לוח משרות דרושים

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and OSATs. This is an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will have an understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will help design, deploy and maintain hardware required to screen high performance compute silicon at various stages of the manufacturing pipeline.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage ATE platform setup (including loadboard/probecard design) and change kit, SLT bench platform, and handler.
Identify and screen potential vendors (including technological and budgetary assessment) and track and verify progress at all stages of the design.
Define probecard and loadboard requirements based on testing strategy, accounting for test time, tester memory, and budget.
Review SI/PI simulations and final design signoff.
Validate probecard and loadboard hardware and open testing pipeline.

We are looking for an experienced System Engineer to lead the definition and integration of our next-generation wireless IoT systems. You will possess a unique "end-to-end" perspective: understanding the physics of the RF/Analog silicon, the intricacies of the BLE protocol, and the full integration between devices to network connectivity. You will work closely with Silicon, FW, and Cloud teams to ensure robust connectivity and optimized power consumption.

Responsibilities:
System Architecture: Define system-level requirements for Wireless IoT products, focusing on RF performance, power budgets, and data throughput. Faimilairy with in-door wireless including antenna design consideration is an advantage.
Silicon & RF Interface: Work with Silicon development teams to define RFIC specs and resolve integration challenges (Analog/RF mixed-signal flows).
Connectivity Pipeline: Define the HW to Firmware to Ethernet or wireless pipeline.
Integration & Debug: Hands-on bring-up of new silicon/hardware in the lab, debugging complex issues spanning from RF interference to network protocol failures.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.

We are looking for an experienced, forward-thinking, focused, analytical, and motivated Engineer to take ownership for the NPI and suppliers management in order to meet company targets. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which NV products acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. Youll be immersed in a diverse, supportive environment where everyone is encouraged to do their best work. Come join the team and see how you can make a lasting impact on the world.

What you'll be doing:

The NPI engineer will work alongside with R&D BU, finance, engineering and various multi-functional teams, leading NPI products from am operational perspective
Work with our partners worldwide to establish a supply chain incorporating business, manufacturing, technology, Engineering, quality, and additional aspects to assure design acceptance and manufacturability
Identify critical-paths, bottlenecks and implement risk management methodologies.
Define and lead execution to ensure delivery on schedule according to SOW and budget
Pave the way for NPI Production transition: Active participation from very early pre-design stages, highlighting needed operational related aspects while defining the infrastructure for the future transfer to production stage.
Develop an in-depth understanding of the vendors manufacturing capabilities and influence current and future product qualifications and loading decisions
Develop and implement project management methodologies and processes to improve tracking, transparency, execution, and day-to-day efficiency
Report program status to senior management.

We are seeking a CAD Engineer to join the Physical Design team.

You'll be joining our Physical Design team within us, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

You will be the tech lead for CAD within the team, leveraging your extensive backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

We demonstrate the latest silicon technologies and processes to build the largest-scale and most complex devices, pushing the boundaries of feasibility.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.

we're a global leader in smart energy technology, with over 3,000 employees, offices in 34 countries, and millions of installations worldwide. Our innovative solutions include solar inverters, battery Storage, backup systems, EV charging, and AI-based energy management. We're committed to making clean, green energy the primary power source for homes, businesses, and beyond. With the growing demand for electricity, the need for smart, clean energy sources is constantly rising. SolarEdge offers amazing opportunities to develop your skills in a multidisciplinary environment, covering everything from research and development to production and customer supply. Work with talented colleagues, tackle exciting challenges, and help create a sustainable future in an industry that's always evolving and innovating. Join us and be part of a company that values creativity, agility, and impactful work. What will you be doing:
* Taking part in the development of the companys flagship products
* Responsibility for the development from the design stage to the final product, including all tests necessary to deliver the product to mass production (electronic tests, thermal tests, EMI tests).
* Working with other teams inside the Hardware division and outside of it (such as the Mechanical department, Software and more)

Country:
Israel
City:
Modiin

Define, design and verify ASIC and ASIC subsystems to be deployed in a range of our platforms. Contribute to a multi-disciplined engineering team to meet the power, performance, and area goals for products.
Design, document, and develop ASIC subsystems for release in high volume and quality.
Help define the process, methods, and tools for design and implementation of complex developments.
What Youll Do:
Executes assignments delegated in ASIC team.
Owns portion of project code.
Creates own code.
Participates in code reviews.
Debugs owned code.
Contributes to the creation of new designs.
Maintains and enhances existing designs.
Executes test plans and test benches.
Modifies and enhances test to meet specific test cases.
Executes and tests analog/mixed signal products.
Creates floor planning and timing closure of multiple ASIC blocks.
Debugs timing issues with RTL block owners.
Leads products to manufacturing, identifies and helps to implement power and signaling solutions.
Supports with the planning of signal integrity.

We are looking for an experienced STA Lead Engineer to join our growing BE team. We are working on the most challenging and interesting ASIC chips. Come join us and have a big impact on our groundbreaking and innovative designs.
Responsibilities:
Take part in STA activities for blocks, Sub Systems and Full chip, from definitions to TO.
Analyze timing results, verify correctness and provide timing budget for the different partitions.
Own the timing constraints both for STA and P&R flow.
Working closely with architecture, design, PD and DFT teams to make sure timing closure and ensures product success.
Identify risks and bottlenecks, work closely with PD, RTL and DFT teams, ensuring convergence throughout various project stages.
Participating in design methodology, reviews and tool automation work and definition.
As part of this rule you will gain very good understanding of our HPC and AI designs and sub system as well as product targets.

We are looking for an excellent Firmware Design Engineer for our FW PHY Group. The person will closely work with our FW development, architecture, chip design teams and gain deep understanding of our Networking products and technologies. We have some of the most forward-thinking and hardworking people in the world working for us. Are you a creative and autonomous engineer who loves a challenge? Are you ready to become the engineer you always wanted to be? Come and be part of the best chip design team in the industry!

What youll be doing:

Work on the next development Fusion GPU project.

Design and develop PHY-layer firmware for cutting-edge networking devices.

Enabling new SerDes and physical linkup flows

Work closely with the architecture, HW, and SW design teams

Define implement and maintain FW algorithm to control the Silicon

Develop and test FW on emulation & simulation environments during the Pre-silicon phase

Debug and screen HW/FW/SW issues

Take an active part in silicon bring-up and SW development phases

Lead data-driven discussions about the product functionality and areas for improvement

As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) and RF semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC and RF die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving team behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

We are looking for highly motivated engineers who love the challenges and the opportunity of a small company. Join us and be a part of a small and dynamic team, which revolutionizes the parallel processor architecture.

Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Silicon Validation Engineer at our company Cloud, you will play a pivotal role in the validation of our company's custom silicon solutions that power our cloud infrastructure bringing it to the highest quality level. With your expertise in post-silicon validation, you will be identifying and resolving issues before they impact our customers, ensuring a seamless and high performance cloud experience.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define, develop and execute post-silicon validation content on both pre-silicon setups and real silicon platforms in the lab.
Drive silicon from being a chip towards becoming a product.
Debug and investigate issues along cross-functional teams such as Firmware, Software, Design, Design Verification, Architecture and multiple production teams.
Provide quality functional coverage for our company designs.
Test development and automation, design, implement, and maintain validation tests using scripting and programming languages (e.g., Python, C/C++) to verify SmartNIC functionality and performance.