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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our portfolio spans CPU, TPU, Networking and other key data center technologies, which power our company's most demanding Compute and AI/ML applications.
In this role, youll work to shape the future of strategic Data Center silicon. Youll be an early and key contributor in a nascent high-growth team that pushes boundaries, developing advanced custom IP and solutions. You will require expertise in one or more of the following areas: wireline communications, analog circuit design, Digital Signal Processor (DSP) design and algorithms, signal integrity, transmission line theory, advanced analog and mixed-signal modeling, high-speed clocking, Clock and Data Recovery (CDR), equalization, high-speed input/output (IO) industry standards. Your role has a significant component of cross-collaboration with a broad set of cross-functional organizations. You'll bring out the best in the team to deliver designs that serve many of our companys advanced data center products.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Architect and design high-speed analog/digital circuits (ADC, DAC, PLL, CDR, DSP), including optimizing for Power, Performance, and Area (PPA).
Model and simulate channel behavior (S-parameters), signal integrity, and jitter using tools like MATLAB.
Bring up new silicon, characterize performance, and test for electrical compliance in lab environments.
Work with packaging, board design, and firmware teams to ensure seamless integration into System-on-Chips (SoCs).
Adhere to standards like IEEE or OIF for high-speed protocols and optimize power consumption.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience in analog mixed signal or high-speed IO development.
Experience defining and taking to High Volume Manufacturing (HVM) leading edge mixed-signal or high-speed IO designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on wireline silicon architecture and design.
Experience with technical innovation in mixed-signal and high-speed IO solutions.
Experience working on high-performance, data center class IP, from concept through high-volume deployment.
This position is open to all candidates.
 
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8544213
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will help to manufacture the SoCs that power these data centers by developing and deploying comprehensive manufacturing test and data analytics solutions for high volume manufacturing at wafer fabs and OSATs. This is an opportunity to create silicon in the most advanced technologies and follow it into the field to close the loop back to design and test for the next generation of chips. You will help to integrate SoC technologies into devices and drive manufacturing test flows to assure performance and screen devices. You will drive yield improvement, cost optimization and work closely with cross functional teams to ensure the optimal test coverage in production to ensure high quality SoCs. You will have an understanding of IC flows, wafer processing, testing, qualification, diagnostics, and failure analysis. You will help design, deploy and maintain hardware required to screen high performance compute silicon at various stages of the manufacturing pipeline.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage ATE platform setup (including loadboard/probecard design) and change kit, SLT bench platform, and handler.
Identify and screen potential vendors (including technological and budgetary assessment) and track and verify progress at all stages of the design.
Define probecard and loadboard requirements based on testing strategy, accounting for test time, tester memory, and budget.
Review SI/PI simulations and final design signoff.
Validate probecard and loadboard hardware and open testing pipeline.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience in multi-disciplinary semiconductor hardware engineering and systems.
Experience in loadboard or probecard design, including SI/PI simulations, layout reviews, and schematic reviews.
Experience in Automated Test Equipment (ATE) test methodologies and their impact on hardware requirements/design.
Preferred qualifications:
Experience with semiconductor handlers, including Chroma or Hontech.
Experience in BurnIn hardware.
Experience managing the complete test hardware life-cycle, from initial design and NPI enablement through to final production deployment.
Experience in multi-disciplinary thermo-electro-mechanical systems.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8544533
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08/02/2026
Job Type: Full Time
This role combines hands-on technical leadership with team ownership, guiding complex electronic board development from early concept through production, while working closely with multidisciplinary engineering teams.
We are looking for an experienced hardware engineer who is strongly connected to the work itself, values teamwork, takes ownership of outcomes, and is driven by delivering reliable systems for real operational use.
Job Description:
Team Leadership: Lead and mentor a team of hardware engineers, supporting professional growth and promoting a collaborative, hands-on working environment.
Technical Responsibility: Serve as the focal point for hardware design, from system architecture and key design decisions through bring-up, validation, and production.
Project Execution: Plan and manage hardware development cycles, including task prioritization, resource coordination, and meeting project milestones.
Multidisciplinary Collaboration: Work closely with System, Software, Mechanical, and Integration teams to achieve robust, well-integrated system solutions.
Design & Quality: Lead design reviews and ensure compliance with reliability, EMC/EMI, and defense-related standards.
Suppliers & Manufacturing: Interface with PCB manufacturers, component suppliers, and subcontractors, supporting NPI and production readiness.
Hands-on Engineering: Take an active role in hardware bring-up, deep debugging, root-cause analysis, and system-level troubleshooting, both in the lab and in the field.
Requirements:
B.Sc. or higher degree in Electrical Engineering from a recognized institution.
10+ years of hands-on experience in board-level hardware design, analog and digital.
4-5 years of experience in a technical leadership or team lead role.
Proven experience across the full product lifecycle: schematics, layout guidance, bring-up, and validation.
Strong understanding of Signal Integrity, Analog, Digital, Power Integrity, and EMC/EMI in high-speed systems.
Experience working in multidisciplinary engineering environments.
Clear, effective communication skills in both English and Hebrew.
Advantages:
Experience in the defense industry and working with MIL-STD requirements.
Hands-on experience with STM32 microcontrollers and NVIDIA Jetson or similar SOM platforms.
Background in transitioning products from R&D to mass production.
Willingness to travel internationally for field trials or operational support.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8535459
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דיווח על תוכן לא הולם או מפלה
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an experienced System Engineer to lead the definition and integration of our next-generation wireless IoT systems. You will possess a unique "end-to-end" perspective: understanding the physics of the RF/Analog silicon, the intricacies of the BLE protocol, and the full integration between devices to network connectivity. You will work closely with Silicon, FW, and Cloud teams to ensure robust connectivity and optimized power consumption.

