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דרושים בOR-YA HR Services
סוג משרה: מספר סוגים
ניהול צוות של מהנדסי תהליך וציוד.
אחריות על כל תהליכי הייצור השונים במפעל ובאתרי ייצור אצל קבלני משנה והתאמתם לתקנים הרלוונטיים.
אפיון ושיפור תהליכי ייצור והתאמתם לסביבה המשתנה.
ייזום והובלת פרויקטים לשיפור איכות ונצילות תהליכי ייצור ידניים ואוטומטים.
אפיון, בחינה והטמעת תהליכי ייצור חדשים בקווי ייצור.
ליווי מחלקת R D בפיתוח מוצרים חדשים, DFM, התאמה של חו"ג, תהליכי ייצור, תהליכי בדיקות סביבה למוצרים חדשים וכמובן, ליווי ייצור של אבי טיפוס.
אחריות על העברת מוצרים מפיתוח לייצור בכל הקשור לכתיבה נהלי עבודה חדשים ו/ או התאמת נהלי עבודה הקיימים, תקינות שרטוטי הרכבה וכרטיסי ניתוב, התאמת אמצעי ייצור יעודיים ועוד'.
שותפות פעילה בחקר כשלים וקביעת פעילות מונעת בתקלות שונות כגון: תקלות לקוח, תקלות ספקים, תקלות ייצור וכו'.

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תואר ראשון בהנדסת חומרים, הנדסת אלקטרוניקה או הנדסת כימיה מאוניברסיטה מוכרת, תואר שני יתרון.
5 שנות ניסיון בניהול והובלת צוותי הנדסת תהליך בחברות ייצרנית בתחומים כגון: הרכבות אלקטרוניות PCBA, הרכבות Chip Wire, ייצור Hybrids וכו'.
בעל ידע מעמיק וסמכות מקצועית בתהליכי ייצור שונים כגון: הלחמות, הדבקות, ציפויים מסוגים שונים, הרכבות SMT, ריתוך לייזר, צבע וכו'
הכרות עם התקנים AS9100, MIL STD 883 - יתרון משמעותי.
ידע מעמיק וניסיון בתהליכי ייצור ובדיקות מעגלים PCB, תהליכי השמות רכיבים PCBA והכירות עם התקנים הרלוונטיים בתחום כגון IPC 600/ 610/ 612 יתרון משמעותי מאוד.
יכולת העמקה ולמידה תאורטית של תהליכים שונים, חיזוי נקודות תורפה בהתאם לתנאי העבודה והסביבה של המוצר ויכולת התאמת בדיקות וניסויים להוכחת אמינות תהליכי הייצור השונים.
יכולת עבודה על מספר משימות במקביל,
יכולת הנעת עובדים ועמיתים, אסרטיביות,
יכולת לייצג את החברה בצורה מיטבית מול לקוחות וספקים.

במסגרת התפקיד יידרש סיווג בטחוני. המשרה מיועדת לנשים ולגברים כאחד.
 
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הגשת מועמדות
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8423055
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לפני 7 שעות
דרושים בRisco Group
Job Type: Full Time
HW team lead
Description
Technological leadership of hardware development within the company
Responsibility for documenting development processes and technological requirements
Managing and driving distributed development teams
Leading technological processes while performing hands-on development work
Role definition
Planning work schedules and ensuring timelines are met
Collaborating with product managers on product definition and specifications
Professional development of the team
Electrical circuit design
Researching and evaluating potential technologies for product integration
Building infrastructure for preserving technological knowledge and managing professional documentation.
Requirements:
B.Sc. in Electrical and Electronics Engineering
Over 10 years of experience in the development and design of analog and digital circuits
In-depth knowledge of hardware-software integrated product development
Background in physics and electro-optics an advantage
Strong team player with the ability to work across various organizational interfaces
Proven leadership in managing distributed teams in Israel and Bulgaria
High-level English proficiency.
This position is open to all candidates.
 
