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Our Switch ASIC group is seeking a top-tier ASIC technical manager to lead the development of our next-generation ASICs. Join us in shaping the future of technology! As an ASIC Project Lead, you will manage the pre-silicon development of NVIDIA's most advanced and complex switch ASICs - from concept to tape-out - and drive the chip through power-on and qualification to production release. You will collaborate with a cross-disciplinary team, interacting with unit-level ASIC, Physical Design, CAD, Package Design, Firmware & Software, DFT, System Design, Analog Design, and other specialized teams.


What you'll be doing:
Development Management: Lead the ASIC development from concept and architecture stages through micro-architecture, design, verification, and physical design until tape-out.
Post-Silicon Execution: Drive chip power-on, bring-up, and qualification to production release.
Execution Plans: Define and implement execution plans in collaboration with cross-discipline leaders in unit-level, full-chip, physical design, and firmware/software emulation.
Roadmap Definition: Contribute to the definition of NVIDIA's switch ASIC roadmap.

As we expand our presence in Israel, we're seeking a highly skilled Chip Top Physical Design Engineer focusing on implementation to join our local engineering powerhouse from the ground up.
If you thrive on solving complex, unnamed challenges in deep-submicron processes, your place is with us.

As a Physical Design Engineer, you will be a key hands-on member of our PD Team in the Israel R&D center. You will execute the physical design of the SoC Top level for chips that drive the worlds largest AI clusters. You will be deeply involved in all PD disciplines of the chip, driving the tape-out (T.O.) GDS to meet strict signoff criteria (Timing, LVS, EMIR, DRC, PV, etc.), ensuring our silicon meets the extreme performance, power, and area (PPA) targets required for AI scale.

Key Responsibilities
Execute SoC Top-level physical design and actively drive full-chip convergence.
Perform Top-Level physical implementation, including floor-planning, Place & Route (P&R), Clock Tree Synthesis (CTS), Power/Clock distribution, Power Integrity, and Timing/Physical signoff.
Work closely with the Architecture, Design, DFT, and Product teams to achieve optimal Power, Performance, and Area (PPA). This involves participating in feasibility studies for new architectures and optimizing runs to ensure the best Quality of Results (QoR).
Resolve complex signal integrity, thermal, and power challenges inherent in high-speed connectivity silicon.
Collaborate closely with the Package team on Bump-map-to-Ballout design, taking all signal integrity aspects into consideration.

Required Staff ChipDev Engineer
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
In this role, you will have the opportunity to find the perfect blend of software design practices and hardware development complexity. You will be a hardware engineer with software proficiency.
Responsibilities
Work with partner teams to provide the compute, storage and methodology needs of the chip design, verification and physical design teams.
Collaborate with application-specific integrated circuit (ASIC) teams to implement tools and methodologies.
Design and implement CAD tools, solutions and methodologies for ASIC development.
Create software solutions that improve the hardware design process through automation.
Propose, design and implement software automation that directly addresses bottlenecks in today's ASIC and SoC EDA flow.

We are looking for a Chip Design Manager to join our Switch Silicon team. As a Chip Design Manager in our Networking Business Unit, you'll join a group of passionate professionals to design and lead the implementation of the next generation of state-of-the-art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!


What You'll Be Doing:

Lead a team of design and verification engineers that develops core units within the Switch Silicon.

Handle micro-architecture for RTL and simulation environment planning for units and modules.

Be responsible for the delivery of complex RTL units and their verification.

Work closely with multiple teams within the organization, such as Architecture, Full Chip, Micro-Architecture, BE, and FW.