Responsibilities:
System Architecture: Define system-level requirements for Wireless IoT products, focusing on RF performance, power budgets, and data throughput. Faimilairy with in-door wireless including antenna design consideration is an advantage.
Silicon & RF Interface: Work with Silicon development teams to define RFIC specs and resolve integration challenges (Analog/RF mixed-signal flows).
Connectivity Pipeline: Define the HW to Firmware to Ethernet or wireless pipeline.
Integration & Debug: Hands-on bring-up of new silicon/hardware in the lab, debugging complex issues spanning from RF interference to network protocol failures.
Requirements:
Education: B.Sc. in Electrical Engineering (M.Sc. is an advantage).
Experience: 5+ years in System Engineering, with a focus on Wireless/IoT products.
RF/HW/Silicon Expertise: Experience working with Silicon development teams; solid understanding of RF chains, Analog constraints, and Board design.
Analytical Skills: Proficiency with modeling tools (Matlab/Python) and lab equipment (Spectrum Analyzers, Sniffers).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8555823
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דיווח על תוכן לא הולם או מפלה
מה השם שלך?
תיאור
שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Power and Signal Integrity Engineer, you will be responsible for the design and characterization of signal and power integrity of our IC designs. You will design the external electrical interfaces of the device, from their Signal/Power-integrity and electrical usage perspectives and set up methodologies, perform simulations, silicon characterization and correlations to ensure our IC designs meet systems design budgets and achieve the highest performance. You will work with systems architects, ASIC design, systems engineers, and partner cross-functionally with teams and external vendors/partners.The ML, Systems, and Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Our end users, Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Generate precise electrical models (e.g., S-parameters, SPICE models) for components such as packages, PCBs, and connectors for use in simulations.
Simulate high speed interface electrical behavior using HSPICE or other circuit simulators.
Execute lab measurements utilizing test equipment like oscilloscopes, Vector Network Analyzers (VNA), Time Domain Reflectometers (TDR) , Spectrum analyzers to validate simulation outcomes and debug signal and power-related issues on silicon prototypes and boards.
Establish design rules and guidelines for optimal signal/power integrity during PCB and package layout, ensuring high production yield and reliability.
Document design specifications, analysis results, and validation reports to ensure compliance with standards and for future reference, while collaborating extensively with cross-functional teams, including ASIC architects, digital/analog designers, physical design/layout engineers, and system engineers.
Requirements:
Minimum qualifications:
Bachelor's degree in Mechanical, Electrical Engineering, Material Science, or equivalent practical experience.
2 years of experience in the signal and power integrity field.
Preferred qualifications:
5 years of experience with signal and power integrity modeling and simulation for high-speed interfaces (e.g., LPDDR, MIPI, UFS, PCIe, USB).
Experience with industry-standard Electronic Design Automation (EDA) tools for simulation and layout (e.g., Cadence Sigrity/Allegro, Ansys HFSS/PowerDC/Q3D, Keysight ADS, Synopsys HSPICE).
Experience in scripting languages such as Python, Perl, or Tcl for flow automation and data analysis.
Familiarity with high-speed testing equipment like VNAs, TDRs, and oscilloscopes for measurement and validation.
Knowledge of circuit analysis, electromagnetics, and transmission line theory.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8544538
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
As a Design Team Manager within the Server Chip Design team, you will oversee the IP and SoC VLSI design cycle from architecture to production. In this role, you will own and manage IP, subsystems and SoC development, leading a group of designers and design tech leads.
You will be responsible for mentoring and developing team members and tech leads while driving improvements in leadership, technical execution, and design flows.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Manage a team of tech leads and designers. Develop and mentor team members, and communicate and co-work with multi-disciplined and multi-site teams.
Lead design activities at IPs, subsystems, and SoC.
Plan, execute, track progress, assure quality, and report status of the assigned activity.
Work closely with internal customers and support multiple activities and deliverables.
Assure and manage deliverables quality at all RTL design categories including reviews, static checks, design for physical design, power, etc.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
10 years of experience in RTL design cycle from IP to SoC, from specification to production.
8 years of experience in execution teams management.
Experience in the following areas: RTL design, design quality checks, physical design aspects of RTL coding, and power.
Preferred qualifications:
Experience with synthesis techniques to optimize Register-Transfer Level (RTL) code, performance and power as well as low-power design techniques.
Experience with a scripting language like Python or Perl.
Experience with design for test and its impact on design and physical design.
Knowledge of SOC architecture and assertion-based formal verification.
Knowledge of high performance and low power design techniques.
Knowledge of one of these areas: PCIe, UCIe, DDR, AXI, CHI, Fabrics, ARM processors family.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544202
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
11/02/2026
Location: Yokne`am
Job Type: Full Time
We are looking for an experienced, forward-thinking, focused, analytical, and motivated Engineer to take ownership for the NPI and suppliers management in order to meet company targets. Today, were tapping into the unlimited potential of AI to define the next era of computing. An era in which NV products acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing whats never been done before takes vision, innovation, and the worlds best talent. Youll be immersed in a diverse, supportive environment where everyone is encouraged to do their best work. Come join the team and see how you can make a lasting impact on the world.