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הגשת מועמדות
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8425953
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Job Type: Full Time and Hybrid work
Plan and perform validation testing to analog and digital boards
Design and execute complex integration tasks in Motion Control Application products
Debug and correct design flaws and problems
Understand CE, UL and Functional Safety standards and perform these tests for Motion Control Applications
Write integration and TEST reports, design and certification documents
Primary Duties and Responsibilities
Perform Safety, CE, UL tests while understanding the standards and their impact on design
Analyze, debug and modify existing products to address EOL and reliability issues
Perform Bring-Up tasks, validate design, support transition to manufacturing
Define and write Testing and Validation documents/reports
Requirements:
Practical Engineer
2+ years of Experience as a R D Validation engineer
Good knowledge of relevant CAD tools (ORCAD, Allegro)
Experience and knowledge of safety standards and certification processes including hands on experience - advantage
Experience with motion and control systems - advantage
Personal skills: Excellent interpersonal skills, Ability to work independently or in a team of engineers
Creative in solving complex problems
This position is open to all candidates.
 
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8473523
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לפני 4 שעות
דרושים בReady
Job Type: Full Time and Hybrid work
We are seeking Verification engineers to join our team. The role focuses on chip verification using SystemVerilog and UVM methodologies.
Candidates with experience verifying high-speed SERDES interfaces such as PCIe, Aurora, and Ethernet are preferred.
Requirements:
- 2+ years of experience in chip verification using SystemVerilog and UVM
- Preferably experience in verification of high-speed SERDES (PCIe, Aurora, Ethernet)
This position is open to all candidates.
 
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הגשת מועמדות
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8441751
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דרושים בוייזדום
Job Type: Full Time
A global technology company is looking for a Senior Firmware Engineer to develop Embedded firmware and microcontroller subsystems for advanced SOC and system -level products. This position is central to enabling reliable, high-performance operation across the companys hardware platforms.
Key Responsibilities
Design and implement Embedded firmware for on-chip microcontrollers and system controllers.
Define and validate HWSW interfaces together with silicon and logic design teams.
Develop C -based SDKs and supporting tools, including Python automation for testing and validation.
Collaborate with cross-functional and customer-facing teams to ensure smooth integration and product quality.
Requirements:
B.Sc. in Electrical Engineering / Computer Science ; M.Sc. an advantage.
5+ years of hands-on experience in Embedded or SOC -related development.
Strong proficiency in C ( Embedded /firmware) and Python (automation).
Experience with build and version-control environments (gcc, Make, Git).
Solid understanding of Embedded systems, microcontrollers, and HWSW integration.
Ability to manage multiple tasks, work independently, and engage professionally with partners and customers.
This position is open to all candidates.
 
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8454561
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משרה בלעדית
לפני 5 שעות
דרושים בTop-IT Solutions Ltd
Location: Nazareth Iliit
Job Type: Full Time
We are seeking an experienced Electronics Practical Engineer to join its manufacturing plant
in the north of Israel, providing Technical Support on production lines.
The role includes troubleshooting and repair, supporting production teams with technical
issues, working with advanced testing equipment, and maintaining production systems and
infrastructure.
Responsibilities:
Provide ongoing Technical Support to production lines and resolve technical issues
Troubleshoot electrical circuit faults, testing equipment, and production systems
Operate lab equipment such as oscilloscopes, power supplies and spectrum analysers
Read and interpret electrical schematics to identify malfunctions
Document and report faults and maintenance activities
Requirements:
Electronic Practical engineer 2-3 years of experience mandatory
Technical background working in production line area.
Knowledge and experience in reading electronic schematics - a must.
Previous experience working in a computerized environment mandatory.
Ability to diagnose and troubleshooting and technical response to production problems.
Familiarity with laboratory equipment - scopes, spectrum, power supplies, etc.
Experience in editing digital and analog circuits - an advantage.
Knowledge with ATE environment
Knowledge working with OrCAD design - an advantage.
Experience in TestStand and National Instruments environment - a significant advantage.
Experience knowledge in mechanical maintenance level - an advantage.
Highly motivated to learn new things and new technologies.
Diligent and responsible and highly self-motivated.
This position is open to all candidates.
 
