working closely with senior engineers, SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance, density, and reliability targets.

Key job responsibilities
- Execute package layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
- Implement physical designs for advanced packaging architectures including 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
- Support package floorplan development considering die placement, bump maps, power/ground distribution, signal escape routing, and decoupling capacitor placement.
- Perform RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
- Support die-level RDL routing and bump planning in coordination with ASIC physical design teams to help co-optimize the die-package interface.
- Contribute to cross-level layout co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
- Assist in maintaining package stack-up definitions in collaboration with SI/PI and materials engineering teams.
- Run physical verification checks (DRC, connectivity, shorts/opens) and support design closure.
- Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout - impedance-controlled routing, power plane optimization, and critical net shielding.
Requirements:
Basic Qualifications
- Experience identifying bugs in architecture, algorithms, functionality, and performance with strong overall debugging skills.
- Experience verifying at multiple levels of logic from IP blocks to SoCs to full system testing.
- 5+ years of experience in IC package layout and physical design.
- Experience executing package designs from concept through tape out for multi-layer organic substrates or silicon interposers.
- Hands-on experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent.
- Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects.
- Working knowledge of package design rules, DFM constraints, and physical verification methodologies (DRC, connectivity checks).
- Experience with bump map and ball map definition, escape routing strategies, and power/ground plane design.
- Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams.

Preferred Qualifications
- Experience with formal verification techniques including abstraction and end-to-end checking.
- Experience with ARM and various DSP ISAs.
- Experience with current and upcoming RF standards in cellular (4G/5G NR), WiMAX, 802.11ad, microwave backhaul, or related broadband wireless standards.
- Experience with industry standard tools and scripting languages (Python or Perl) for automation.
- MS with 3+ years in IC package layout and physical design
- Familiarity with substrate and interposer manufacturing processes, material properties, and their impact on design decisions.
- Exposure to chiplet-based or heterogeneous integration packaging architectures.
- Familiarity with package-level SI/PI concepts (impedance control, PDN layout, crosstalk-aware routing) sufficient to collaborate with SI/PI engineers.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8834518
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required Package Design/Layout Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Dive into the architecture and microarchitecture of complex hardware units and features, such as packet processing pipelines and advanced networking capabilities. Develop comprehensive post-silicon validation test plans based on a thorough understanding of the design and specifications.
Write, execute, and debug validation tests using Python or C/C++, running on pre-silicon emulation platforms and primarily on the silicon.
Lead the bring-up, troubleshooting, and debug efforts on silicon, identifying root causes of hardware and software issues. Collaborate closely with architects, designers, and other teams to drive bug fixes and ensure feature functionality.
Contribute to the development of test infrastructure and methodologies to improve validation efficiency and coverage. Mentor and guide junior engineers as the team grows.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with functional tests for silicon validation (i.e., writing in C or C++ or Python or similar).
5 years of experience in pre-silicon or post-silicon validation.
5 years of experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Ability to learn new systems quickly and work independently in a fast-paced environment.
Excellent communication and collaboration skills.
A passion for deep technical challenges, excellent problem-solving skills, and a strong sense of ownership.
Interest in hardware and a desire to transition into silicon validation.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8843847
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Caesarea
Job Type: Full Time
In this role, you will contribute to the development of complex ASIC package designs from early planning and exploration through implementation and tapeout. You will collaborate across package design, layout, SI/PI, and silicon teams to help deliver high‑speed, robust, and manufacturable package solutions.

You will participate in package architecture activities, design tradeoff discussions, and technical problem solving while growing your expertise in advanced packaging technologies and system-level integration. This role provides an opportunity to work on some of the most advanced networking silicon products in the industry within a highly collaborative engineering environment.

Responsibilities:
As a member of the Package Design team, you will:

Lead the package design activities including planning, floorplanning, pinout optimization, stack‑up definition, and high‑speed routing support.

Collaborate with SI/PI, silicon floorplanning, layout, and manufacturing teams to ensure high‑quality package solutions.