What you'll be doing:

The NPI engineer will work alongside with R&D BU, finance, engineering and various multi-functional teams, leading NPI products from am operational perspective
Work with our partners worldwide to establish a supply chain incorporating business, manufacturing, technology, Engineering, quality, and additional aspects to assure design acceptance and manufacturability
Identify critical-paths, bottlenecks and implement risk management methodologies.
Define and lead execution to ensure delivery on schedule according to SOW and budget
Pave the way for NPI Production transition: Active participation from very early pre-design stages, highlighting needed operational related aspects while defining the infrastructure for the future transfer to production stage.
Develop an in-depth understanding of the vendors manufacturing capabilities and influence current and future product qualifications and loading decisions
Develop and implement project management methodologies and processes to improve tracking, transparency, execution, and day-to-day efficiency
Report program status to senior management.
Requirements:
What we need to see:
B.Sc. in Industrial/Electrical/Material engineering or a related field.
Strong engineering background with business and operations proficiency.
8+ years of proven experience in leading sophisticated, highly technology-intensive projects.
Sharp thinking, attention to details, and outstanding decision-making skills
Independent and proactive approach - being able to own a task but also to deep dive into the relevant details surrounding it.
Performs well in an intensive environment - Working hour flexibility (working with global parties).
Ability to manage schedule and meet deadlines.
Multitasking, good interpersonal skills and a team player.
Fluent English - reading, writing, and speaking.
Proficiency in Microsoft Office tools including Word and Excel.