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הגשת מועמדות
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8147917
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לפני 8 שעות
דרושים בJobs.ai
Job Type: Full Time
Company Overview

ZutaCore is a global organization revolutionizing cooling solutions for the data center. We are a dynamic and rapidly expanding company that specializes in developing innovative direct-on-chip waterless liquid cooling solutions for AI workloads. Our cutting-edge technologies address critical needs in the thriving data center market. We foster a purpose-driven culture built on passion, optimism, and a genuine commitment to our customers, each other, and our planet.



Responsibilities

Lead the preparation of monthly, quarterly, and annual financial statements, ensuring accu-racy and compliance with accounting standards.
Support and help improve the budgeting and forecasting processes, including variance analy-sis and financial modeling.
Strengthen and monitor internal financial controls, ensuring adherence to regulatory re-quirements and company policies.
Perform analytical reviews of company activities, including profitability calculations.
Collaborate with other departments to ensure accurate and efficient financial processes.
Oversee day-to-day finance operations, including reconciliations, reporting, and process opti-mization.
Assist in preparing materials for management and board reporting.
Requirements:
Qualifications

Certified Public Accountant (CPA) license.
Minimum of 4 years of experience in accounting or financial reporting.
Proficiency in Microsoft Excel, including advanced functions.
Familiarity with financial systems (Priority experience is a plus).
Strong analytical skills, attention to detail, and ability to meet deadlines.
Excellent communication and interpersonal skills.
High level English proficiency in all aspects: reading, writing, and speaking.
This position is open to all candidates.
 
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8442641
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לוח ללקוחות VIP בלבד
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04/12/2025
Location: Tel Aviv-Yafo
Job Type: Full Time
The Chip Test Engineer plays a crucial role in designing, developing, and implementing automated test for IC chips and systems for Automotive industry.
The Test Engineer is responsible to define and develop tests, design test features, program test scripts, and analyze test results to ensure the quality and functionality of products.
The Test Engineer collaborates with cross-functional teams to troubleshoot issues, improve test processes, and support product development efforts.
Responsibilities:
Develop and implement test strategies, plans, and procedures for ATE systems to ensure comprehensive testing of ICs.
Design and develop test features, test programs, and test scripts for automated test environment (ATE) based on product specifications and requirements.
Collaborate with design engineers, product manager, production vendors and manufacturing teams to understand product functionality, performance requirements, and testability considerations.
Conduct feasibility studies and risk assessments to identify potential challenges and develop mitigation strategies for test development and implementation.
Develop test program based on code languages C++ , Java and Python.
Debug, troubleshoot, and resolve issues with ATE hardware, software, and test scripts to ensure reliable and accurate test results.
Analyze test data and results to identify trends, anomalies, and potential defects, and provide feedback to design and development teams for product improvement.
Develop and maintain documentation for test procedures, specifications, and configurations.
Collaborate with vendors and suppliers to evaluate and select ATE equipment, components, and software tools that meet project requirements and performance standards.
Stay abreast of industry trends, advancements in test technologies, and best practices in automated testing to drive continuous improvement in test processes and methodologies.
Requirements:
Bachelor's degree in electrical engineering, computer engineering, or a related field.
Proven 5+ years of experience in automated test development, preferably in the semiconductor or electronics industry.
Experience in programming languages such as C/C++/JAVA/Python.
knowledge of ATE hardware platforms (e.g., Advantest or Teradyne) and test methodologies (e.g., parametric testing, functional testing).
Familiarity with electronic measurement instruments (e.g., oscilloscopes, multimeters, signal generators) and test techniques for analog and digital circuits. Advantage RF test.
Excellent problem-solving skills and the ability to troubleshoot complex issues with ATE systems and test setups.
Strong communication and interpersonal skills, with the ability to work effectively in cross-functional teams.
Detail-oriented with a focus on quality, accuracy, and efficiency in test development and execution.
Ability to work independently, prioritize tasks, and manage multiple projects simultaneously in a fast-paced environment.
Preferred Qualifications
Experience in Mix-signals, high-speed interfaces testing fields.
Experience with test data analysis tools (e.g JMP, Spotfire, Yield HUB, Silicon Dash).
This position is open to all candidates.
 