Support package implementation activities and work closely with layout designers to ensure alignment between design intent and physical implementation.

Participate in technical investigations, design reviews, and tradeoff discussions involving performance, manufacturability, and schedule considerations.

Assist in developing and improving package design methodologies, flows, and best practices.

Contribute to debugging, issue resolution, and package bring‑up activities as needed.
Requirements:
Bachelors degree in Electrical Engineering or a related field.

5+ years of experience in package, PCB, or high‑speed design engineering.

Strong understanding of high-speed signal design and power distribution networks (PDN).

Familiarity with industry-standard EDA tools for layout and design.

Strong communication skills with the ability to collaborate and coordinate effectively with cross-functional teams
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8837189
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required CPU Design for Test Engineer, Cloud
About the job
Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of our platforms, we make our product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
In this role, you will be part of a varied team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You will contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next-generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Design-for-Test (DFT) Engineer, you will play a crucial role in DFT design, and support devices of extreme complexity to production. You will be responsible for developing flows, automation, and methodology, executing DFT activities. You will be responsible for test vectors end-to-end, from generating DFT content on complex design, debugging to coverage goals, simulating it at gate level, sign-off DFT to tapeout, and debugging Si results.
Responsibilities:
Execute activities in the design, implementation, and verification of Design for Testing solutions for Application-Specific Integrated Circuit (ASICs).
Develop DFT strategy for array DFT, hierarchical DFT, Scan, and Automatic Test Pattern Generation (ATPG).
Perform ATPG, scan coverage debug and drive design fixes for coverage and quality improvements.
Perform DFT verification at RTL and gate level.
Work with other Engineering teams (e.g., Design, Verification, Physical Design) to ensure that DFT design requirements are met and mutual dependencies are managed.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field, or equivalent practical experience.
4 years of experience with Design For Test (DFT) methodologies, DFT verification, and industry-standard DFT tools.
Experience with industry-standard Automatic Test Pattern Generation (ATPG) methods, fault modeling, and scan coverage debug.
Experience validating Memory Built-In Self-Test (MBIST) structures and Joint Test Action Group (JTAG)/ Test Access Port (TAP) controllers.
Experience running structural verification, debugging testbenches, or simulation tracking utilizing simulators.
Preferred qualifications:
Master's degree in Electrical Engineering.
Experience with the Tessent shell environment, specifically extracting Instrument Connectivity Language (ICL) networks.
Familiarity with Silicon bring-up and validation on Automatic Test Equipment (ATE) testers, including debugging hardware execution patterns.
Proficiency using Python or Tcl to manage complex Electronic Design Automation (EDA) design and sign-off flows.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8843113
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Required CPU Design Verification Engineer, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will work as part of a Research and Development team. You will build verification components, constrained-random testing, and system testing, and drive verification closure. You will verify digital designs, collaborate closely with design and verification engineers on projects, and perform direct verification. You will build constrained-random verification environments that exercise designs through their corner-cases and expose all types of bugs. You will manage the full life-cycle of verification, which can range from verification planning and test execution to collecting and closing coverage.
We're the driving force behind our groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing,
Responsibilities:
Plan the verification of digital design blocks by fully understanding the design specification and interacting with design engineers to identify important verification scenarios.
Create and enhance constrained-random verification environments using SystemVerilog and universal verification methodology (UVM), or formally verify designs with SystemVerilog assertions (SVA) and industry leading formal tools.
Identify and write all types of coverage measures for corner-cases.
Debug tests with design engineers to deliver functionally correct design blocks.
Close coverage measures to identify verification holes and to show progress towards tape-out.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering or equivalent practical experience.
4 years of experience with creating and using verification components and environments in standard verification methodology.