Ways to stand out from the crowd:
Experience with supply chain management.
Vast Semiconductor experience and global market.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8542256
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סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
19/02/2026
Location: Herzliya
Job Type: Full Time
Power the Future with us! Atour company, we're a global leader in smart energy technology, with over 3,000 employees, offices in 34 countries, and millions of installations worldwide. Our innovative solutions include solar inverters, battery Storage, backup systems, EV charging, and AI-based energy management. We're committed to making clean, green energy the primary power source for homes, businesses, and beyond. With the growing demand for electricity, the need for smart, clean energy sources is constantly rising. we offer amazing opportunities to develop your skills in a multidisciplinary environment, covering everything from research and development to production and customer supply. Work with talented colleagues, tackle exciting challenges, and help create a sustainable future in an industry that's always evolving and innovating. Join us and be part of a company that values creativity, agility, and impactful work. Are you passionate about designing high-performance power systems that move from concept to mass production? Join us and take a leading role in shaping our next-generation flagship products! What Youll Do:
* Lead the end-to-end development of advanced power electronics hardware - from architecture and schematic design through validation and mass production.
* Own complex board-level designs, driving performance, reliability, and cost optimization.
* Design, simulate, build, TEST, debug, and bring to life robust power solutions under real-world constraints.
* Collaborate in a multidisciplinary R&D environment alongside Mechanical, Software, system, and Certification teams.
* Influence product architecture and technical direction with hands-on engineering excellence.
* Ensure on-time delivery of high-quality, production-ready designs. Why Join Us?
* Work on impactful, market-leading products.
* Be part of a highly collaborative, multidisciplinary engineering culture.
* Take real ownership and influence technical decisions.
* See your designs transition from concept to millions of units in the field.
Country:
Israel
City:
Herzliya
Requirements:
* B.Sc. in Electrical Engineering.
* 4+ years of hands-on experience in circuit and board design (power electronics preferred).
* Strong lab experience - Oscilloscope, Spectrum Analyzer, Electronic Loads, and other validation equipment.
* Experience with simulation tools such as LTspice, PSpice, MATLAB, or equivalent.
* Deep knowledge of analog design, LCR components, filters, and op-amps.
* Solid understanding of DC-DC converter topologies (Buck, Boost, Flyback, etc.).
* Experience with OrCAD (Allegro, Capture) or similar PCB design tools.
* Magnetic design and simulation experience - an advantage
* Background in control theory and experience working with microcontrollers - an advantage
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8553654
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דיווח על תוכן לא הולם או מפלה
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שליחה
סגור
v נשלח
תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Foundry, IP and Package Technologist, you will directly collaborate with architecture teams, external manufacturing partners (foundries and packaging vendors) to coordinate the technical stabilization and yield ramp of our custom silicon. You will be responsible for in-depth yield analysis, debugging process-design interactions, and driving corrective actions to resolve manufacturing defects. Your expertise in root-cause analysis and process optimization will ensures that our groundbreaking chips ramp up seamlessly from initial silicon arrival to high-volume production, directly enabling the future of our computing capacity.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Drive yield modeling for NPIs, support pre silicon activities in Foundry aspects of new devices.
Lead process debug investigations, utilizing inline data to isolate the root cause of yield limiters, distinguishing between random defects and systematic marginalities.
Drive yield improvements by executing advanced statistical analysis on high-volume manufacturing data, identifying subtle process-design interactions that impact performance, and defining the necessary corrective actions.
Collaborate with cross-functional design, product, and test teams to triage silicon failures, distinguishing between design bugs, foundry process marginalities, and packaging interaction issues to support New Product Introduction (NPI).
Partner with architecture and design teams to feed back critical manufacturing constraints into future product definitions, ensuring that next-generation chiplets are architected to be resilient to known process variances.
Requirements:
Minimum qualifications:
Bachelors degree in Electrical Engineering, Material Science, Physics, Microelectronics, a related technical field, or equivalent practical experience.
8 years of experience in semiconductor foundry technologies, advanced process nodes and product engineering or yield analysis.
Experience in leading post-silicon yield improvement, including root cause analysis, defect correlation, and process debugging.
Experience with characterization of silicon interaction with package thermal and mechanical stress.
Preferred qualifications:
15 years of experience in test engineering, product engineering, foundry technology, advanced packaging development, or product yield engineering.
Experience in debugging IP integration issues (e.g., HBM, SerDes, PCIe) and advanced packaging failures (2.5D/3D, flip-chip).
Ability to drive technical feedback loops between foundry partners, internal architecture and design teams, and Post-Silicon (Post-Si) teams to resolve manufacturing limiters.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8544578
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Location: Giv'atayim
Job Type: Full Time
We are looking for an experienced STA Lead Engineer to join our growing BE team. We are working on the most challenging and interesting ASIC chips. Come join us and have a big impact on our groundbreaking and innovative designs.
Responsibilities:
Take part in STA activities for blocks, Sub Systems and Full chip, from definitions to TO.
Analyze timing results, verify correctness and provide timing budget for the different partitions.
Own the timing constraints both for STA and P&R flow.
Working closely with architecture, design, PD and DFT teams to make sure timing closure and ensures product success.
Identify risks and bottlenecks, work closely with PD, RTL and DFT teams, ensuring convergence throughout various project stages.
Participating in design methodology, reviews and tool automation work and definition.
As part of this rule you will gain very good understanding of our HPC and AI designs and sub system as well as product targets.
Requirements:
BSc/MSc in Electrical Engineering/Computer Science.
8+ years of experience in VLSI backend (RTL2GDS).
5+ years experience in STA (Prime-Time/Signoff).
Experience Full chip STA on complex SoCs experience.
Expert knowledge and hands-on experience in timing closure & signoff methodologies.
Good knowledge of DFT architecture and DFT timing related issues
Good knowledge of Async timing concepts & verification.
Good knowledge of the full backend flows from RTL to TO. (Synthesis, FP, PnR , CTS , STA, EM/IR, Chip Integration, high-frequency designs).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8543798
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08/02/2026
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for an excellent Firmware Design Engineer for our FW PHY Group. The person will closely work with our FW development, architecture, chip design teams and gain deep understanding of our Networking products and technologies. We have some of the most forward-thinking and hardworking people in the world working for us. Are you a creative and autonomous engineer who loves a challenge? Are you ready to become the engineer you always wanted to be? Come and be part of the best chip design team in the industry!