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עדכון קורות החיים לפני שליחה
8442822
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21/12/2025
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
we are looking for a passionate Software Engineer to join our Chip Design CAD team. In this role, you will experience the interesting junction of electrical and software engineering, when developing SW tools and solutions used to design the next generation Smart Adapters, Switches and GPUs for the advanced data centers across the world.
You will join us as a software engineer dedicated to the connectivity and reliability of our product ecosystem. Your focus will be engineering the integration layers that allow our CAD tools to seamlessly interact with the companys wider infrastructure and projects.
What you'll be doing:
Own the Integration Framework: Architect and maintain the Python-based framework connecting our CAD tools to the internal ecosystem, driving a code-first approach to automate delivery pipelines and integration events.
Cross-Team Compatibility: Collaborate with other engineering groups to design resilient interfaces, ensuring our tools remain compatible with the broader ecosystem as we release new features
Continuous Improvement: Proactively identify friction points in our current processes and implement software solutions to resolve them.
Requirements:
Computer Science / Computer Engineering degree
Motivated, responsive, and keen on process improvement
25 years of software development experience.
Python Proficiency: Strong command of Python for scripting, complex automation, and tool development.
System Design: Ability to visualize software dependencies and design modular, scalable integration architectures.
Development Lifecycle: Familiarity with git (or other SCM), branching strategies, and release methodologies.
Ways to stand out from the crowd:
Knowledge with Linux
Experience in DA / CAD team
Knowledge in Chip Design and EDA world: Design, DV, FW.
C++ Experience
Experience building APIs or middleware that allows distinct software tools to communicate effectively.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8465142
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03/12/2025
Job Type: Full Time
We develop cutting-edge technology in Silicon Photonics, revolutionizing connectivity and communication in data centres. Silicon photonics is becoming a standard technology used for high-performance systems, solving challenges of performance, integration, power, and cost. This technology is growing rapidly also in other markets such as Healthcare, LIDARs, and other sensors.
We are looking to solve difficult problems, smartly and simply, by thinking out of the box, leveraging the knowledge and know-how of the team members, and working as a team to create Magic. Our Company culture is characterized by accountability for our ethics, and for being fair to every employee, customer, supplier, and partner. We believe we must work hard and have fun on the way to success.
We are looking for a Photonics Layout Engineer to join our integrated photonics design team - This position is also well-suited for Analog Layout Engineers who are interested in transitioning into photonic integrated circuit (PIC) design.
In this role, you will be responsible for creating, optimizing and validating PIC layouts, ensuring manufacturability, performance and compliance with foundry design rules. You will work closely with device designers, process engineers, and tape-out teams to deliver high-quality layouts of silicon photonics PICs. Strong candidates will have hands-on experience with industry-standard layout tools, especially Cadence Virtuoso or similar software. Understanding of photonic components, waveguide routing and automated layout generation is a major advantage. You will also contribute to layout methodologies, PCells, and design automation flows to accelerate PIC development.
Responsibilities:
Develop and implement mask layouts for photonic integrated circuits using Cadence Virtuoso or similar software. Create and maintain PCells for photonic building blocks (waveguides, couplers, modulators, gratings, etc.). Perform waveguide routing, ensuring correct connectivity, bend radius limits, and low-loss optical paths. Verify layouts using DRC, and LVS to ensure compliance with foundry requirements. Collaborate with device designers to translate basic schematics and specifications into Software schematics and manufacturable layouts. Optimize layouts for performance, yield, and compactness while adhering to technology constraints. Participate in photonic design automation tool development and workflow improvements. Prepare and manage data for tape-out and support mask review processes. Debug layout and rule-check issues and propose corrective actions.
Requirements:
Hands-on experience with Cadence Virtuoso or similar layout software (e.g., analog IC layout tools). Experience with DRC/LVS, foundry PDKs, and layout verification methodologies. Familiarity with foundries PDKs. Ability to build and maintain automated layout structures (PCells/SKILL scripting or equivalent). Strong communication skills and ability to work in cross-functional teams. Preferred Background in silicon photonics fabrication processes. Experience with mixed photonic-electronic layout integration.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8440010
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Location: Tel Aviv-Yafo and Haifa
Job Type: Full Time
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our company's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As a SoC Physical Design Engineer, you will collaborate with functional design, Design for Testing (DFT), architecture, and packaging engineers. In this role, you will solve technical problems with innovative micro-architecture and practical logic circuits solutions, while evaluating design options with optimized performance, power, and area in mind.
The AI and Infrastructure team is redefining whats possible. We empower our company customers with breakthrough capabilities and insights by delivering AI and Infrastructure at unparalleled scale, efficiency, reliability and velocity. Our customers, our company Cloud customers, and billions of our company users worldwide.
We're the driving force behind our company's groundbreaking innovations, empowering the development of our cutting-edge AI models, delivering unparalleled computing power to global services, and providing the essential platforms that enable developers to build the future. From software to hardware our teams are shaping the future of world-leading hyperscale computing, with key teams working on the development of our TPUs, Vertex AI for our company Cloud, our company Global Networking, Data Center operations, systems research, and much more.
