לוח משרות דרושים הייטק חומרה בחיפה

Requirements:
Previous experience in leading hardware development projects
Strong understanding of software and HW delivery lifecycle - must (strong technical background advantage)
Experience in a Scrum Master role (knowledge of Scrum techniques, Jira expert, Microsoft project)
Proven experience in planning and executing several concurrent projects with multiple teams and integration points till completion with quality, time and budget in an Agile environment.
familiarity with electronic circuits- Advantage
Electronics/Electrical Practical Engineer- Advantage
Excellent client-facing and internal communication skills
Problem-solving approach, conflict-resolution ability, self-motivation and accountability.
Excellent time management and organizational skills
Excellent oral and written communication skills, good presentation abilities, leadership skills, maintaining proactive and can-do Attitude.
Out of the box thinker with innovative & positive approach
Ability working under pressure.
English Fluent.

Requirements:
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Solid understanding of general purpose CPU micro-architecture, including load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory technologies and memory controllers.
Ability to make trade-offs between power, performance and area to meet the requirements of the product.
Hand-on experience with high power-efficient CPU on chip interconnect, coherent fabric, memory controllers.
At least 8 years experience in architecture in one of the leading CPU companies
Experience modeling microprocessors using higher-level languages, like C/C++.
DESIRED
Co-operate and communicate well with the architecture and design teams.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Minimum of 10 years of proven design experience in complex processor projects.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Software development (C, assembly).
Experience modeling microprocessors using higher-level languages, like C/C++.
Excellent verbal and written communication skills.
Co-operate and communicate well with the architecture team and other members of development team.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to US, Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.
MINIMAL REQUIREMENTS
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Ability to make trade-offs between power, performance and area appropriately to meet the requirements of the product.
Hand-on experience with high power-efficient CPU core successfully.
Understanding of CPU instruction set architecture and assembly language.
Ownership of the overall verification methodology for a CPU project.

Requirements:
PhD or MSc in computer science or area related to computer architecture, or equivalent research experience in industry
At least 10 years of relevant research experience in industry or Academia
Ability to provide innovation and global vision throughout the company
Experience analyzing performance of new application and root cause of performance bottlenecks
Candidates should have research experience in at least one of the following areas:
Computer architectures: instruction set architecture, microarchitecture, cache sub-system, memory sub-system, NOC, interconnect- MUST.
Workload characterization and analytical model generation- MUST.
Parallel, High-Performance, and Distributed Computing with an emphasis on hardware-software characterization, optimization and innovation
Heterogeneous Architectures and Systems for Datacenters.
Expertise in the field of AI will be a big advantage Excellent communication, presentation and reporting skills Experience working with highly technical teams and communicating to non-technical partners.
Excellent oral and written English.

Requirements:
5+ years of experience in high-speed SERDES design, implementation, or research, with hands-on involvement in previous generations of Ethernet standards (e.g., 100G, 200G, 400G).
Proven experience with IEEE 802.3 working groups and standards, particularly in areas related to Ethernet and optical PHY layer technologies (e.g., 802.3ba, 802.3bs, 802.3cd, 802.3ck)
Deep knowledge of modulation techniques such as PAM4 and NRZ, as well as high-speed signaling protocols used in both optical and copper interconnects
Expertise in physical layer research, signal integrity, channel modeling, equalization and error correction techniques for high-speed links
Experience working with key industry players, vendors, and consortiums to shape standards and drive technology adoption
Strong ability to produce technical reports, white papers, and presentations that distill complex technical information into actionable insights
How would you stand out:
Advanced Degree: Masters or PhD in Electrical Engineering, Communications Engineering, or a related field
Expertise and knowledge in in PCS/PMA sublayers, GMII Interface and MAC (Media Access control) in IEEE 802.3.
Extensive involvement in developing Ethernet standards from 100G up to 400G, with insights into the evolution toward 800G and Terabit Ethernet
Demonstrated leadership in managing cross-functional engineering projects related to PHY layer technologies and SERDES interface innovation
Previous experience presenting at or contributing to major industry conferences and events (e.g., OFC, ECOC, IEEE Ethernet Alliance meetings).

Requirements:
Solid understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store unit, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems.
Ability to make trade-offs between power, performance and area appropriately to meet the requirements of the product.
Hand-on experience with high power-efficient CPU core successfully.
Understanding of CPU instruction set architecture and assembly language.
At least 20 years of experience in one of the leading CPU companies
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Familiarity with the ARM architecture and the micro-architecture for current ARM CPU cores.
Software development (C, assembly).
Experience modeling microprocessors using higher-level languages, like C/C++.
Excellent verbal and written communication skills.
QUALIFICATIONS
Co-operate and communicate well with the architecture team and other members of development team.
Interact with the Product System architects, software teams and ASIC chip teams to define the overall architecture of the Processor ASIC including memory hierarchy.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
BSC, MS or PHD in Electrical Engineering, Computer Engineering, or Computer Science.
Good understanding of general purpose CPU micro-architecture, including knowledge of areas such as processor pipelines, load store units, caches, cache coherence, memory hierarchy, multi-processor, multi-thread processor systems, memory controller.
Good understanding of high speed digital VLSI design flow and methodology
Understanding of trade-offs between power, performance and area appropriately to meet the requirements of the product.
At least 6 years of experience in one of the leading CPU companies
Familiarity with the ARM\IA architecture and the micro-architecture for current ARM\IA CPU cores.
Software development (C, assembly).
Hands on experience as a Front end ASIC designer
DESIRED
Co-operate and communicate well with the architecture team and other members of the development.
Excellent verbal and written communication skills.
Travel to Beijing and ShenZhen sites may be required.
Good presentation and internal customer interaction skills.

Requirements:
Experience of 5+ years in the firmware development/design of L2/3/4 networking devices or working with such device
Deep knowledge in one or more of the following fields: Virtualization, Storage, HW offloads, network acceleration, RDMA (iWARP, RoCE, InfiniBand)
Hands-on with software coding: C/C++, real-time programming of embedded microprocessors (ARM or Tensilica or MIPS)
Experience with OS kernel and user mode programming for Linux, understanding of Memory/Process/Thread/IO management
Bachelors degree or higher in Computer Engineering, Computer Science, Electrical Engineering, or equivalent
Ways to stand out from the crowd:
An expertise in one of the following:
Linux kernel , KVM, DPDK, SPDK, DPU/IPU environments, DOCA, IPDK.

Requirements:
BSc or MSc in Electrical engineering or Physics.
At least 2 years of proven experience in SI/PI and/or RF simulations.
Knowledge in SI/PI/RF simulation tools, including 2.5D/3D extraction.
Knowledge in SI/PI theory, electro - magnetics.
Experience in custom digital/analog circuit design and transistor level simulations - advantage.
Experience in Electrical Validation - advantage
Experience in High-Speed PCB design - advantage.