What youll be doing:

Work on the next development Fusion GPU project.

Design and develop PHY-layer firmware for cutting-edge networking devices.

Enabling new SerDes and physical linkup flows

Work closely with the architecture, HW, and SW design teams

Define implement and maintain FW algorithm to control the Silicon

Develop and test FW on emulation & simulation environments during the Pre-silicon phase

Debug and screen HW/FW/SW issues

Take an active part in silicon bring-up and SW development phases

Lead data-driven discussions about the product functionality and areas for improvement
Requirements:
What we need to see:

B.Sc. or M.Sc. in Electrical or Computer Engineering.

3+ years of relevant experience.

Proficient programming in C.

Debugging experience and ability to investigate and triage difficult problems in embedded FW.

Good communication skills and the ability to work with people across several countries.

Ability to work with interrupts and dynamic environment with good spirit.

Excellent English verbal and written communication skills.

Ways to stand out from the crowd:

Proficient in Python and MatLab.

Good understanding of SerDes operation.

Experience with developing the physical layer of communication protocols.

Knowledgeable of Hardware/Software Development Process.

Strong collaborative and interpersonal skills, with an ability to successfully guide and influence.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8535788
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Location: Haifa
Job Type: Full Time
As a Quality and Reliability (Q&R) Engineer, you will lead the qualification and long-term reliability of advanced System-on-Chip (SoC) and RF semiconductor products for automotive applications. Youll work across digital and RF domains to ensure robust performance and compliance with industry standards.
What will your job look like:
Define and manage Quality and Reliability specifications, simulations, and qualification plans for SoC and RF die and package.
Plan and execute automotive-grade qualifications per standards such as AEC-Q100, JEDEC JESD22, and IATF 16949.
Design and implement die-level and package-level stress tests.
Select and prepare electrical, environmental, and mechanical test platforms for reliability testing.
Define requirements for Pre-Si Q&R (e.g. ESD, LU, EM, IR drop), Design-for-Test (DFT), electrical characterization, and Post-Si Q&R testing of digital, mixed-signal and RF SoCs.
Collaborate extensively with internal design teams, external subcontractors, and outsourcing partners (OSATs).
Lead failure analysis, reliability modeling, and corrective action processes (e.g., 8D, FMEA, FMEDA).
Document and certify automotive standards compliance, including PPAP/APQP deliverables.
Requirements:
BSc/MSc in Electrical Engineering, Physics, Materials Engineering or related field.
5+ years of experience in semiconductor Q&R, preferably with SoCs, ASICs, VLSI, or RF ICs.
Strong knowledge of semiconductor physics, packaging technologies, materials and reliability mechanisms.
Knowledge and experience with RF reliability concerns.
Experience with advanced packaging Q&R (e.g., FCCSP, FCBGA).
Hands-on experience with Q&R test design and environmental stress testing.
Deep understanding of failure prediction models, reliability simulations, and statistical analysis.
High proficiency in English, including strong verbal, reading, and writing skills.
Expertise in automotive Q&R standards, including AEC-Q100, IATF 16949, and JEDEC/ISO/IEEE protocols -advantage.
Exposure to radar or ADAS/AV automotive systems Q&R - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8515818
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving team behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHSIC Hardware Description Language (VHDL)), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
8 years of experience architecting networking ASICs from specification to production or equivalent experience.
Experience developing RTL for ASIC subsystems.
Experience in micro-architecture, design, verification, logic synthesis, and timing closure.
Preferred qualifications:
Experience working with design networking: Remote Direct Memory Access (RDMA) or packet processing and system design principles for low latency, high throughput, security, and reliability.
Experience architecting networking switches, end points, and hardware offloads.
Experience working with software teams optimizing the hardware/software interface.
Experience in a procedural programming language (e.g., C++, Python, Go).
Knowledge of TCP, IP, Ethernet, PCIE and DRAM.
Familiarity with Network on Chip (NoC) principles and protocols (AXI, ACE, and CHI).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8544535
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04/02/2026
Location: Merkaz
Job Type: Full Time
Are you looking for a great opportunity to further your career? our company (formerly Mentor Graphics) is investing in the rapid growth area of Hardware Assisted Verification (HAV).