Responsibilities
Use problem-solving and simulation techniques to ensure performance, power, and area (PPA) are within defined requirements.
Collaborate with cross-functional teams to debug failures or performance shortfalls and meet program goals in lab or simulation.
Design chips, chip-subsystems, or partitions within subsystems from synthesis through place and route, and sign off convergence, ensuring that the design meets the architecture goals of power, performance, and area.
Develop, validate, and improve Electronic Design Automation (EDA) methodology for a specialized sign off or implementation domain to enable cross-functional teams to build and deliver blocks that are correct by construction and ease convergence efforts.
Requirements:
Minimum qualifications:
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
5 years of experience with System on a Chip (SoC) cycles.
Experience with advanced design, including clock/voltage domain crossing, DFT, and low power designs.
Experience in high-performance, high-frequency, and low-power designs.
Preferred qualifications:
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
Experience with scripting languages such as Perl, Python, or Tcl.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
7 ימים
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
we are looking for best-in-class Chip Verification Engineers to join our outstanding Networking Silicon Engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a significant part in verifying our ground-breaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.
What youll be doing:
Verification for chip blocks/entities according to specifications
Integrations and Full-Chip models
Interaction with organization-wide groups.
Requirements:
B.SC./ M.SC. in Computer Engineering/ Electrical Engineering/ Communication Engineering or equivalent experience
2+ years experience in verification or similar position
High Level of English
Ability to work as part of a team
Ways to stand out from the crowd:
Validated experience in Verification
Experience in Specman
Background in UVM/SV
Knowledge in HDL (Verilog/VHDL).
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8467654
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
14/12/2025
Location: Tel Aviv-Yafo
Job Type: Full Time
We are looking for talented people to join us, as leaders in our excellent Physical Design team, adopting super advanced process nodes, mentoring team members, and further developing our implementation methodologies.
Key job responsibilities
* Daily involvement in all aspects of physical design chip development (RTL2GDS), including floorplanning, synthesis, clock tree synthesis, place and route, static timing analysis, power and noise analysis, physical verification testing, and equivalence checks.
* Being actively engaged in design-backend convergence aspects and defining timing constraints.
* Taking full end-to-end responsibility for the physical design of macros and clusters level, according to specifications, under challenging constraints, with focus on optimizing power, area, and performance.
* Participation in the development of design flows, using a variety of EDA tools and vendors such as Synopsis and Cadence.
* Engaged in defining implementation and signoff methodologies.
A day in the life
Your day will be a dynamic blend of technical innovation and collaborative problem-solving. You'll dive deep into intricate chip design processes, working with state-of-the-art tools and technologies to create semiconductor solutions that drive cloud computing forward. Expect to engage in complex design challenges, collaborate with brilliant engineers, and see your work directly impact global technological advancement.
Requirements:
Basic Qualifications
- 8+ years of experience in physical design
- Understanding the entire place and route flow (RTL to GDS)
- Very deep understanding of timing
- Process and technology (advanced nodes) oriented
- Leadership and mentoring skills
Preferred Qualifications
- Full-chip experience (floor plan, layout, timing)
- Previous experience in high-speed designs, multi-voltage (low power) designs.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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7 ימים
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are now looking for a Chip Design Verification Engineer. we are seeking a verification engineer to join the chip design methodologies team. The team is in charge of the verification methodologies, shared code, training, and embracing new technologies. One of our main goals is to make sure that the team works in an efficient manner, and provides high-quality deliveries. This position offers the opportunity to have real impact in a dynamic, technology-focused company.
What you'll be doing:
Develop shared verification code and solutions to be widely used by the chip design team.
Develop groundbreaking methodologies to create a flawless experience for verification engineers to keep the focus on new problems.
Collaborate with the design automation team to provide end-to-end solutions that combine verification, simulation, and automation.
Get in touch with EDA vendors to learn about cutting-edge tools/technology and apply them into our verification process.
Understand the design, define the verification scope, develop the verification infrastructure and verify the correctness of the design.
Collaborate with designers, verification specialists to accomplish your tasks.
Develop training sessions.
Requirements:
A Bachelor's Degree in Electrical Engineering or Computer Science.
Exposure to design and verification tools.
Strong interpersonal skills and ability & desire to innovate.
Ways to stand out from the crowd:
Experience in Specman / System Verilog UVM.
Understanding simulation tools.
Experience in building test benches, evaluate coverage and debug simulation failures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8467703
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27/11/2025
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are looking for a passionate and experienced software developer to join our Chip Design Technologies group, helping to build the tools that shape the future of Chip Design and Verification. This role is at the intersection of software engineering and hardware design. Youll work on the software that accelerates the development of our industry-leading networking chips highway for the AI revolution.