Required ASIC Design Verification Engineer, Digital Signal Processing
About the job
In this role, youll work to shape the future of AI/ML hardware acceleration. You will have an opportunity to drive cutting-edge TPU (Tensor Processing Unit) technology that powers our most demanding AI/ML applications. Youll be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our TPU. You'll contribute to the innovation behind products loved by millions worldwide, and leverage your design and verification expertise to verify complex digital designs, with a specific focus on TPU architecture and its integration within AI/ML-driven systems.
In this role, you will define and execute the verification strategy for high-speed Physical Layer (PHY) digital blocks. This role focuses on the functional and mathematical verification of complex DSP algorithms, digital-analog boundaries, and signal processing logic. This position requires a strong technical foundation in communication theory, fixed-point arithmetic, and mixed-signal co-simulation.
Responsibilities
Verify RTL implementations against high-level architectural reference models (MATLAB, C++, or SystemC) using bit-exact and fixed-point verification methodologies.
Verify the stability, tracking capability, and convergence of adaptive equalization loops (FFE, DFE) and timing recovery systems under varying channel impairments.
Model and verify the functional interface between Digital DSP blocks and the Analog Front End (AFE) using Real Number Modeling (RNM) or SystemVerilog-AMS.
Design, implement, and maintain scalable UVM-based simulation environments, SystemVerilog Assertions (SVA), and functional coverage metrics for digital signal processing blocks.

Required Design AI Lead, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Our mission is to organize the world's information and make it universally accessible and useful. Our team combines the best of AI, Software, and Hardware to create radically helpful experiences. We research, design, and develop new technologies and hardware to make computing faster, seamless, and more powerful. We aim to make people's lives better through technology.
Responsibilities
Lead an edge AI IP design team including definition, implementation and deployment, and define IP development methodologies sharing unified blocks within the IP design team.
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Demonstrate technical involvement throughout the entire Intellectual Property (IP) development cycle, ensuring seamless integration into System-on-Chip (SoC).
Perform RTL development (e.g., coding and debug in SystemVerilog), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Collaborate closely with software, verification, emulation, physical design, packaging, and silicon validation stakeholders to ensure that designs are complete, correct, and performant.

Required RTL Design Technical Lead, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
As part of our Server Chip Design team, you will use your ASIC design experience to be part of a team that creates the SoC VLSI design cycle from start to finish. You will collaborate closely with design and verification engineers in active projects, creating architecture definitions with RTL coding, and running block level simulations.
In this role, you will contribute in all phases of Application-Specific Integrated Circuit (ASIC) designs from design specification to production. You will collaborate with members of architecture, software, verification, power, timing, synthesis, etc. to specify and deliver high quality SoC/RTL. You will solve technical problems with innovative micro-architecture and practical logic solutions, and evaluate design options with complexity, performance, power and area in mind.
Responsibilities:
Define the block level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up.
Participate in test plan and coverage analysis of the block and SOC-level verification.
Communicate and work with multi-disciplined and multi-site teams.

As we expand our presence in Israel, we're seeking a visionary Expert IC Package Design Lead to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, leading the physical implementation strategy for chips that power the world's largest AI clusters.

As an Expert IC Package Design Lead, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon.
You will own package flow, architecture, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for defining package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our products to operate reliably in the worlds most demanding AI and cloud environments.

Key Responsibilities
Own end-to-end IC package design, from early architecture and feasibility through detailed design, qualification, and high-volume manufacturing.
Define package architecture and technology selection (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration).
Lead signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices.
Drive package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and mechanical constraints.
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance.
Interface with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets.
Lead package-related risk assessment, failure analysis, and corrective actions during bring-up and production ramp.
Support NPI, qualification, and product sustainment activities, including vendor audits and technical reviews.

We are looking for best-in-class Chip Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high speed communication devices, delivering the highest throughput and lowest latency! Come and take a significant part in designing our groundbreaking and innovative chips, enjoy working in a meaningful, growing and highly professional environment where you make a huge impact in a technology-focused company.

What you will be doing:

Join the Tel Aviv or Beer-Sheva group, working on RiscV processors platform.

Verification for chip blocks according to specifications under challenging constraints and with high orientation to power, area and performance.

