we are establishing a strategic R&D center in Israel to drive the development of complex semiconductor chips that solve the critical 'data bottlenecks' enabling the future of AI at scale. As we expand our presence in Israel, we're seeking a visionary Package Design Engineer to help build our local engineering powerhouse from the ground up. This is a unique opportunity to take on meaningful product ownership in a new site, Driving the physical implementation strategy for chips that power the world's largest AI clusters.
As a Package Design Engineer, you will be a core technical contributor in the development of advanced IC packaging solutions for high-performance connectivity silicon. You will execute the package flow, design, and qualification from concept through production, working closely with silicon, signal integrity, power integrity, mechanical, manufacturing, and external OSAT partners. You will be responsible for implementing package technologies that meet aggressive electrical, thermal, mechanical, and cost targets, enabling our company products to operate reliably in the worlds most demanding AI and cloud environments.
Key Responsibilities
Execute end-to-end IC package design, from early feasibility and detailed design through to qualification and high-volume manufacturing
Implement package architecture and utilize advanced technologies (organic substrates, advanced laminate, interposers, multi-die/chiplet packaging, CoWoS - 2.5D/3D integration)
Drive signal integrity (SI), power integrity (PI), and thermal considerations at the package level for high-speed, high-power devices
Perform package layout, substrate routing, bump/ball maps, stack-ups, materials selection, and apply mechanical constraints
Collaborate closely with silicon design, SerDes, system, SI/PI, and reliability teams to optimize overall product performance
Interface directly with OSATs, substrate vendors, and manufacturing partners to ensure design-for-manufacturability (DFM), yield, and cost targets are met
Conduct package-related risk assessments, failure analysis, and corrective actions during bring-up and production ramp
Support NPI, qualification, and product sustainment activities, including vendor technical reviews.
Requirements: 5+ years of hands-on IC package design experience for high-performance semiconductor products, with full technical ownership from concept through tape-out
Expert proficiency in IC package design tools (Cadence APD / SiP or equivalent) and hands-on experience designing complex packages (BGA, FCBGA, FCCSP)
Strong package integration expertise, including stack-ups, ball/bump maps, constraints, SMT integration, and package BOM ownership
Deep understanding of signal, power, and thermal integrity at the package level, with the ability to execute design tradeoffs based on analysis
Proven manufacturing and release experience, including running DRC/LVS/DFM, OSAT engagement, and delivering production-ready package designs
Preferred Qualifications
Experience with AI, networking, PCIe, CXL, or other high-speed data center interfaces
Familiarity with package reliability standards and qualification (JEDEC, IPC, thermal cycling, HTOL, etc.)
Experience supporting chiplet-based architectures and heterogeneous integration
Demonstrated track record of complete technical package ownership on high-volume products.
This position is open to all candidates.