We're looking for someone who combines strong coding skills with a solid understanding of chip design or verification. If youre excited about solving technical bottlenecks, building scalable tools, and collaborating with designers and verification experts, youll feel right at home here.

What youll be doing:

Develop software tools for our chip design and verification flows

Collaborate closely with designers and verification engineers to identify bottlenecks, propose improvements, and build software solutions that boost productivity and quality.

Own your solutions end-to-end from idea to delivery to support.
Requirements:
What we need to see:

B.Sc. or M.Sc. in Computer Science, Computer Engineering, or Electrical Engineering.

Total of 5+ years of experience; 3+ years of experience developing software tools for chip design/verification and 2+ years of hands-on experience in chip design or verification.

Proficiency in software engineering, with strong debugging and system design skills.

Strong communication skills and a proactive approach to working with users and cross-functional teams.

Ways to stand out from the crowd:

Proven ability to identify quality or efficiency gaps in design/verification workflows and deliver impactful methodology or automation improvements.

Experience in leading or contributing to cross-team technical discussions to define software solutions.

Passion for building usable tools, with deep understanding of user needs, pain points, and design/verification/debug scenarios.

Takes initiative to explore new ideas and independently drives solutions in ambiguous environments.

Proficiency in Python.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
21/12/2025
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
we ae looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.
What you'll be doing:
Own the special chiplet STA, analyze the timing results, verify correctness and provide budget for the different partitions.
Generate the timing constraints for the STA and the P&R flow.
Be exposed and work on a variety of exciting designs (including high cell count and high frequency), resolving complex timing and congestion problems.
Help to shape clock tree, and effect the work of the different teams (Front end, DFT & BE).
Daily work involves all aspect of STA & chip design: take part in SDC generation & review, actively running & analyzing STA tools, guiding the group during chip closure process, etc'.
Taking part inflows development.
Take part in ramping up new breaking technologies.
Requirements:
B.SC./ M.SC. in Electrical Engineering/Computer Engineering or equivalent work experience
5+ years of hands-on STA experience.
Experience in Prime Time and signoff methodologies.
Deep understanding of all aspects of Physical construction and Integration.
Great teammate.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8465315
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
לפני 23 שעות
Location: Tel Aviv-Yafo
Job Type: Full Time
We are driving innovation in automotive technology, developing solutions that power the next generation of vehicles. We are looking for a Junior Engineer who is eager to learn, grow, and make an impact in a dynamic and innovative environment. This is a unique opportunity to work alongside experienced professionals, gain hands-on experience, and contribute to projects at the forefront of automotive electronics. If you are passionate about technology, curious to explore new challenges, and excited to make a real difference, we are the place to develop your skills, innovate, and grow your career.
Why join us?
* Work on cutting-edge automotive projects.
* Learn from a talented and supportive team.
* Gain exposure to real-world automotive challenges.
* Grow your career in a collaborative and inspiring environment.
If youre ready to take the next step in your career and be part of something meaningful, wed love to meet you!
About The Position:
As a Junior ASIC Design Engineer, you will take part in the full lifecycle of advanced chips that power the next generation of vehicles. This is a hands-on, growth-oriented role where youll work closely with experienced ASIC engineers, gain exposure to real silicon, and build a strong foundation in chip design and verification. In this role, you will:
* Be part of a professional ASIC team working on cutting-edge automotive solutions.
* Support and learn from real emulation platforms used in production-grade designs.
* Contribute to RTL implementation and gain practical experience in design flows.
* Assist with verification and backend (BE) activities, learning industry best practices.