Experience verifying digital logic at RTL level using SystemVerilog or Specman/E for FPGAs or ASICs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, or a related field.
3 years of experience creating and using verification components and environments in standard verification methodology.
Experience with Application-Specific Integrated Circuit (ASIC) standard interfaces and memory system architecture.
Experience with verification techniques, and the full verification life cycle.
Experience with performance verification of ASICs and ASIC components.
Knowledge of CPU/Processor architectures (e.g., pipeline, cache, memory subsystem, instruction sets, exceptions) like ARM, X86 or RISC-V, for verifying processor cores or IP blocks.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8843740
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
30/09/2026
Location: Herzliya
Job Type: Full Time
BIRD Aerosystems is a global leader in the development of advanced airborne defense, intelligence, and surveillance solutions for military, governmental, and commercial aviation. Our innovative technologies are deployed worldwide, supporting mission-critical operations and protecting aircraft through advanced multidisciplinary systems. As we continue to grow, we are looking for a talented Hardware Design Engineer (Board Design) to join our Hardware Development team and contribute to the design and development of advanced electronic boards for complex aerospace and defense systems. What You’ll Do · Design, develop, and modify electronic boards throughout the entire product lifecycle. · Perform board bring-up activities following development and initial manufacturing. · Troubleshoot hardware issues, analyze failures, and implement design improvements. · Edit schematics and support PCB layout activities. · Improve product manufacturability and maintain production documentation. · Support PCB manufacturers and electronic assembly subcontractors while ensuring compliance with IPC standards. · Investigate manufacturing failures and provide engineering solutions. · Work closely with multidisciplinary teams including Mechanical, Software, Firmware, and System Engineering. · Participate in design reviews (PDR/CDR). · Prepare engineering documentation, test procedures, and product verification documents. Support the transition from development to production.
Requirements:
· B.Sc. in Electrical Engineering / Electronics Engineering – Mandatory · Up to 5 years of professional experience in Hardware Design Engineering (excluding mandatory military service). · Proven experience in analog board design and high-power power supply design Mandatory · Hands-on experience performing board bring-up for digital boards and power supply boards – Mandatory · Experience with schematic editing and PCB layout support – Mandatory · Experience preparing and participating in design reviews (PDR/CDR) – Mandatory · Experience writing ATP and POD documentation – Mandatory · Experience supporting PCB manufacturing and electronic board assembly. · Strong proficiency with OrCAD and Allegro · Excellent Microsoft Office skills. · Fluent Hebrew and English. Nice to Have · Experience in the aerospace and defense industry. · Experience working with complex multidisciplinary systems. · Familiarity with IPC standards and production processes. Strong understanding of development in compliance with MIL-STD and DO-160 testing standards Why Join BIRD Aerosystems? · Work on advanced aerospace and defense technologies with global impact. · Take part in designing complex electronic systems deployed worldwide. · Collaborate with experienced engineers across multiple disciplines. · Join a professional, innovative, and growing organization. · Develop your expertise in a challenging and technology-driven environment. If you are passionate about hardware development, electronics, and advanced aerospace technologies, we would love to hear from you.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8743095
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
30/09/2026
Location: Caesarea
Job Type: Full Time
The Senior Silicon Photonics PIC Design Engineer will help build next-generation Photonic Integrated Circuits (PICs) that power high-performance optical interconnect solutions. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components, while contributing to optical test instrumentation for emerging semiconductor test markets.
As a member of the Silicon Photonics Engineering Staff, you will be a key player in the definition, implementation, and validation of complex automated test equipment that interfaces optical ports of silicon photonic devices at all stages of fabrication, from wafer probe to packaged test.
Lead the design, simulation, layout, and system-level testing of advanced silicon photonics components and Photonic Integrated Circuits.
Utilize simulation and design tools, including Ansys/Lumerical and Cadence Virtuoso, to design, validate, and optimize photonic designs.
Collaborate closely with design, layout, EIC, packaging, validation, quality, and system architecture teams to develop high-performance integrated photonic circuits and validate link performance.
Partner with fab and process engineers to define and optimize device design and implement process monitoring structures.
Develop test and qualification plans in coordination with validation and quality engineering teams.
