We are seeking an experienced and driven Quality and Reliability (Q&R) Engineer to own and manage the qualification and long-term reliability of advanced automotive semiconductor products. In this role, you will be responsible for defining, executing, and ensuring product compliance with industry standards (e.g., AEC-Q100, JEDEC, ISO26262), collaborating cross-functionally with design, test, packaging, and manufacturing teams to ensure robust quality performance throughout the product lifecycle.
What your job will look like:
Lead end-to-end quality and reliability activities for new automotive product introductions (NPI), including definition of Q&R plans, stress test strategy, and execution of qualification.
Define and align qualification strategy with AEC-Q100, JEDEC (JESD22), and customer-specific requirements.
Drive reliability risk assessments (FMEA, FMEDA, fault tree analysis) in collaboration with functional safety and design teams.
Manage product qualification timelines, budgets, and documentation, including reliability test reports, risk mitigation plans, and deviation justifications.
Interface with OSATs and test/assembly partners to ensure reliability test execution, including HTOL, ELFR, HAST, PTC, HTSL, and solder joint reliability.
Lead root cause analysis and corrective actions for product or qualification-related failures (FA/8D process).
Act as the Q&R voice in cross-functional reviews (DFX, tape-out, production ramp, and PCN).
Track field returns, drive reliability monitoring, and contribute to continuous improvement activities.
Support audits, customer quality inquiries, and product certifications as needed.
Requirements: B.Sc./M.Sc. in Electrical Engineering, Materials Science, Physics, or related technical field.
5+ years of experience in semiconductor quality/reliability, preferably in automotive-grade ICs or modules.
Strong knowledge of AEC-Q100, JEDEC standards (e.g., JESD47, JESD22), and automotive PPAP/APQP process.
Hands-on experience with reliability testing, failure analysis techniques, and qualification management.
Familiarity with packaging-related reliability (FCBGA, FCCSP, WLCSP, QFN) and stress mechanisms (solder fatigue, moisture sensitivity, ESD/LU).
Proven ability to work across multidisciplinary teams (design, test, process, FA, packaging).
Excellent communication, organizational, and problem-solving skills.
Experience with radar, vision, or ADAS automotive products- Advantage.
This position is open to all candidates.