* Participate in silicon bring-up, seeing your work come to life on real hardware This position is ideal for curious engineers who want to learn fast, take ownership, and grow into a key contributor in the world of automotive semiconductor design.
Requirements:
* B.Sc. in Electrical Engineering (graduate with excellence or a 3rd-year student).
* Strong interest in ASIC / chip design and hardware development.
* Basic understanding of RTL design concepts - an advantage.
* Any exposure to programming or scripting (e.g., Python, TCL, PERL) - an advantage.
* Previous academic or practical experience in relevant fields - an advantage.
* Good English communication skills, both written and verbal.
* Team player with a positive attitude, curiosity, and willingness to learn.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8476259
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Jerusalem
Job Type: Full Time
Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
3+ years of experience in semiconductor package design and assembly.
Deep knowledge of package design, substrate engineering, and simulation methodologies.
Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
Strong background in schematic review, capture, and system-level integration.
Proficiency in scripting for automation and design optimization with tools like MATLAB or Python advantage.
Proficiency in layout design verification tool such as CAM350- advantage.
Experience working directly with OSATs advantage.
Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS, Cadence Sigrity and Siemens HyperLynx advantage.
Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8448714
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
Location: Petah Tikva
Job Type: Full Time
Join our advanced packaging team to define and develop cutting-edge semiconductor package solutions for automotive-grade digital and RF System-on-Chip (SoC) products. Youll collaborate with internal teams and external OSATs to deliver high-performance, manufacturable, and reliable packages that meet stringent automotive standards.
What will your job look like:
Define and specify advanced package architectures for digital SoCs and RF ICs in automotive applications.
Perform substrate design for flip-chip BGA (FC-BGA) packages, including stack-up, routing, and ball-out optimizations.
Evaluate and select substrate technologies, materials, and package solutions based on performance, cost, and reliability.
Collaborate with OSATs to define and validate assembly materials and process flows.
Work closely with internal teams such as Backend, SIPI, Product Engineering, and Quality & Reliability to ensure seamless integration.
Monitor yield, quality, and manufacturability across package development and production stages.
Support DFM reviews and ensure compliance with automotive standards and customer requirements.
Requirements:
B.Sc. or M.Sc. in Electrical Engineering, Materials Science, or a related field.
3+ years of experience in semiconductor package design and assembly.
Deep knowledge of package design, substrate engineering, and simulation methodologies.
Hands-on experience with package layout tools such as Cadence Allegro Package Designer or Xpedition Package Designer.
Solid understanding of high-speed layout constraints (e.g., crosstalk, EMI, RFI) and proven experience with interfaces like DDR, PCIe, MIPI, and UFS.
Strong background in schematic review, capture, and system-level integration.
Proficiency in scripting for automation and design optimization with tools like MATLAB or Python advantage.
Proficiency in layout design verification tool such as CAM350- advantage.
Experience working directly with OSATs advantage.
Proven experience with SIPI simulation tools like Ansys SIwave, Ansys HFSS, Cadence Sigrity and Siemens HyperLynx advantage.
Proven experience with thermal or thermo-mechanical simulation tools like Cadence Celsius, Ansys Icepak, Ansys Mechanical and Flotherm - advantage.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8448712
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תודה על שיתוף הפעולה
מודים לך שלקחת חלק בשיפור התוכן שלנו :)
21/12/2025
Location: Tel Aviv-Yafo and Yokne`am
Job Type: Full Time
We are now looking for a Chip Design Verification Engineer. we are seeking a verification engineer to join the chip design methodologies team. The team is in charge of the verification methodologies, shared code, training, and embracing new technologies. One of our main goals is to make sure that the team works in an efficient manner, and provides high-quality deliveries. This position offers the opportunity to have real impact in a dynamic, technology-focused company.