Our most successful multi-national customers are using our company HAV platforms to verify some of the worlds most advanced System on Chip (SoC) designs. HAV solutions are expanding to a wider audience of smaller companies who are benefiting from early software development and ultra-fast hardware verification through hosted services.
our company is looking to hire a Senior Consultant with either Emulation or FPGA prototyping knowledge and experience. This role is ideally suited to someone with a good understanding of HAV platforms who can guide customers through successful HAV deployment and design validation. This is a great opportunity to work with some of the most interesting and innovative people and companies across the semiconductor industry.
The consultant role will be mainly focused on technical services delivery. This could range from platform enablement to methodology guidance. Interactions may be direct with the customer or collaborative through a wider technical team. This position will require a combination of remote, office and onsite working. As a consultant, you will also be expected to uncover opportunities, scope engagements, promote offerings, and grow new business.
Key Responsibilities
A good understanding of HAV platforms and infrastructure (e.g. Strato, Primo or proFPGA enterprise-level systems would be preferable)
A good understanding of HAV compilation and runtime flows (e.g. Veloce or VPS would be preferable)
Practical insights into the application and usage of HAV
Knowledge of design mapping, testbench mapping and pre-silicon validation
Familiarity with HAV debug solutions (probes, waveforms, assertions, coverage, etc.)
Knowledge of virtual TestBench eXpress (TBX) and/or In-Circuit Emulation (ICE) use-cases
Proficient in HDLs (Verilog/SV) for RTL design and HVLs (SV/UVM) for verification
Strong background in functional verification, RTL synthesis, design partitioning and place-and-route
Conversant with SoC design and architecture concepts.
Requirements:
BSc/MSc qualified in Electronic Engineering, Computer Engineering or Computer Science
Team player and individual contributor
Lateral thinker and problem solver with a pragmatic approach
Excellent communication and presentation skills
Outgoing and enthusiastic personality
Happy to learn new technologies and methodologies when needed
English language mandatory, other European languages beneficial
Ability and willingness to travel including rights to work onsite within EMEA.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8532235
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a Silicon Validation Engineer at our company Cloud, you will play a pivotal role in the validation of our company's custom silicon solutions that power our cloud infrastructure bringing it to the highest quality level. With your expertise in post-silicon validation, you will be identifying and resolving issues before they impact our customers, ensuring a seamless and high performance cloud experience.
The ML, Systems, & Cloud AI (MSCA) organization at our company designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all our company services (Search, YouTube, etc.) and our company Cloud. Cloud customers and the billions of people who use our company services around the world.
We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including our company Clouds Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers.
Responsibilities
Define, develop and execute post-silicon validation content on both pre-silicon setups and real silicon platforms in the lab.
Drive silicon from being a chip towards becoming a product.
Debug and investigate issues along cross-functional teams such as Firmware, Software, Design, Design Verification, Architecture and multiple production teams.
Provide quality functional coverage for our company designs.
Test development and automation, design, implement, and maintain validation tests using scripting and programming languages (e.g., Python, C/C++) to verify SmartNIC functionality and performance.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
3 years of experience with functional tests for silicon validation (i.e., writing in C or C++).
Experience in silicon bring-up, functional validation, characterizing, and qualifying silicon.
Experience in packet processing, data path, packet buffering, scheduler, networking protocols offload engine.

Preferred qualifications:
Experience with hardware prototyping, including hardware/software integration (i.e., pre-silicon use of emulation, software-based test, and diagnostics development).
Experience in Peripheral Component Interconnect Express (PCIe) interface, PCIe internal switch, PCIe components Root Port (RP)/Endpoint (EP) link establishment.
Knowledge of SoC architecture, including boot flows and embedded processors/firmware.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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8543943
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