Daily work might involve any or all aspects of chip development including verification, integration, debug

Work closely with firmware and other groups around the globe.

We are looking for best-in-class Physical Design Engineers to join our outstanding Networking Silicon engineering team, developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency! Come and take a part in designing our groundbreaking and innovating chips, enjoy working in a meaningful, growing and highly professional environment where you make a significant impact in a technology-focused company.

What you'll be doing:

Perform physical layout for full-chip level, integration, pinning and bump route.

Work with block owners and project managers to assure high quality convergence in all layout aspects.

You will be responsible for chip layout from the floorplanning stage through tape-out.

Our networking is a world-leader in building the most powerful supercomputers in the world which drive the AI and HPC industry. These rely on high performant network ASICs which connect GPUs at scale for efficient data transfer and compute. We are looking for a hardware performance modeling architect to join our team and build a network simulator used for the design, optimization and exploration of our future networking chips. The role is cross-disciplinary, collaborating with hardware and software teams across the wider company. You will solve complex problems, develop innovative solutions and be instrumental in determining the architecture of our next generation networking solutions.

What you'll be doing:

Define the Network Adapter chip architecture end to end from the market requirements through design and all product life cycles (post/pre-silicon, on deployments). Work with related industry standards & customers on deploying your tech.

Collaborate with teams across teams (physical design, logic design, system software, firmware, applications)

Develop cycle-accurate simulation components to evaluate and analyze micro-architecture and architectural options.

Explore innovative ideas to improve and optimize our chip systems performance.

Serve as a focal point within the organization and distribute the knowledge that you acquire.

We are now looking for a Senior Chip Design Verification Engineer to join our Switch Silicon team. As a Chip Design Engineer in our Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state-of-the-art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What You'll Be Doing:

Work in a design/verification team which develops core units within the Switch silicon.

Micro-architecture of dynamic verification environments planning for units and modules.

Design dynamic verification environments of units/blocks according to Arch. specifications under challenging constraints with high orientation to power, area, and performance.

Work closely with multiple teams within organizations such as Architecture, u-arch, Full chip Micro-Architecture, BE, and FW.

We are now looking for a Senior Chip Design Verification Engineer for the Switch Silicon group.

As a Chip Design Engineer at NVIDIA's Networking business unit, you'll join a group of passionate engineers to design and implement the next generation state of the art Switch Silicon chips. In this position, you'll make a real impact in a dynamic, technology-focused company while developing the industry's best high-speed communication devices, delivering the highest throughput and lowest latency!

What you'll be doing:
Work in a combined design and verification team which develops some of the switch silicon core units.
Build reference models, verify and simulate chip blocks/entities according to specifications.
Work closely with multiple teams within organizations such as Architecture, Micro- Architecture, and FW.

You'll be joining our Physical Design team within Cisco Silicon One, which is responsible for the entire backend methodology and flow development from RTL to GDS. This is a critical part of the group leading the development of high-quality VLSI designs.

Our Backend Engineers handle all aspects of chip design, including Definition, Physical Synthesis, Place and Route, Optimization, Timing Closure, Design Floor Planning.

You will be leveraging your backend and physical design experience to drive the development, optimization, and innovation of CAD methodologies and tools, ensuring the highest quality and efficiency in our chip design flows from RTL to GDS.

Required Micro-Architect, Networking, Cloud
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of our direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.
Responsibilities
Lead Design Activities at IPs, SubSystems(S.S) and SoC.
Define the block-level design documents such as interface protocol, block diagram, transaction flow, pipeline, and more.
Perform RTL development (e.g., coding and debug in Verilog, SystemVerilog, VHDL), function/performance simulation debug, and Lint/CDC/FV/UPF checks.
Participate in synthesis, timing/power, and FPGA/silicon bring-up, as well as test plan development and coverage analysis for block and SOC-level verification.
Communicate and collaborate with multi-disciplined and multi-site teams.