What you'll be doing:
Develop shared verification code and solutions to be widely used by the chip design team.
Develop groundbreaking methodologies to create a flawless experience for verification engineers to keep the focus on new problems.
Collaborate with the design automation team to provide end-to-end solutions that combine verification, simulation, and automation.
Get in touch with EDA vendors to learn about cutting-edge tools/technology and apply them into our verification process.
Understand the design, define the verification scope, develop the verification infrastructure and verify the correctness of the design.
Collaborate with designers, verification specialists to accomplish your tasks.
Develop training sessions.
Requirements:
A Bachelors Degree in Electrical Engineering or Computer Science.
Exposure to design and verification tools.
15+ years of hands-on pre-silicon verification experience.
Strong interpersonal skills and ability & desire to innovate.
Ways to stand out from the crowd:
Experience in Specman / System Verilog UVM.
Understanding simulation tools.
Experience in building test benches, evaluate coverage and debug simulation failures.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8466036
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מודים לך שלקחת חלק בשיפור התוכן שלנו :)
14/12/2025
Location: Haifa
Job Type: Part Time and May Be Suitable For Students
Required Chip Design Student, Graviton Server
A fabless semiconductor company established by semiconductor industry veterans and is now part of Amazon. We are developing leading edge products, manufactured on leading edge technologies. We offer a dynamic, open, teamwork environment operating at high pace mode.
About the team
Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description, we encourage candidates to apply. If your career is just starting, hasnt followed a traditional path, or includes alternative experiences, dont let it stop you from applying.
Why AWS?
We are the worlds most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating thats why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.
Inclusive Team Culture
AWS values curiosity and connection. Our employee-led and company-sponsored affinity groups promote inclusion and empower our people to take pride in what makes us unique. Our inclusion events foster stronger, more collaborative teams. Our continual innovation is fueled by the bold ideas, fresh perspectives, and passionate voices our teams bring to everything we do.
Requirements:
Basic Qualifications
- BSc student in Electrical Engineering / Computer Engineering. Please include your CV and a grade sheet in a single PDF file.
Preferred Qualifications
- Available two to three work days per week
- Fluent English
- Knowledge of digital logic systems, computer networks, and computer architecture.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
עדכון קורות החיים לפני שליחה
עדכון קורות החיים לפני שליחה
8455886
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Location: Hod Hasharon and Haifa
Job Type: Full Time
Our goal is to design cutting-edge CPUs for smartphones, servers, and desktops, and we need the very best talent to help us achieve it!
The CPU Architect will take charge of defining a processor on chip inter-connect and coherent fabric that meets the requirement of high performance, high bandwidth, and scalable processing architecture. This architect will utilize his processor experience to deliver a world-class processor ASIC with many advanced features for Huawei products.
Requirements:
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Solid understanding of general purpose CPU micro-architecture, including load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory technologies and memory controllers.
Ability to make trade-offs between power, performance and area to meet the requirements of the product.
Hand-on experience with high power-efficient CPU on chip interconnect, coherent fabric, memory controllers.
At least 8 years experience in architecture in one of the leading CPU companies
Experience modeling microprocessors using higher-level languages, like C/C++.
DESIRED:
Co-operate and communicate well with the architecture and design teams.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.
This position is open to all candidates.
 
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הגשת מועמדותהגש מועמדות
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עדכון קורות החיים לפני שליחה
8422282
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