Conduct rigorous testing and characterization of devices and PICs, including passive and active photonic components.
Engage in direct collaboration with silicon foundries to streamline processes and support successful tape-out execution.
Requirements:
We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If youre ready to join us in this mission, take a closer look at the minimum criteria for the position.
Masters degree in Physics, Electrical Engineering, Optics, or a related field with 10+ years of relevant experience
Strong proficiency in photonic design and simulation tools such as Ansys/Lumerical and Cadence Virtuoso.
Extensive experience in RF/Signal Integrity simulation and optimization for high-speed modulators, photodetectors, electrical subsystems such as PCB, TIA, and driver circuits, integrated optical components, and full transceiver systems.
Hands-on experience designing high-speed active optical devices, including Mach-Zehnder Modulators (MZM) and Micro-Ring Modulators (MRM).
Hands-on experience with passive optical components, including couplers, splitters, polarization splitter-rotators (PSR), wavelength-division multiplexing (WDM) components, edge couplers, grating couplers, directional couplers, and MMIs.
Working knowledge of the tape-out process with at least one Silicon Photonics foundry, including experience with its Process Design Kit (PDK).
Proficiency in programming for data analysis, modeling, and layout automation, including Python and scripting tools.
Hands-on experience with photonic testing equipment in a lab environment.
Strong analytical thinking, problem-solving ability, and cross-functional collaboration skills.
Strong verbal and written communication skills with a proven ability to work independently and collaboratively.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8837768
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
30/09/2026
Location: Caesarea
Job Type: Full Time
The Senior Silicon Photonics PIC Design Engineer will help build next-generation Photonic Integrated Circuits (PICs) that power high-performance optical interconnect solutions. In this role, you will lead the design, simulation, layout, and system-level testing of advanced silicon photonics components, while contributing to optical test instrumentation for emerging semiconductor test markets.
As a member of the Silicon Photonics Engineering Staff, you will be a key player in the definition, implementation, and validation of complex automated test equipment that interfaces optical ports of silicon photonic devices at all stages of fabrication, from wafer probe to packaged test.
Lead the design, simulation, layout, and system-level testing of advanced silicon photonics components and Photonic Integrated Circuits.
Utilize simulation and design tools, including Ansys/Lumerical and Cadence Virtuoso, to design, validate, and optimize photonic designs.
Collaborate closely with design, layout, EIC, packaging, validation, quality, and system architecture teams to develop high-performance integrated photonic circuits and validate link performance.
Partner with fab and process engineers to define and optimize device design and implement process monitoring structures.
Develop test and qualification plans in coordination with validation and quality engineering teams.
Conduct rigorous testing and characterization of devices and PICs, including passive and active photonic components.
Engage in direct collaboration with silicon foundries to streamline processes and support successful tape-out execution.
Requirements:
We seek individuals who share our passion and determination. Our commitment to customer success drives us to go the extra mile. If youre ready to join us in this mission, take a closer look at the minimum criteria for the position.
Masters degree in Physics, Electrical Engineering, Optics, or a related field with 10+ years of relevant experience
Strong proficiency in photonic design and simulation tools such as Ansys/Lumerical and Cadence Virtuoso.
Extensive experience in RF/Signal Integrity simulation and optimization for high-speed modulators, photodetectors, electrical subsystems such as PCB, TIA, and driver circuits, integrated optical components, and full transceiver systems.
Hands-on experience designing high-speed active optical devices, including Mach-Zehnder Modulators (MZM) and Micro-Ring Modulators (MRM).
Hands-on experience with passive optical components, including couplers, splitters, polarization splitter-rotators (PSR), wavelength-division multiplexing (WDM) components, edge couplers, grating couplers, directional couplers, and MMIs.
Working knowledge of the tape-out process with at least one Silicon Photonics foundry, including experience with its Process Design Kit (PDK).
Proficiency in programming for data analysis, modeling, and layout automation, including Python and scripting tools.
Hands-on experience with photonic testing equipment in a lab environment.
Strong analytical thinking, problem-solving ability, and cross-functional collaboration skills.
Strong verbal and written communication skills with a proven ability to work independently and collaboratively.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8837771
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